公开(公告)号：US08088438B2

公开(公告)日：2012-01-03

申请号：US11597438

申请日：2005-06-01

申请人： Tomokazu Ito ,  Hisashi Nishigaki ,  Tsukasa Kawakami ,  Haruka Narita ,  Yoji Takizawa ,  Takumi Hanada ,  Munenori Iwami

发明人： Tomokazu Ito ,  Hisashi Nishigaki ,  Tsukasa Kawakami ,  Haruka Narita ,  Yoji Takizawa ,  Takumi Hanada ,  Munenori Iwami

IPC分类号： B05D3/12 ,  B05D3/06

CPC分类号： B05C11/08 ,  B05D1/005 ,  B05D7/56 ,  G11B7/266 ,  Y10T156/10 ,  Y10T428/31504

摘要： A resin layer formation method, resin layer formation device, disk and disk manufacturing method for making a resin layer uniform on a substrate before lamination or on a substrate to be coated by a simple procedure are provided. Adhesive A is coated at the inner circumference side while rotating a substrate P at low speed, a first adhesive layer AL1 is formed on the surface of the substrate P by rotating the substrate P at high speed, a step difference section H is formed around a rotation center of the substrate P by irradiating ultraviolet on an area in the inner circumference side of the first adhesive layer AL1 and hardening the area, the adhesive A is coated at the rotation center side from the step difference section H on the substrate P, and a second adhesive layer AL2 is formed on the first adhesive layer AL1 by rotating the substrate P at high speed. The first adhesive layer AL1 and the second adhesive layer AL2 are integrated to form a uniform adhesive layer B as a whole.

摘要翻译： 提供树脂层形成方法，树脂层形成装置，用于在层压之前在基板上或通过简单的方法在待涂覆的基板上使树脂层均匀的盘和盘制造方法。 在低速旋转基板P的同时，在内周侧涂布粘合剂A，通过高速旋转基板P，在基板P的表面上形成第一粘接层AL1，在其周围形成台阶差H 通过在第一粘合层AL1的内周侧的区域上照射紫外线并使该区域硬化来将基板P的旋转中心从基板P上的台阶差异部H的旋转中心侧涂布， 通过高速旋转基板P，在第一粘合层AL1上形成第二粘接层AL2。 第一粘合剂层AL1和第二粘合层AL2整体上形成均匀的粘合剂层B。

公开(公告)号：US20120076947A1

公开(公告)日：2012-03-29

申请号：US13310469

申请日：2011-12-02

申请人： Tomokazu Ito ,  Hisashi Nishigaki ,  Tsukasa Kawakami ,  Haruka Narita ,  Yoji Takizawa ,  Takumi Hanada ,  Munenori Iwami

发明人： Tomokazu Ito ,  Hisashi Nishigaki ,  Tsukasa Kawakami ,  Haruka Narita ,  Yoji Takizawa ,  Takumi Hanada ,  Munenori Iwami

IPC分类号： B05D1/36 ,  B05D3/06

CPC分类号： B05C11/08 ,  B05D1/005 ,  B05D7/56 ,  G11B7/266 ,  Y10T156/10 ,  Y10T428/31504

摘要： A resin layer formation method and device for making a resin layer uniform on a substrate before lamination or on a substrate is provided. Adhesive is coated at an inner circumference side while rotating a substrate at low speed. A first adhesive layer is formed on the surface of the substrate by rotating at high speed. A step difference section is formed around a rotation center of the substrate by irradiating ultraviolet on an area in the inner circumference side of the first adhesive layer to hardening the area. Adhesive is coated at the rotation center side from the step difference section on the substrate, and a second adhesive layer is formed on the first adhesive layer by rotating the substrate at high speed. The first adhesive layer and the second adhesive layer are integrated to form a uniform adhesive layer.

摘要翻译： 提供了一种树脂层形成方法和用于在层压之前或基板上在基板上使树脂层均匀的树脂层形成方法和装置。 在低速旋转基板的同时，在内周侧涂布粘合剂。 通过高速旋转在基板的表面上形成第一粘合剂层。 通过在第一粘合剂层的内周侧的区域上照射紫外线来硬化该区域，在基板的旋转中心周围形成台阶差分部。 在基板上的台阶差部分的旋转中心侧涂覆粘合剂，并且通过高速旋转基板，在第一粘合剂层上形成第二粘合剂层。 第一粘合剂层和第二粘合剂层被一体化以形成均匀的粘合剂层。

