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公开(公告)号：US07619678B2
公开(公告)日：2009-11-17
申请号：US11584560
申请日：2006-10-23
IPC分类号： H04N5/225
CPC分类号： H01L27/14627 , H01L27/14603 , H01L27/1462
摘要： A solid state imaging device includes: a solid state imaging element including a light receiving element, a microlens formed above the light receiving element, a first transparent layer formed on the microlens and a second transparent layer formed on or above the microlens and harder than the first transparent layer; a transparent component formed above the second transparent layer; and an adhesive layer for bonding the second transparent layer and the transparent component. The hard second transparent layer prevents the occurrence of scratches during a dicing step.
摘要翻译： 固态成像装置包括：固态成像元件，包括光接收元件，形成在光接收元件上方的微透镜，形成在微透镜上的第一透明层和形成在微透镜上或之上的第二透明层，并且硬 第一透明层; 形成在所述第二透明层上方的透明部件; 以及用于粘合第二透明层和透明部件的粘合剂层。 硬的第二透明层防止在切割步骤期间发生划痕。
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公开(公告)号：US20070117349A1
公开(公告)日：2007-05-24
申请号：US11584560
申请日：2006-10-23
CPC分类号： H01L27/14627 , H01L27/14603 , H01L27/1462
摘要： A solid state imaging device includes: a solid state imaging element including a light receiving element, a microlens formed above the light receiving element, a first transparent layer formed on the microlens and a second transparent layer formed on or above the microlens and harder than the first transparent layer; a transparent component formed above the second transparent layer; and an adhesive layer for bonding the second transparent layer and the transparent component. The hard second transparent layer prevents the occurrence of scratches during a dicing step.
摘要翻译： 固态成像装置包括：固态成像元件，包括光接收元件，形成在光接收元件上方的微透镜，形成在微透镜上的第一透明层和形成在微透镜上或上方的第二透明层， 第一透明层; 形成在所述第二透明层上方的透明部件; 以及用于粘合第二透明层和透明部件的粘合剂层。 硬的第二透明层防止在切割步骤期间发生划痕。
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公开(公告)号：US20100033607A1
公开(公告)日：2010-02-11
申请号：US12579930
申请日：2009-10-15
IPC分类号： H04N5/335
CPC分类号： H01L27/14627 , H01L27/14603 , H01L27/1462
摘要： A solid state imaging device includes: a solid state imaging element including a light receiving element, a microlens formed above the light receiving element, a first transparent layer formed on the microlens and a second transparent layer formed on or above the microlens and harder than the first transparent layer; a transparent component formed above the second transparent layer; and an adhesive layer for bonding the second transparent layer and the transparent component. The hard second transparent layer prevents the occurrence of scratches during a dicing step.
摘要翻译： 固态成像装置包括：固态成像元件，包括光接收元件，形成在光接收元件上方的微透镜，形成在微透镜上的第一透明层和形成在微透镜上或之上的第二透明层，并且硬 第一透明层; 形成在所述第二透明层上方的透明部件; 以及用于粘合第二透明层和透明部件的粘合剂层。 硬的第二透明层防止在切割步骤期间发生划痕。
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4.发明申请Manufacturing method for a solid-state imaging apparatus, and the solid-state imaging apparatus 审中-公开固体摄像装置的制造方法以及固体摄像装置公开(公告)号：US20070200944A1
公开(公告)日：2007-08-30
申请号：US11588419
申请日：2006-10-27
申请人： Yasuo Takeuchi , Tomoko Komatsu , Nobukazu Teranishi , Tomoki Masuda , Yutaka Harada , Mituru Harada , Takashi Ohbayashi
发明人： Yasuo Takeuchi , Tomoko Komatsu , Nobukazu Teranishi , Tomoki Masuda , Yutaka Harada , Mituru Harada , Takashi Ohbayashi
CPC分类号： H01L27/14618 , H01L27/14621 , H01L27/14627 , H01L27/14636 , H01L27/14683 , H01L27/14843 , H01L2224/05554 , H01L2224/32225 , H01L2224/48091 , H01L2224/49175 , H01L2224/73265 , H01L2224/83385 , H01L2924/01019 , H01L2924/16235 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： A light receiving region 21 and a floating diffusion region 22 are formed apart from each other in a semiconductor substrate 20 (S11), translucent adhesive 31 is applied to an area corresponding to the light receiving region 21 on the semiconductor substrate 20 (S22), and a translucent plate 30 is attached to the semiconductor substrate 20 on which the translucent adhesive 31 has been applied (S23). In this semiconductor manufacturing process, before the translucent adhesive 31 is applied, a dam member 24 is formed on the semiconductor substrate 20 so as to prevent the translucent adhesive 31 from flowing into an area corresponding to the floating diffusion region 22 on the semiconductor substrate 20 (S18).
