Disc inspecting method and disc inspecting device
    5.
    发明授权
    Disc inspecting method and disc inspecting device 失效
    光盘检查方法和光盘检测装置

    公开(公告)号:US08446804B2

    公开(公告)日:2013-05-21

    申请号:US13235836

    申请日:2011-09-19

    IPC分类号: G11B15/52

    CPC分类号: G11B7/00458

    摘要: A disc inspecting method includes: forming recording marks on a disc; scanning the recording marks from inside to outside or from outside to inside of the disc by a pickup unit to read a reproduction signal while rotating a spindle to move a slider by each predetermined width; acquiring reproduction data from the reproduction signal in a signal acquiring unit; and determining whether or not the reproduction data is proper in a calculation unit, and optimizing a formation condition of the recording marks when it is determined that the reproduction data is not proper.

    摘要翻译: 盘检查方法包括:在盘上形成记录标记; 通过拾取单元从盘内的内部或外部到外部扫描记录标记,以在旋转主轴的同时读取再现信号,以使滑块以预定的宽度移动; 在信号获取单元中从再现信号获取再现数据; 以及在计算单元中确定再现数据是否合适,以及当确定再现数据不正确时优化记录标记的形成条件。

    Method of bonding terminal
    6.
    发明授权
    Method of bonding terminal 失效
    端子接合方法

    公开(公告)号:US07877870B2

    公开(公告)日:2011-02-01

    申请号:US11521811

    申请日:2006-09-15

    IPC分类号: H01R9/00 H05K3/00

    摘要: The tip end of the bonding tip is defined between first and second edges. A first inclined surface gets remoter from a first terminal at a position remoter from the first edge. The second inclined surface likewise gets remoter from the first terminal at a position remoter from the second edge. The solder is contoured by first and second contours on the first terminal. The second terminal is located on the solder between the first and second contours. The tip end of the bonding tip is urged against the second terminal. Heat is transferred from the bonding tip to the solder. The melted solder spreads into gaps between the second terminal and the first and second inclined surfaces. The solder is thus prevented from spreading outside the contour of the first terminal. This results in a reliable avoidance of a short circuit between the adjacent first terminals.

    摘要翻译: 接合末端的末端被限定在第一和第二边缘之间。 第一倾斜表面从远离第一边缘的位置处的第一端子远离。 第二倾斜表面同样在距离第二边缘更远的位置处从第一端子偏离。 焊料通过第一端子上的第一和第二轮廓形成轮廓。 第二端子位于第一和第二轮廓之间的焊料上。 接合末端的尖端被推靠在第二端子上。 热量从接合端传递到焊料。 熔融的焊料扩散到第二端子和第一和第二倾斜表面之间的间隙中。 因此防止了焊料扩散到第一端子的轮廓之外。 这导致可靠地避免相邻的第一端子之间的短路。

    X-ray detection device for foreign matter

    公开(公告)号:US20090154643A1

    公开(公告)日:2009-06-18

    申请号:US10582665

    申请日:2005-06-22

    IPC分类号: G01N23/06 A61B6/04

    摘要: An X-ray detection device for detecting whether or not foreign matter is mixed in on the basis of the transmission amount of X-rays that have penetrated an examination subject article by applying X-rays, at a predetermined detection position to an examination subject article being conveyed in a pipe (7), wherein a test-piece table (17) capable of passing by the detection position at substantially the same speed as that of the examination subject article is installed in the vicinity of the pipe (7), with a test-piece (21) placed thereon. X-ray detection sensitivity can be detected without mixing the test-piece in the actual examination subject article.

    Pb-Free Copper-Alloy Sliding Material
    10.
    发明申请
    Pb-Free Copper-Alloy Sliding Material 有权
    无铅铜合金滑动材料

    公开(公告)号:US20080095658A1

    公开(公告)日:2008-04-24

    申请号:US10585993

    申请日:2005-01-13

    IPC分类号: C22C9/00

    摘要: [PROBLEMS] To provide a Cu—Bi—hard substance base sintered alloy in which the respective properties of Bi and hard substance can be satisfactorily exerted. [MEANS FOR SOLVING PROBLEMS] There is provided a Ph free copper base sintered alloy, comprising 1 to 30% of Bi and 0.1 to 10% of hard substance particles of 10 to 50 μm average diameter, (1) wherein a Bi phase having an average particle diameter smaller than that of the hard substance particles is dispersed in a matrix of Cu, or wherein with respect to a Bi phase in contact with the hard substance particles, the ratio of presence of hard substance particles exhibiting a ratio of hard substance particle contact length to entire circumference of Bi phase of 50% or less is 70% or greater based on the total number of hard substance particles.

    摘要翻译: [问题]提供可以令人满意地施加Bi和硬质物质的各种性质的Cu-Bi硬质物质基烧结合金。 [解决问题的手段]提供了一种无Ph的铜基烧结合金,其包含1至30%的Bi和0.1至10%的平均直径为10至50μm的硬物质颗粒,(1)其中Bi相具有 平均粒径小于硬物质粒子的粒径分散在Cu基体中,或者相对于与硬质粒子接触的Bi相,存在硬物质粒子的比例为硬质粒子的比率 50%以下的Bi相的整周的接触长度相对于硬质粒子的总数为70%以上。