公开(公告)号：US20070126914A1

公开(公告)日：2007-06-07

申请号：US11585891

申请日：2006-10-25

申请人： Tomoko Komatsu ,  Tomoki Masuda ,  Yasuo Takeuchi ,  Nobukazu Teranishi ,  Yutaka Harada ,  Kiyokazu Itoi ,  Akiyoshi Kohno

发明人： Tomoko Komatsu ,  Tomoki Masuda ,  Yasuo Takeuchi ,  Nobukazu Teranishi ,  Yutaka Harada ,  Kiyokazu Itoi ,  Akiyoshi Kohno

IPC分类号： H04N5/225

CPC分类号： H01L27/14618 ,  H01L27/14627 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A solid state imaging element including light receiving elements and microlenses is placed in a recess of a ceramic package. A black resin fills space between the ceramic package and the solid state imaging element.

摘要翻译： 包括光接收元件和微透镜的固态成像元件放置在陶瓷封装的凹部中。 黑色树脂填充陶瓷封装和固态成像元件之间的空间。

公开(公告)号：US07646539B2

公开(公告)日：2010-01-12

申请号：US12401904

申请日：2009-03-11

申请人： Kiyokazu Itoi ,  Tetsushi Nishio ,  Yutaka Harada ,  Tomoko Komatsu ,  Masashi Kuroda

发明人： Kiyokazu Itoi ,  Tetsushi Nishio ,  Yutaka Harada ,  Tomoko Komatsu ,  Masashi Kuroda

IPC分类号： G02B27/10 ,  G02B7/02 ,  G03B17/00

CPC分类号： G02B1/14 ,  G02B1/105

摘要： An optical device includes a substrate, a plurality of optical elements formed in an element formation region of the substrate, a plurality of lenses formed over the element formation region so as to correspond to the plurality of optical elements, and a protective layer formed so as to cover the plurality of lenses. A holding member is formed on the protective layer in a region outside the element formation region. The holding member holds a bottom surface of a transparent member. A gap between the protective layer and the transparent member is filled with an adhesive.

摘要翻译： 光学装置包括基板，形成在基板的元件形成区域中的多个光学元件，在元件形成区域上形成为与多个光学元件对应的多个透镜，以及形成为 以覆盖多个透镜。 在元件形成区域外的区域中的保护层上形成保持构件。 保持构件保持透明构件的底面。 保护层和透明构件之间的间隙填充有粘合剂。

公开(公告)号：US20100224948A1

公开(公告)日：2010-09-09

申请号：US12783086

申请日：2010-05-19

申请人： Yasuo TAKEUCHI ,  Tomoko Komatsu ,  Masashi Kuroda ,  Tetsushi Nishio ,  Kiyokazu Itoi

发明人： Yasuo TAKEUCHI ,  Tomoko Komatsu ,  Masashi Kuroda ,  Tetsushi Nishio ,  Kiyokazu Itoi

IPC分类号： H01L31/0232 ,  H01L31/18 ,  H01L31/0216

CPC分类号： G02B3/0006 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14683 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/3025 ,  H01L2224/0401

摘要： A solid-state imaging element includes a semiconductor substrate formed with a valid pixel section including a plurality of photodetector sections, spacers formed on the valid pixel section, a transparent adhesive filling gaps among the spacers, and a transparent substrate which is bonded onto the spacers using the transparent adhesive and covers the valid pixel section when viewed in plan. Electrode pad sections are formed in a region of the semiconductor substrate located outside the valid pixel section.

摘要翻译： 固态成像元件包括形成有有效像素部分的半导体衬底，该有效像素部分包括多个光电检测器部分，形成在有效像素部分上的间隔物，填充间隔物之间​​的间隙的透明粘合剂和粘合到间隔物上的透明基板 使用透明粘合剂并在计划中观察时覆盖有效像素部分。 电极焊盘部分形成在位于有效像素部分外部的半导体衬底的区域中。

公开(公告)号：US20090085139A1

公开(公告)日：2009-04-02

申请号：US12237890

申请日：2008-09-25

申请人： Yasuo Takeuchi ,  Tomoko Komatsu ,  Masashi Kuroda ,  Tetsushi Nishio ,  Kiyokazu Itoi

发明人： Yasuo Takeuchi ,  Tomoko Komatsu ,  Masashi Kuroda ,  Tetsushi Nishio ,  Kiyokazu Itoi

IPC分类号： H01L23/12 ,  H01L21/00

CPC分类号： H01L27/14618 ,  H01L27/14627 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

摘要： A solid-state image sensing element includes an effective pixel section in a central area of a light receiving surface thereof, and a ridge-shaped protruding portion is provided around the effective pixel section. A liquid transparent adhesive is applied on the effective pixel section, and a light transparent substrate is placed thereon. The light transparent substrate is in contact with the protruding portion, and is therefore prevented from sliding with the liquid adhesive serving as a lubricant. Thus, the light transparent substrate can be fixed at a predetermined position.