摘要翻译： 在半导体衬底20中，将光接收区域21和浮动扩散区域22彼此分开地形成（S11），半导体衬底20上的与光接收区域21相对应的区域施加半透明粘合剂31（S22） ），并且半透明板30附接到其上施加有半透明粘合剂31的半导体衬底20（S23）。 在该半导体制造工序中，在施加半透明粘接剂31之前，在半导体基板20上形成有阻挡构件24，以防止半透明粘合剂31流入与半导体基板20上的浮动扩散区域22相对应的区域 （S18）。
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公开(公告)号：US20070126914A1
公开(公告)日：2007-06-07
申请号：US11585891
申请日：2006-10-25
申请人： Tomoko Komatsu , Tomoki Masuda , Yasuo Takeuchi , Nobukazu Teranishi , Yutaka Harada , Kiyokazu Itoi , Akiyoshi Kohno
发明人： Tomoko Komatsu , Tomoki Masuda , Yasuo Takeuchi , Nobukazu Teranishi , Yutaka Harada , Kiyokazu Itoi , Akiyoshi Kohno
IPC分类号： H04N5/225
CPC分类号： H01L27/14618 , H01L27/14627 , H01L2224/48091 , H01L2924/00014
摘要： A solid state imaging element including light receiving elements and microlenses is placed in a recess of a ceramic package. A black resin fills space between the ceramic package and the solid state imaging element.
摘要翻译： 包括光接收元件和微透镜的固态成像元件放置在陶瓷封装的凹部中。 黑色树脂填充陶瓷封装和固态成像元件之间的空间。
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6.发明授权公开(公告)号：US08792037B2
公开(公告)日：2014-07-29
申请号：US13590670
申请日：2012-08-21
CPC分类号： H04N5/357 , H04N5/3742
摘要： A row scanning unit is configured to change a potential of a transfer signal from a second potential V2 to a third potential V3 prior to driving of a transfer operation for causing a transfer of signal charges from a photodiode to a floating diffusion, by supplying a transfer pulse having a first potential V1. The first potential V1 is a positive potential for turning a transfer transistor into ON state, the second potential V2 is a potential for causing pinning of holes under a gate of the transfer transistor and turning the transfer transistor into OFF state, and the third potential V3 is a potential for not causing the pinning of the holes under the gate of the transfer transistor and turning the transfer transistor into OFF state, the third potential being lower than the first potential and higher than the second potential.
摘要翻译： 行扫描单元被配置为在驱动用于使来自光电二极管的信号电荷到浮动扩散的传输操作的驱动之前将传输信号的电位从第二电位V2改变为第三电位V3，通过提供转移 具有第一电位V1的脉冲。 第一电位V1是将转移晶体管转换为导通状态的正电位，第二电位V2是用于使转移晶体管的栅极下方的空穴锁定的电位，并将转移晶体管转换为截止状态，第三电位V3 是不会导致在转移晶体管的栅极下方的钉锁钉并将转移晶体管转为断开状态的可能性，第三电位低于第一电位并高于第二电位。
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7.发明授权Solid state image sensor with transparent film on micro-lenses and offsetting positions of micro-lenses and color filters from a central portion of a corresponding light receiving area 有权固态图像传感器在微透镜上具有透明胶片，并且从对应的光接收区域的中心部分的微透镜和滤色器的偏移位置公开(公告)号：US07411180B2
公开(公告)日：2008-08-12
申请号：US11783703
申请日：2007-04-11
IPC分类号： H01J5/02
CPC分类号： H01L27/14603 , H01L27/14621 , H01L27/14627 , H01L27/14806
摘要： A solid-state image sensor includes a plurality of light-receiving elements arranged in a light-receiving area, and a plurality of micro-lenses corresponding to the light-receiving elements, and has a flattening film formed on the plurality of the micro-lenses. At a center of the light-receiving area, the micro-lenses are placed in positions directly above corresponding photodiodes, and placed in positions which are progressively offset from positions directly above the corresponding photodiodes, towards a center of the light receiving area, as micro-lenses are located farther from the center of the light-receiving area.