公开(公告)号：US08475870B2

公开(公告)日：2013-07-02

申请号：US13310469

申请日：2011-12-02

申请人： Tomokazu Ito ,  Hisashi Nishigaki ,  Tsukasa Kawakami ,  Haruka Narita ,  Yoji Takizawa ,  Takumi Hanada ,  Munenori Iwami

发明人： Tomokazu Ito ,  Hisashi Nishigaki ,  Tsukasa Kawakami ,  Haruka Narita ,  Yoji Takizawa ,  Takumi Hanada ,  Munenori Iwami

IPC分类号： B05D3/06 ,  B05D3/12

CPC分类号： B05C11/08 ,  B05D1/005 ,  B05D7/56 ,  G11B7/266 ,  Y10T156/10 ,  Y10T428/31504

摘要： A resin layer formation method and device for making a resin layer uniform on a substrate before lamination or on a substrate is provided. Adhesive is coated at an inner circumference side while rotating a substrate at low speed. A first adhesive layer is formed on the surface of the substrate by rotating at high speed. A step difference section is formed around a rotation center of the substrate by irradiating ultraviolet on an area in the inner circumference side of the first adhesive layer to hardening the area. Adhesive is coated at the rotation center side from the step difference section on the substrate, and a second adhesive layer is formed on the first adhesive layer by rotating the substrate at high speed. The first adhesive layer and the second adhesive layer are integrated to form a uniform adhesive layer.

摘要翻译： 提供了一种树脂层形成方法和用于在层压之前或基板上在基板上使树脂层均匀的树脂层形成方法和装置。 在低速旋转基板的同时，在内周侧涂布粘合剂。 通过高速旋转在基板的表面上形成第一粘合剂层。 通过在第一粘合剂层的内周侧的区域上照射紫外线来硬化该区域，在基板的旋转中心周围形成台阶差分部。 在基板上的台阶差部分的旋转中心侧涂覆粘合剂，并且通过高速旋转基板，在第一粘合剂层上形成第二粘合剂层。 第一粘合剂层和第二粘合剂层被一体化以形成均匀的粘合剂层。

公开(公告)号：US20080206570A1

公开(公告)日：2008-08-28

申请号：US11597438

申请日：2005-06-01

申请人： Tomokazu Ito ,  Hisashi Nishigaki ,  Tsukasa Kawakami ,  Haruka Narita ,  Yoji Takizawa ,  Takumi Hanada ,  Munenori Iwami

发明人： Tomokazu Ito ,  Hisashi Nishigaki ,  Tsukasa Kawakami ,  Haruka Narita ,  Yoji Takizawa ,  Takumi Hanada ,  Munenori Iwami

IPC分类号： C08J7/04 ,  B32B9/04 ,  B05B5/00

CPC分类号： B05C11/08 ,  B05D1/005 ,  B05D7/56 ,  G11B7/266 ,  Y10T156/10 ,  Y10T428/31504

摘要： A resin layer formation method, resin layer formation device, disk and disk manufacturing method for making a resin layer uniform on a substrate before lamination or on a substrate to be coated by a simple procedure are provided. Adhesive A is coated at the inner circumference side while rotating a substrate P at low speed, a first adhesive layer AL1 is formed on the surface of the substrate P by rotating the substrate P at high speed, a step difference section H is formed around a rotation center of the substrate P by irradiating ultraviolet on an area in the inner circumference side of the first adhesive layer AL1 and hardening the area, the adhesive A is coated at the rotation center side from the step difference section H on the substrate P, and a second adhesive layer AL2 is formed on the first adhesive layer AL1 by rotating the substrate P at high speed. The first adhesive layer AL1 and the second adhesive layer AL2 are integrated to form a uniform adhesive layer B as a whole.

摘要翻译： 提供树脂层形成方法，树脂层形成装置，用于在层压之前在基板上或通过简单的方法在待涂覆的基板上使树脂层均匀的盘和盘制造方法。 在低速旋转基板P的同时，在内周侧涂布粘合剂A，通过高速旋转基板P，在基板P的表面上形成第一粘合层AL1，在其周围形成台阶差H 通过在第一粘合层AL1的内周侧的区域上照射紫外线并使该区域硬化来使基板P的旋转中心从基板P上的台阶差H向旋转中心侧涂布 并且通过高速旋转基板P，在第一粘合层AL 1上形成第二粘合层AL 2。 第一粘合层AL 1和第二粘合层AL 2整体上形成均匀的粘合剂层B。

