LIQUID CRYSTAL DISPLAY AND MANUFACTURING METHOD THEREOF
    1.
    发明申请
    LIQUID CRYSTAL DISPLAY AND MANUFACTURING METHOD THEREOF 审中-公开
    液晶显示及其制造方法

    公开(公告)号:US20060197904A1

    公开(公告)日:2006-09-07

    申请号:US11275954

    申请日:2006-02-07

    IPC分类号: G02F1/13

    CPC分类号: G02F1/1341 G02F1/133305

    摘要: A liquid crystal display includes a first substrate made up of a plastic substrate on which a first electrode for driving liquid crystal is formed, a second substrate made up of a plastic substrate on which a second electrode for driving liquid crystal is formed, and a liquid crystal layer held between the first and second substrates. At least one of the first and second substrates is a plastic substrate. The first and second substrate are glued together, and then the glued substrates are cut out into panels employing laser cutting. An opening for passing through either the first or second substrate is formed on a portion serving as a liquid crystal inlet prior to gluing the first and second substrates, and a notched portion in which at least a part of the opening is employed, is formed on a portion serving as the liquid crystal inlet of the panel.

    摘要翻译: 液晶显示器包括由塑料基板构成的第一基板,其上形成用于驱动液晶的第一电极,第二基板,由形成有用于驱动液晶的第二电极的塑料基板和液体 晶体层保持在第一和第二基板之间。 第一和第二基板中的至少一个是塑料基板。 将第一和第二基板胶合在一起,然后将胶合的基板切割成采用激光切割的面板。 在粘合第一和第二基板之前,在用作液晶入口的部分上形成用于通过第一或第二基板的开口,以及在其中使用开口的至少一部分的切口部分形成在 作为面板的液晶入口的部分。

    Method for manufacturing thin film device that includes a chemical etchant process
    2.
    发明授权
    Method for manufacturing thin film device that includes a chemical etchant process 有权
    包括化学蚀刻工艺的薄膜器件的制造方法

    公开(公告)号:US07179693B2

    公开(公告)日:2007-02-20

    申请号:US11079049

    申请日:2005-03-14

    IPC分类号: H01L21/00

    摘要: The present invention relates to a method for manufacturing a thin film device. The thin film device is manufactured by bonding a second substrate (106) to a thin film device layer (103) provided on a protective layer (102) formed on a first substrate (101) through a first adhesive layer (105), then, completely or partly removing the first substrate (101) in accordance with a process including at least one process of a chemical process and a mechanical polishing process, bonding a third substrate (109) to the exposed protective layer (102) or the protective layer (102) covered with the partly removed first substrate (101) through a second adhesive layer (108) and separating or removing the second substrate (106). Thus, the thin film device suitable for a light and thin display panel is manufactured without deteriorating a ruggedness.

    摘要翻译: 薄膜器件的制造方法技术领域本发明涉及薄膜器件的制造方法。 薄膜器件通过将第二衬底(106)通过第一粘合剂层(105)粘合到形成在第一衬底(101)上的保护层(102)上的薄膜器件层(103)而制造, 根据包括化学过程和机械抛光工艺的至少一个工艺的工艺完全或部分地去除第一衬底(101),将第三衬底(109)接合到暴露的保护层(102)或保护层( 102)通过第二粘合剂层(108)被部分去除的第一基板(101)覆盖并分离或移除第二基板(106)。 因此,制造适合于轻薄型显示面板的薄膜器件,而不会劣化粗糙度。

    Liquid Crystal Display Apparatus and Fabrication Method for Liquid Crystal Display Apparatus
    3.
    发明申请
    Liquid Crystal Display Apparatus and Fabrication Method for Liquid Crystal Display Apparatus 审中-公开
    液晶显示装置及液晶显示装置的制造方法

    公开(公告)号:US20080225214A1

    公开(公告)日:2008-09-18

    申请号:US10597257

    申请日:2005-01-21

    IPC分类号: G02F1/1333

    摘要: A difference in brightness between a portion, at which fiber overlaps, and any other portion of a plastic substrate in which a fiber cloth is contained is eliminated by setting the axis of the fiber and the optical axis of a polarizing plate so as to be coaxial with each other. Thereby, a normal displaying can be effected. In a liquid crystal display apparatus wherein a liquid crystal driving electrode (not shown) is formed on at least one of an active substrate 11 and an opposing substrate 12 in pair opposing to each other and liquid crystal (liquid crystal layer 13) is encapsulated in a space formed between the substrates, at least one of the pair of substrates, for example, the active substrate 11, is a resin substrate which contains a fiber cloth 16, and, first, second polarizing plates 14, 15 are provided on the outer side of at least one of the pair of substrates, for example, on the opposite sides, and besides an axis of the fiber cloth 16 and an optical axis of the first polarizing plate 14 are coaxial with each other.