摘要翻译： 固态图像传感器包括布置在光接收区域中的多个光接收元件和对应于光接收元件的多个微透镜，并且具有形成在多个微接收元件上的平坦化膜， 镜头 在光接收区域的中心处，将微透镜放置在相应的光电二极管正上方的位置，并且放置在相应的光电二极管正上方的位置上，朝向光接收区域的中心逐渐偏移， 光源距离光接收区域的中心更远。
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8.发明授权Solid-state image sensor, manufacturing method for solid-state image sensor, and camera 有权固态图像传感器，固态图像传感器的制造方法和相机公开(公告)号：US07919743B2
公开(公告)日：2011-04-05
申请号：US12418811
申请日：2009-04-06
IPC分类号： H01J5/02
CPC分类号： H01L27/14603 , H01L27/14621 , H01L27/14627 , H01L27/14806
摘要： A solid-state image sensor includes a plurality of light-receiving elements arranged in a light-receiving area, and a plurality of micro-lenses corresponding to the light-receiving elements, and has a flattening film formed on the plurality of the micro-lenses. At a center of the light-receiving area, the micro-lenses are placed in positions directly above corresponding photodiodes, and placed in positions which are progressively offset from positions directly above the corresponding photodiodes, towards a center of the light receiving area, as micro-lenses are located farther from the center of the light-receiving area.
摘要翻译： 固态图像传感器包括布置在光接收区域中的多个光接收元件和对应于光接收元件的多个微透镜，并且具有形成在多个微接收元件上的平坦化膜， 镜头 在光接收区域的中心处，将微透镜放置在相应的光电二极管正上方的位置，并且放置在相应的光电二极管正上方的位置上，朝向光接收区域的中心逐渐偏移， 光源距离光接收区域的中心更远。
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9.发明申请Solid-state image sensor, manufacturing method for solid-state image sensor, and camera 有权固态图像传感器，固态图像传感器的制造方法和相机公开(公告)号：US20070246640A1
公开(公告)日：2007-10-25
申请号：US11812613
申请日：2007-06-20
IPC分类号： H01L27/00
CPC分类号： H01L27/14603 , H01L27/14621 , H01L27/14627 , H01L27/14806
摘要： A solid-state image sensor includes a plurality of light-receiving elements arranged in a light-receiving area, and a plurality of micro-lenses corresponding to the light-receiving elements, and has a flattening film formed on the plurality of the micro-lenses. At a center of the light-receiving area, the micro-lenses are placed in positions directly above corresponding photodiodes, and placed in positions which are progressively offset from positions directly above the corresponding photodiodes, towards a center of the light receiving area, as micro-lenses are located farther from the center of the light-receiving area.
摘要翻译： 固态图像传感器包括布置在光接收区域中的多个光接收元件和对应于光接收元件的多个微透镜，并且具有形成在多个微接收元件上的平坦化膜， 镜头 在光接收区域的中心处，将微透镜放置在相应的光电二极管正上方的位置，并且放置在相应的光电二极管正上方的位置上，朝向光接收区域的中心逐渐偏移， 光源距离光接收区域的中心更远。
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10.发明申请Solid-state image sensor, manufacturing method for solid-state image sensor, and camera 有权固态图像传感器，固态图像传感器的制造方法和相机公开(公告)号：US20050029433A1
公开(公告)日：2005-02-10
申请号：US10909311
申请日：2004-08-03
IPC分类号： G02B3/00 , H01L27/00 , H01L27/14 , H01L27/148 , H01L31/10 , H04N5/225 , H04N5/335 , H04N5/369
CPC分类号： H01L27/14603 , H01L27/14621 , H01L27/14627 , H01L27/14806
摘要： The solid-state image sensor in the present invention includes a plurality of light-receiving elements arranged in a light-receiving area, and a plurality of micro-lenses 7 corresponding to the light-receiving elements, and has a flattening film 8 formed on the plurality of the micro-lenses. At the center of the light-receiving area, micro-lenses 7 are placed in positions directly above the corresponding photodiodes 1, and placed in positions which are progressively offset from the positions directly above the corresponding photodiodes 1, towards the center of the light receiving area, as micro-lenses 7 are located farther from the center of the light-receiving area.
摘要翻译： 本发明的固态图像传感器包括配置在光接收区域中的多个受光元件和对应于光接收元件的多个微透镜7，并且具有形成在 多个微透镜。 在光接收区域的中心处，将微透镜7放置在对应的光电二极管1正上方的位置，并且放置在相对于光电二极管1的正上方的位置逐渐偏离到接收光的中心 区域，因为微透镜7远离光接收区域的中心。
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