公开(公告)号：US08220410B2

公开(公告)日：2012-07-17

申请号：US12835627

申请日：2010-07-13

申请人： Tomokazu Ito ,  Hisashi Nishigaki ,  Tsukasa Kawakami ,  Haruka Narita ,  Yoji Takizawa ,  Takumi Hanada ,  Munenori Iwami

发明人： Tomokazu Ito ,  Hisashi Nishigaki ,  Tsukasa Kawakami ,  Haruka Narita ,  Yoji Takizawa ,  Takumi Hanada ,  Munenori Iwami

IPC分类号： B05C11/00 ,  B05C11/02

CPC分类号： B05C11/08 ,  B05D1/005 ,  B05D7/56 ,  G11B7/266 ,  Y10T156/10 ,  Y10T428/31504

摘要： A resin layer formation method, resin layer formation device, disk and disk manufacturing method for making a resin layer uniform on a substrate before lamination or on a substrate to be coated by a simple procedure are provided. Adhesive A is coated at the inner circumference side while rotating a substrate P at low speed, a first adhesive layer AL1 is formed on the surface of the substrate P by rotating the substrate P at high speed, a step difference section H is formed around a rotation center of the substrate P by irradiating ultraviolet on an area in the inner circumference side of the first adhesive layer AL1 and hardening the area, the adhesive A is coated at the rotation center side from the step difference section H on the substrate P, and a second adhesive layer AL2 is formed on the first adhesive layer AL1 by rotating the substrate P at high speed. The first adhesive layer AL1 and the second adhesive layer AL2 are integrated to form a uniform adhesive layer B as a whole.

摘要翻译： 提供树脂层形成方法，树脂层形成装置，用于在层压之前在基板上或通过简单的方法在待涂覆的基板上使树脂层均匀的盘和盘制造方法。 在低速旋转基板P的同时，在内周侧涂布粘合剂A，通过高速旋转基板P，在基板P的表面上形成第一粘接层AL1，在其周围形成台阶差H 通过在第一粘合层AL1的内周侧的区域上照射紫外线并使该区域硬化来将基板P的旋转中心从基板P上的台阶差异部H的旋转中心侧涂布， 通过高速旋转基板P，在第一粘合层AL1上形成第二粘接层AL2。 第一粘合剂层AL1和第二粘合层AL2整体上形成均匀的粘合剂层B。

公开(公告)号：US20100275840A1

公开(公告)日：2010-11-04

申请号：US12835627

申请日：2010-07-13

申请人： Tomokazu Ito ,  Hisashi Nishigaki ,  Tsukasa Kawakami ,  Haruka Narita ,  Yoji Takizawa ,  Takumi Hanada ,  Munenori Iwami

发明人： Tomokazu Ito ,  Hisashi Nishigaki ,  Tsukasa Kawakami ,  Haruka Narita ,  Yoji Takizawa ,  Takumi Hanada ,  Munenori Iwami

IPC分类号： B05B3/02 ,  B05B15/00

CPC分类号： B05C11/08 ,  B05D1/005 ,  B05D7/56 ,  G11B7/266 ,  Y10T156/10 ,  Y10T428/31504

摘要： A resin layer formation method, resin layer formation device, disk and disk manufacturing method for making a resin layer uniform on a substrate before lamination or on a substrate to be coated by a simple procedure are provided. Adhesive A is coated at the inner circumference side while rotating a substrate P at low speed, a first adhesive layer AL1 is formed on the surface of the substrate P by rotating the substrate P at high speed, a step difference section H is formed around a rotation center of the substrate P by irradiating ultraviolet on an area in the inner circumference side of the first adhesive layer AL1 and hardening the area, the adhesive A is coated at the rotation center side from the step difference section H on the substrate P, and a second adhesive layer AL2 is formed on the first adhesive layer AL1 by rotating the substrate P at high speed. The first adhesive layer AL1 and the second adhesive layer AL2 are integrated to form a uniform adhesive layer B as a whole.

摘要翻译： 提供树脂层形成方法，树脂层形成装置，用于在层压之前在基板上或通过简单的方法在待涂覆的基板上使树脂层均匀的盘和盘制造方法。 在低速旋转基板P的同时，在内周侧涂布粘合剂A，通过高速旋转基板P，在基板P的表面上形成第一粘接层AL1，在其周围形成台阶差H 通过在第一粘合层AL1的内周侧的区域上照射紫外线并使该区域硬化来将基板P的旋转中心从基板P上的台阶差异部H的旋转中心侧涂布， 通过高速旋转基板P，在第一粘合层AL1上形成第二粘接层AL2。 第一粘合剂层AL1和第二粘合层AL2整体上形成均匀的粘合剂层B。