    摘要翻译: 纤维重叠部分与其中包含纤维布的塑料基材的任何其它部分之间的亮度差异通过将光纤的轴线和偏振片的光轴设置为同轴而消除 与彼此。 由此,可以进行正常显示。 在液晶显示装置中,液晶驱动电极(未示出)形成在彼此相对的一对有源基板11和相对基板12中,液晶(液晶层13)被封装在 在基板之间形成的空间中,一对基板中的至少一个,例如有源基板11,是包含纤维布16的树脂基板,第一偏振板14,15设置在外侧 一对基板中的至少一个的侧面,例如在相对的两侧,除了纤维布16的轴线和第一偏振片14的光轴之外,彼此同轴。

    Method for manufacturing thin film device and semiconductor device
    4.
    发明申请
    Method for manufacturing thin film device and semiconductor device 有权
    制造薄膜器件和半导体器件的方法

    公开(公告)号:US20050181547A1

    公开(公告)日:2005-08-18

    申请号:US11079049

    申请日:2005-03-14

    摘要: The present invention relates to a method for manufacturing a thin film device. The thin film device is manufactured by bonding a second substrate (106) to a thin film device layer (103) provided on a protective layer (102) formed on a first substrate (101) through a first adhesive layer (105), then, completely or partly removing the first substrate (101) in accordance with a process including at least one process of a chemical process and a mechanical polishing process, bonding a third substrate (109) to the exposed protective layer (102) or the protective layer (102) covered with the partly removed first substrate (101) through a second adhesive layer (108) and separating or removing the second substrate (106). Thus, the thin film device suitable for a light and thin display panel is manufactured without deteriorating a ruggedness.

    摘要翻译: 薄膜器件的制造方法技术领域本发明涉及薄膜器件的制造方法。 薄膜器件通过将第二衬底(106)通过第一粘合剂层(105)粘合到形成在第一衬底(101)上的保护层(102)上的薄膜器件层(103)而制造, 根据包括化学过程和机械抛光工艺的至少一个工艺的工艺完全或部分地去除第一衬底(101),将第三衬底(109)接合到暴露的保护层(102)或保护层( 102)通过第二粘合剂层(108)被部分去除的第一基板(101)覆盖并分离或移除第二基板(106)。 因此,制造适合于轻薄型显示面板的薄膜器件,而不会劣化粗糙度。

    Method for manufacturing thin film device and semiconductor device
    5.
    发明授权
    Method for manufacturing thin film device and semiconductor device 有权
    制造薄膜器件和半导体器件的方法

    公开(公告)号:US07550326B2

    公开(公告)日:2009-06-23

    申请号:US11536482

    申请日:2006-09-28

    IPC分类号: H01L21/00

    摘要: The present invention relates to a method for manufacturing a thin film device. The thin film device is manufactured by bonding a second substrate (106) to a thin film device layer (103) provided on a protective layer (102) formed on a first substrate (101) through a first adhesive layer (105), then, completely or partly removing the first substrate (101) in accordance with a process including at least one process of a chemical process and a mechanical polishing process, bonding a third substrate (109) to the exposed protective layer (102) or the protective layer (102) covered with the partly removed first substrate (101) through a second adhesive layer (108) and separating or removing the second substrate (106). Thus, the thin film device suitable for a light and thin display panel is manufactured without deteriorating a ruggedness.

    摘要翻译: 薄膜器件的制造方法技术领域本发明涉及薄膜器件的制造方法。 薄膜器件通过将第二衬底(106)通过第一粘合剂层(105)粘合到形成在第一衬底(101)上的保护层(102)上的薄膜器件层(103)而制造, 根据包括化学过程和机械抛光工艺的至少一个工艺的工艺完全或部分地去除第一衬底(101),将第三衬底(109)接合到暴露的保护层(102)或保护层( 102)通过第二粘合剂层(108)被部分去除的第一基板(101)覆盖并分离或移除第二基板(106)。 因此,制造适合于轻薄型显示面板的薄膜器件,而不会劣化粗糙度。

    PROCESS FOR THE FABRICATION OF THIN-FILM DEVICE AND THIN-FILM DEVICE
    6.
    发明申请
    PROCESS FOR THE FABRICATION OF THIN-FILM DEVICE AND THIN-FILM DEVICE 审中-公开
    制造薄膜器件和薄膜器件的方法

    公开(公告)号:US20070090404A1

    公开(公告)日:2007-04-26

    申请号:US11567812

    申请日:2006-12-07

    IPC分类号: H01L27/10

    摘要: A thin-film device is fabricated by forming a protective layer and a thin-film device layer one by one on a first substrate and bonding a second substrate on the thin-film device layer via a first adhesive layer or a coating layer and first adhesive layer, removing the first substrate at least in a part thereof by etching with a chemical solution, bonding the protective layer, which covers the thin-film device layer on a side of the first substrate, to a third substrate via a second adhesive layer, and removing the second substrate. The protective layer is formed of at least two layers having resistance to the chemical solution used upon removal of the first substrate.

