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公开(公告)号：US20070126914A1
公开(公告)日：2007-06-07
申请号：US11585891
申请日：2006-10-25
申请人： Tomoko Komatsu , Tomoki Masuda , Yasuo Takeuchi , Nobukazu Teranishi , Yutaka Harada , Kiyokazu Itoi , Akiyoshi Kohno
发明人： Tomoko Komatsu , Tomoki Masuda , Yasuo Takeuchi , Nobukazu Teranishi , Yutaka Harada , Kiyokazu Itoi , Akiyoshi Kohno
IPC分类号： H04N5/225
CPC分类号： H01L27/14618 , H01L27/14627 , H01L2224/48091 , H01L2924/00014
摘要： A solid state imaging element including light receiving elements and microlenses is placed in a recess of a ceramic package. A black resin fills space between the ceramic package and the solid state imaging element.
摘要翻译： 包括光接收元件和微透镜的固态成像元件放置在陶瓷封装的凹部中。 黑色树脂填充陶瓷封装和固态成像元件之间的空间。
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2.发明申请Manufacturing method for a solid-state imaging apparatus, and the solid-state imaging apparatus 审中-公开固体摄像装置的制造方法以及固体摄像装置公开(公告)号：US20070200944A1
公开(公告)日：2007-08-30
申请号：US11588419
申请日：2006-10-27
申请人： Yasuo Takeuchi , Tomoko Komatsu , Nobukazu Teranishi , Tomoki Masuda , Yutaka Harada , Mituru Harada , Takashi Ohbayashi
发明人： Yasuo Takeuchi , Tomoko Komatsu , Nobukazu Teranishi , Tomoki Masuda , Yutaka Harada , Mituru Harada , Takashi Ohbayashi
CPC分类号： H01L27/14618 , H01L27/14621 , H01L27/14627 , H01L27/14636 , H01L27/14683 , H01L27/14843 , H01L2224/05554 , H01L2224/32225 , H01L2224/48091 , H01L2224/49175 , H01L2224/73265 , H01L2224/83385 , H01L2924/01019 , H01L2924/16235 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： A light receiving region 21 and a floating diffusion region 22 are formed apart from each other in a semiconductor substrate 20 (S11), translucent adhesive 31 is applied to an area corresponding to the light receiving region 21 on the semiconductor substrate 20 (S22), and a translucent plate 30 is attached to the semiconductor substrate 20 on which the translucent adhesive 31 has been applied (S23). In this semiconductor manufacturing process, before the translucent adhesive 31 is applied, a dam member 24 is formed on the semiconductor substrate 20 so as to prevent the translucent adhesive 31 from flowing into an area corresponding to the floating diffusion region 22 on the semiconductor substrate 20 (S18).
摘要翻译： 在半导体衬底20中，将光接收区域21和浮动扩散区域22彼此分开地形成（S11），半导体衬底20上的与光接收区域21相对应的区域施加半透明粘合剂31（S22） ），并且半透明板30附接到其上施加有半透明粘合剂31的半导体衬底20（S23）。 在该半导体制造工序中，在施加半透明粘接剂31之前，在半导体基板20上形成有阻挡构件24，以防止半透明粘合剂31流入与半导体基板20上的浮动扩散区域22相对应的区域 （S18）。
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公开(公告)号：US07619678B2
公开(公告)日：2009-11-17
申请号：US11584560
申请日：2006-10-23
IPC分类号： H04N5/225
CPC分类号： H01L27/14627 , H01L27/14603 , H01L27/1462
摘要： A solid state imaging device includes: a solid state imaging element including a light receiving element, a microlens formed above the light receiving element, a first transparent layer formed on the microlens and a second transparent layer formed on or above the microlens and harder than the first transparent layer; a transparent component formed above the second transparent layer; and an adhesive layer for bonding the second transparent layer and the transparent component. The hard second transparent layer prevents the occurrence of scratches during a dicing step.