公开(公告)号：US09330948B2

公开(公告)日：2016-05-03

申请号：US13529404

申请日：2012-06-21

申请人： Masaaki Furuya ,  Munenori Iwami ,  Takahiko Wakatsuki ,  Masanori Kondo ,  Katsuya Yamada

发明人： Masaaki Furuya ,  Munenori Iwami ,  Takahiko Wakatsuki ,  Masanori Kondo ,  Katsuya Yamada

IPC分类号： F27D11/00 ,  H01L21/67 ,  B01D46/10 ,  B01D46/42 ,  H05B3/28

CPC分类号： H01L21/67103 ,  B01D46/10 ,  B01D46/4263 ,  B01D2273/30 ,  H05B3/283 ,  H05B2203/022

摘要： A heater unit according to an embodiment includes: a flat heater including a linear heating element arranged in a planar pattern; a first mesh body formed in a mesh pattern using a material with high heat conductivity and placed at least on one side of the flat heater facing the flat heater; and a second mesh body formed in a mesh pattern using a material with lower heat conductivity than that of the first mesh body and placed to face a surface of the first mesh body opposite to the surface of the first mesh body facing the flat heater.

摘要翻译： 根据实施例的加热器单元包括：扁平加热器，其包括以平面图案布置的线性加热元件; 使用具有高导热性的材料以网格图案形成的第一网状体，并且至少放置在面向平面加热器的平面加热器的一侧上; 以及第二网状体，其使用比所述第一网状体的导热性低的材料以网状图案形成，并且与所述第一网状体的与所述第一网状体的面对所述扁平加热器的表面相对的表面放置。

公开(公告)号：US4693777A

公开(公告)日：1987-09-15

申请号：US802468

申请日：1985-11-27

申请人： Shigeki Hazano ,  Masahiro Shibagaki ,  Hidetaka Jyo ,  Reiichiro Sensui ,  Munenori Iwami ,  Noboru Suzuki

发明人： Shigeki Hazano ,  Masahiro Shibagaki ,  Hidetaka Jyo ,  Reiichiro Sensui ,  Munenori Iwami ,  Noboru Suzuki

IPC分类号： B25J9/10 ,  H01L21/00 ,  H01L21/3065 ,  H01L21/3213 ,  H01L21/324 ,  H01L21/677 ,  B44C1/22 ,  C03C15/00 ,  C23F1/02

CPC分类号： H01L21/324 ,  B25J9/107 ,  H01L21/3065 ,  H01L21/32136 ,  H01L21/67109 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/67742 ,  Y10S134/902

摘要： An apparatus for producing semiconductor devices in which a plurality of treatment chambers such as a load chamber, an etching chamber, a sputtering chamber, an ion implantation chamber, a CVD chamber, an unload chamber, a transfer chamber, a heat-treatment chamber, a rinsing chamber and the like, are connected in series preferably in the form of U for effecting various treatments of semiconductor wafers. Wafer conveyor and transfer means are provided to move a wafer through the treatment chambers in which the wafer is normally sequentially processed and these conveyor and transfer means are reversible so that a wafer which has been moved into a predetermined treatment chamber can be returned to the inlet of the apparatus, whereby the quantity of dust attached to the wafer in each treatment chamber can be easily and positively detected. In the heat-treatment chamber, the hot air is discharged against the upper surface of the wafer on the belt conveyor while a vertically movable heating plate is brought into contact with the undersurface of the wafer so that the uniform heat-treatment can be accomplished within a short period of time. Furthermore, the inner surfaces of the etching chamber or the like are lined with detachable linings made of, for instance, aluminum so that maintenance is facilitated.

摘要翻译： 一种用于制造半导体器件的装置，其中诸如负载室，蚀刻室，溅射室，离子注入室，CVD室，卸载室，转移室，热处理室等多个处理室， 漂洗室等优选以U形式串联连接，以实现半导体晶片的各种处理。 提供晶片输送机和转印装置以使晶片移动通过处理室，其中晶片通常在其中被顺序加工，并且这些输送机和转印装置是可逆的，从而已经移动到预定处理室中的晶片可以返回到入口 从而可以容易且可靠地检测每个处理室中附着到晶片的灰尘的量。 在热处理室中，热空气相对于带式输送机上的晶片的上表面排出，同时使可垂直移动的加热板与晶片的下表面接触，从而可以在晶片的内表面内完成均匀的热处理 很短的时间。 此外，蚀刻室等的内表面衬有由例如铝制成的可拆卸衬里，从而便于维护。