公开(公告)号：US20220365187A1

公开(公告)日：2022-11-17

申请号：US17661302

申请日：2022-04-29

Applicant: Tokyo Electron Limited

Inventor： Toshiaki KODAMA ,  Shinji WAKABAYASHI ,  Takehiro SHINDO ,  Tatsuru OKAMURA

IPC: G01S7/497 ,  G01S17/08 ,  H01J37/32 ,  G01S17/88

Abstract: A substrate processing system includes: a substrate processing apparatus including a stage on which a substrate and an annular member are placed; a substrate transport mechanism including a substrate holder; a distance sensor provided in the substrate holder; and a control device, wherein the substrate transport mechanism is configured to place a jig substrate having a reference surface as a reference for a height of the annular member on the stage, wherein the distance sensor is configured to measure a distance from the substrate holder positioned above the stage to the reference surface of the jig substrate and a distance from the substrate holder to the annular member, and wherein the control device is configured to estimate the height of the annular member based on a measurement result of the distance to the reference surface and a measurement result of the distance to the annular member.

公开(公告)号：US20250006533A1

公开(公告)日：2025-01-02

申请号：US18697729

申请日：2021-10-13

Applicant: TOKYO ELECTRON LIMITED

Inventor： Wataru MATSUMOTO ,  Takehiro SHINDO ,  Tatsuru OKAMURA ,  Nanako SHINODA ,  Junpei SASAKI

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/68

Abstract: This substrate conveyance method is disclosed for a conveyance device. A conveyance chamber includes a conveyance mechanism having forks, on upper and lower sides, and support a substrate. A buffer chamber is connected to the conveyance chamber, and includes: a mounting unit that mounts a substrate; and, pins that support the substrate. In the method, the conveyance mechanism, with a second substrate supported by the lower fork, is inserted into the buffer chamber in which a first substrate is mounted on the mounting unit, and the first substrate is lifted by the upper fork. In the method, the pins are raised while the first substrate is lifted by the upper fork, and the second substrate supported by the lower fork is lifted by the pins. In the method, the conveyance mechanism is removed from the buffer chamber while the second substrate is lifted by the pins.

公开(公告)号：US20250046583A1

公开(公告)日：2025-02-06

申请号：US18926627

申请日：2024-10-25

Applicant: Tokyo Electron Limited

Inventor： Tatsuru OKAMURA ,  Masatomo KITA ,  Young tae SONG

IPC: H01J37/32

Abstract: A substrate processing system disclosed here includes a vacuum transfer chamber, a plurality of substrate processing modules, a ring stocker, a transfer robot, and control circuitry. The plurality of substrate processing modules and the ring stocker are connected to the vacuum transfer chamber. When the transfer robot is transferring only a new edge ring using one of at least two end effectors, the controller controls the transfer robot to transfer a substrate via the vacuum transfer chamber using an unused end effector of the at least two end effectors in response to a substrate transfer request.

公开(公告)号：US20250046585A1

公开(公告)日：2025-02-06

申请号：US18926710

申请日：2024-10-25

Applicant: Tokyo Electron Limited

Inventor： Tatsuru OKAMURA ,  Masatomo KITA ,  Young tae SONG

IPC: H01J37/32

Abstract: A substrate processing system according to an aspect of the present disclosure includes: a plurality of processors each including a substrate support supporting a substrate and a ring disposed around the substrate, a vacuum transferer connected to the processors, the vacuum transferer including a transfer robot for transferring the substrate or the ring, an accommodation for accommodating the ring, and a controller for executing control to remove all the substrates from the processors and the vacuum transferer, and after the removing, for executing control to transfer the ring between at least one of the processors and the accommodation.

公开(公告)号：US20240222185A1

公开(公告)日：2024-07-04

申请号：US18605892

申请日：2024-03-15

Applicant: Tokyo Electron Limited

Inventor： Tatsuru OKAMURA ,  Norihiko AMIKURA ,  Masatomo KITA ,  Takehiro SHINDO

IPC: H01L21/687 ,  B25J11/00 ,  B25J19/00 ,  H01L21/67

CPC classification number: H01L21/68707 ,  B25J11/0095 ,  B25J19/0054 ,  H01L21/67248 ,  H01L21/67253

Abstract: A substrate transfer system includes a substrate processing assembly, a substrate transfer assembly, and a controller. The substrate processing assembly includes a substrate processing chamber, a substrate support, and a first temperature sensor that measures a temperature of the substrate support. The substrate transfer assembly includes a substrate transfer chamber, a robotic substrate transferrer, and a temperature control system. The robotic substrate transferrer includes a first end-effector that holds a high-temperature substrate, a second end-effector that holds a low-temperature substrate, and a deposit detector located adjacent to at least one of the end-effectors. The temperature control system includes a cooling gas supply that supplies a cooling gas into the robotic substrate transferrer, a second temperature sensor that measures a temperature of an internal space of the robotic substrate transferrer, and a temperature adjuster that adjusts a temperature of the cooling gas based on an output from the second temperature sensor.