摘要翻译： 固态成像装置包括：固态成像元件，包括光接收元件，形成在光接收元件上方的微透镜，形成在微透镜上的第一透明层和形成在微透镜上或之上的第二透明层，并且硬 第一透明层; 形成在所述第二透明层上方的透明部件; 以及用于粘合第二透明层和透明部件的粘合剂层。 硬的第二透明层防止在切割步骤期间发生划痕。
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公开(公告)号：US20070117349A1
公开(公告)日：2007-05-24
申请号：US11584560
申请日：2006-10-23
CPC分类号： H01L27/14627 , H01L27/14603 , H01L27/1462
摘要： A solid state imaging device includes: a solid state imaging element including a light receiving element, a microlens formed above the light receiving element, a first transparent layer formed on the microlens and a second transparent layer formed on or above the microlens and harder than the first transparent layer; a transparent component formed above the second transparent layer; and an adhesive layer for bonding the second transparent layer and the transparent component. The hard second transparent layer prevents the occurrence of scratches during a dicing step.
摘要翻译： 固态成像装置包括：固态成像元件，包括光接收元件，形成在光接收元件上方的微透镜，形成在微透镜上的第一透明层和形成在微透镜上或上方的第二透明层， 第一透明层; 形成在所述第二透明层上方的透明部件; 以及用于粘合第二透明层和透明部件的粘合剂层。 硬的第二透明层防止在切割步骤期间发生划痕。
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5.发明申请SOLID-STATE IMAGING ELEMENT, METHOD FOR FABRICATING THE SAME, AND SOLID-STATE IMAGING DEVICE 审中-公开固态成像元件，其制造方法和固态成像装置公开(公告)号：US20100224948A1
公开(公告)日：2010-09-09
申请号：US12783086
申请日：2010-05-19
IPC分类号： H01L31/0232 , H01L31/18 , H01L31/0216
CPC分类号： G02B3/0006 , H01L27/14618 , H01L27/14627 , H01L27/14683 , H01L2224/16 , H01L2224/48091 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/3025 , H01L2224/0401
摘要： A solid-state imaging element includes a semiconductor substrate formed with a valid pixel section including a plurality of photodetector sections, spacers formed on the valid pixel section, a transparent adhesive filling gaps among the spacers, and a transparent substrate which is bonded onto the spacers using the transparent adhesive and covers the valid pixel section when viewed in plan. Electrode pad sections are formed in a region of the semiconductor substrate located outside the valid pixel section.
摘要翻译： 固态成像元件包括形成有有效像素部分的半导体衬底，该有效像素部分包括多个光电检测器部分，形成在有效像素部分上的间隔物，填充间隔物之间的间隙的透明粘合剂和粘合到间隔物上的透明基板 使用透明粘合剂并在计划中观察时覆盖有效像素部分。 电极焊盘部分形成在位于有效像素部分外部的半导体衬底的区域中。
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公开(公告)号：US20090085139A1
公开(公告)日：2009-04-02
申请号：US12237890
申请日：2008-09-25
CPC分类号： H01L27/14618 , H01L27/14627 , H01L27/14683 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： A solid-state image sensing element includes an effective pixel section in a central area of a light receiving surface thereof, and a ridge-shaped protruding portion is provided around the effective pixel section. A liquid transparent adhesive is applied on the effective pixel section, and a light transparent substrate is placed thereon. The light transparent substrate is in contact with the protruding portion, and is therefore prevented from sliding with the liquid adhesive serving as a lubricant. Thus, the light transparent substrate can be fixed at a predetermined position.
摘要翻译： 固态摄像元件包括在其受光面的中央区域的有效像素部，并且在有效像素部的周围设置有脊状的突出部。 将液体透明粘合剂施加在有效像素部分上，并且将透光基板放置在其上。 透光性基板与突出部接触，因此防止与作为润滑剂的液体粘合剂滑动。 因此，可以将光透明基板固定在预定位置。
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公开(公告)号：US07646539B2
公开(公告)日：2010-01-12
申请号：US12401904
申请日：2009-03-11
摘要： An optical device includes a substrate, a plurality of optical elements formed in an element formation region of the substrate, a plurality of lenses formed over the element formation region so as to correspond to the plurality of optical elements, and a protective layer formed so as to cover the plurality of lenses. A holding member is formed on the protective layer in a region outside the element formation region. The holding member holds a bottom surface of a transparent member. A gap between the protective layer and the transparent member is filled with an adhesive.