    摘要翻译: 通过在第一基板上逐个形成保护层和薄膜器件层并经由第一粘合剂层或涂层和第一粘合剂将薄膜器件层上的第二衬底接合来制造薄膜器件 至少通过用化学溶液进行蚀刻来去除第一衬底,通过第二粘合剂层将覆盖薄膜器件层的第一衬底侧的保护层与第三衬底接合, 并移除第二基板。 保护层由至少两层具有抵抗在去除第一基底时使用的化学溶液的层形成。

    Process for the fabrication of thin-film device and thin-film device
    7.
    发明授权
    Process for the fabrication of thin-film device and thin-film device 失效
    制造薄膜器件和薄膜器件的工艺

    公开(公告)号:US07172708B2

    公开(公告)日:2007-02-06

    申请号:US10782658

    申请日:2004-02-19

    IPC分类号: B44C1/22

    摘要: A thin-film device is fabricated by forming a protective layer and a thin-film device layer one by one on a first substrate and bonding a second substrate on the thin-film device layer via a first adhesive layer or a coating layer and first adhesive layer, removing the first substrate at least in a part thereof by etching with a chemical solution, bonding the protective layer, which covers the thin-film device layer on a side of the first substrate, to a third substrate via a second adhesive layer, and removing the second substrate. The protective layer is formed of at least two layers having resistance to the chemical solution used upon removal of the first substrate.

    摘要翻译: 通过在第一基板上逐个形成保护层和薄膜器件层并经由第一粘合剂层或涂层和第一粘合剂将第二基板粘合在薄膜器件层上来制造薄膜器件 至少在其一部分中通过用化学溶液进行蚀刻去除第一衬底,通过第二粘合剂层将覆盖薄膜器件层的第一衬底侧的保护层与第三衬底接合, 并移除第二基板。 保护层由至少两层具有抵抗在去除第一基底时使用的化学溶液的层形成。

    Method for Manufacturing Thin Film Device and Semiconductor Device
    8.
    发明申请
    Method for Manufacturing Thin Film Device and Semiconductor Device 有权
    制造薄膜器件和半导体器件的方法

    公开(公告)号:US20070020823A1

    公开(公告)日:2007-01-25

    申请号:US11536482

    申请日:2006-09-28

    IPC分类号: H01L21/84

    摘要: The present invention relates to a method for manufacturing a thin film device. The thin film device is manufactured by bonding a second substrate (106) to a thin film device layer (103) provided on a protective layer (102) formed on a first substrate (101) through a first adhesive layer (105), then, completely or partly removing the first substrate (101) in accordance with a process including at least one process of a chemical process and a mechanical polishing process, bonding a third substrate (109) to the exposed protective layer (102) or the protective layer (102) covered with the partly removed first substrate (101) through a second adhesive layer (108) and separating or removing the second substrate (106). Thus, the thin film device suitable for a light and thin display panel is manufactured without deteriorating a ruggedness.

    摘要翻译: 薄膜器件的制造方法技术领域本发明涉及薄膜器件的制造方法。 薄膜器件通过将第二衬底(106)通过第一粘合剂层(105)粘合到形成在第一衬底(101)上的保护层(102)上的薄膜器件层(103)而制造, 根据包括化学过程和机械抛光工艺的至少一个工艺的工艺完全或部分地去除第一衬底(101),将第三衬底(109)接合到暴露的保护层(102)或保护层( 102)通过第二粘合剂层(108)被部分去除的第一基板(101)覆盖并分离或移除第二基板(106)。 因此,制造适合于轻薄型显示面板的薄膜器件,而不会劣化粗糙度。

    Method for manufacturing thin film device and semiconductor device using a third substrate
    9.
    发明授权
    Method for manufacturing thin film device and semiconductor device using a third substrate 有权
    使用第三基板制造薄膜器件和半导体器件的方法

    公开(公告)号:US06916681B2

    公开(公告)日:2005-07-12

    申请号:US10311192

    申请日:2002-04-12

    摘要: The present invention relates to a method for manufacturing a thin film device. The thin film device is manufactured by bonding a second substrate (106) to a thin film device layer (103) provided on a protective layer (102) formed on a first substrate (101) through a first adhesive layer (105), then, completely or partly removing the first substrate (101) in accordance with a process including at least one process of a chemical process and a mechanical polishing process, bonding a third substrate (109) to the exposed protective layer (102) or the protective layer (102) covered with the partly removed first substrate (101) through a second adhesive layer (108) and separating or removing the second substrate (106). Thus, the thin film device suitable for a light and thin display panel is manufactured without deteriorating a ruggedness.

    摘要翻译: 薄膜器件的制造方法技术领域本发明涉及薄膜器件的制造方法。 薄膜器件通过将第二衬底(106)通过第一粘合剂层(105)粘合到形成在第一衬底(101)上的保护层(102)上的薄膜器件层(103)而制造, 根据包括化学过程和机械抛光工艺的至少一个过程的工艺完全或部分地去除第一衬底(101),将第三衬底(109)接合到暴露的保护层(102)或保护层 102)通过第二粘合剂层(108)被部分去除的第一基板(101)覆盖并分离或移除第二基板(106)。 因此,制造适合于轻薄型显示面板的薄膜器件,而不会劣化粗糙度。