摘要翻译： 光学装置包括基板，形成在基板的元件形成区域中的多个光学元件，在元件形成区域上形成为与多个光学元件对应的多个透镜，以及形成为 以覆盖多个透镜。 在元件形成区域外的区域中的保护层上形成保持构件。 保持构件保持透明构件的底面。 保护层和透明构件之间的间隙填充有粘合剂。
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公开(公告)号：US20090237796A1
公开(公告)日：2009-09-24
申请号：US12401904
申请日：2009-03-11
摘要： An optical device includes a substrate, a plurality of optical elements formed in an element formation region of the substrate, a plurality of lenses formed over the element formation region so as to correspond to the plurality of optical elements, and a protective layer formed so as to cover the plurality of lenses. A holding member is formed on the protective layer in a region outside the element formation region. The holding member holds a bottom surface of a transparent member. A gap between the protective layer and the transparent member is filled with an adhesive.
摘要翻译： 光学装置包括基板，形成在基板的元件形成区域中的多个光学元件，在元件形成区域上形成为与多个光学元件对应的多个透镜，以及形成为 以覆盖多个透镜。 在元件形成区域外的区域中的保护层上形成保持构件。 保持构件保持透明构件的底面。 保护层和透明构件之间的间隙填充有粘合剂。
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9.发明申请SOLID-STATE IMAGE SENSING DEVICE HAVING A DIRECT-ATTACHMENT STRUCTURE AND METHOD FOR MANUFACTURING THE SAME 审中-公开具有直接附着结构的固态图像感测装置及其制造方法公开(公告)号：US20110278692A1
公开(公告)日：2011-11-17
申请号：US13192155
申请日：2011-07-27
IPC分类号： H01L31/0203
CPC分类号： H01L27/14618 , H01L27/14627 , H01L27/14683 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： A solid-state image sensing element includes an effective pixel section in a central area of a light receiving surface thereof, and a ridge-shaped protruding portion is provided around the effective pixel section. A liquid transparent adhesive is applied on the effective pixel section, and a light transparent substrate is placed thereon. The light transparent substrate is in contact with the protruding portion, and is therefore prevented from sliding with the liquid adhesive serving as a lubricant. Thus, the light transparent substrate can be fixed at a predetermined position.
摘要翻译： 固态摄像元件包括在其受光面的中央区域的有效像素部，并且在有效像素部的周围设置有脊状的突出部。 将液体透明粘合剂施加在有效像素部分上，并且将透光基板放置在其上。 透光性基板与突出部接触，因此防止与作为润滑剂的液体粘合剂滑动。 因此，可以将光透明基板固定在预定位置。
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公开(公告)号：US20090039454A1
公开(公告)日：2009-02-12
申请号：US12186157
申请日：2008-08-05
IPC分类号： H01L31/0232 , H01L21/02
CPC分类号： H01L27/1462 , H01L27/14627 , H01L27/14685
摘要： Provided is a solid-state image pickup device capable of suppressing deterioration of characteristic caused due to an antireflection film itself absorbing a light. In the solid-state image pickup device of the present invention, a plurality of color filters 8a, 8b, and 8c having spectral characteristics, respectively, different from each other are provided so as to correspond to a plurality of light reception sections 2, respectively, aligned on a semiconductor substrate 1. Further, a plurality of microlenses 10 are provided above the plurality of color filters 8a, 8b, and 8c, respectively. A plurality of antireflection films 11a are selectively formed on surfaces of the microlenses 10 provided above color filters 8b each having a predetermined spectral characteristic.
摘要翻译： 提供一种能够抑制由吸收光的抗反射膜本身引起的特性劣化的固态图像拾取装置。 在本发明的固态图像拾取装置中，分别具有彼此不同的分光特性的多个滤色器8a，8b和8c分别对应于多个光接收部2 在半导体衬底1上对准。此外，多个微透镜10分别设置在多个滤色器8a，8b和8c上方。 多个防反射膜11a选择性地形成在设置在具有预定光谱特性的滤色器8b之上的微透镜10的表面上。
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