摘要翻译： 固态摄像元件包括在其受光面的中央区域的有效像素部，并且在有效像素部的周围设置有脊状的突出部。 将液体透明粘合剂施加在有效像素部分上，并且将透光基板放置在其上。 透光性基板与突出部接触，因此防止与作为润滑剂的液体粘合剂滑动。 因此，可以将光透明基板固定在预定位置。

公开(公告)号：US20110278692A1

公开(公告)日：2011-11-17

申请号：US13192155

申请日：2011-07-27

申请人： Yasuo TAKEUCHI ,  Tomoko Komatsu ,  Masashi Kuroda ,  Tetsushi Nishio ,  Kiyokazu Itoi

发明人： Yasuo TAKEUCHI ,  Tomoko Komatsu ,  Masashi Kuroda ,  Tetsushi Nishio ,  Kiyokazu Itoi

IPC分类号： H01L31/0203

CPC分类号： H01L27/14618 ,  H01L27/14627 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

摘要： A solid-state image sensing element includes an effective pixel section in a central area of a light receiving surface thereof, and a ridge-shaped protruding portion is provided around the effective pixel section. A liquid transparent adhesive is applied on the effective pixel section, and a light transparent substrate is placed thereon. The light transparent substrate is in contact with the protruding portion, and is therefore prevented from sliding with the liquid adhesive serving as a lubricant. Thus, the light transparent substrate can be fixed at a predetermined position.

摘要翻译： 固态摄像元件包括在其受光面的中央区域的有效像素部，并且在有效像素部的周围设置有脊状的突出部。 将液体透明粘合剂施加在有效像素部分上，并且将透光基板放置在其上。 透光性基板与突出部接触，因此防止与作为润滑剂的液体粘合剂滑动。 因此，可以将光透明基板固定在预定位置。

公开(公告)号：US07834926B2

公开(公告)日：2010-11-16

申请号：US11540753

申请日：2006-10-02

申请人： Masanori Minamio ,  Tomoko Komatsu ,  Kiyokazu Itoi ,  Toshiyuki Fukuda

发明人： Masanori Minamio ,  Tomoko Komatsu ,  Kiyokazu Itoi ,  Toshiyuki Fukuda

IPC分类号： H04N5/225 ,  G02B26/00 ,  G02F1/00 ,  H01L21/00

CPC分类号： H01L27/14623 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/14683 ,  H01L27/14685 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/16235 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor image sensing element has a semiconductor element including an image sensing area, a peripheral circuit region, a plurality of electrode portions provided in the peripheral circuit region, and a plurality of micro-lenses provided on the image sensing area and an optical member having a configuration covering at least the image sensing area and bonded over the micro-lenses via a transparent bonding member. The side surface region of the optical member is formed with a light shielding film for preventing the irradiation of the image sensing area with a reflected light beam or a scattered light beam from the side surface region.

摘要翻译： 半导体图像感测元件具有包括图像感测区域，外围电路区域，设置在外围电路区域中的多个电极部分和设置在图像感测区域上的多个微透镜的半导体元件和具有 至少覆盖图像感测区域并通过透明结合部件粘合在微透镜上的构造。 光学构件的侧表面区域形成有用于防止来自侧表面区域的反射光束或散射光束照射摄像区域的遮光膜。

公开(公告)号：US20070109439A1

公开(公告)日：2007-05-17

申请号：US11540753

申请日：2006-10-02

申请人： Masanori Minamio ,  Tomoko Komatsu ,  Kiyokazu Itoi ,  Toshiyuki Fukuda

发明人： Masanori Minamio ,  Tomoko Komatsu ,  Kiyokazu Itoi ,  Toshiyuki Fukuda

IPC分类号： H04N5/225

CPC分类号： H01L27/14623 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/14683 ,  H01L27/14685 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/16235 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor image sensing element has a semiconductor element including an image sensing area, a peripheral circuit region, a plurality of electrode portions provided in the peripheral circuit region, and a plurality of micro-lenses provided on the image sensing area and an optical member having a configuration covering at least the image sensing area and bonded over the micro-lenses via a transparent bonding member. The side surface region of the optical member is formed with a light shielding film for preventing the irradiation of the image sensing area with a reflected light beam or a scattered light beam from the side surface region.

摘要翻译： 半导体图像感测元件具有包括图像感测区域，外围电路区域，设置在外围电路区域中的多个电极部分和设置在图像感测区域上的多个微透镜的半导体元件和具有 至少覆盖图像感测区域并通过透明结合部件粘合在微透镜上的构造。 光学构件的侧表面区域形成有用于防止来自侧表面区域的反射光束或散射光束照射摄像区域的遮光膜。

公开(公告)号：US20070206455A1

公开(公告)日：2007-09-06

申请号：US11708472

申请日：2007-02-21

申请人： Masanori Minamio ,  Yutaka Harada ,  Kiyokazu Itoi ,  Toshiyuki Fukuda

发明人： Masanori Minamio ,  Yutaka Harada ,  Kiyokazu Itoi ,  Toshiyuki Fukuda

IPC分类号： G11B7/00

CPC分类号： H01L27/14618 ,  H01L24/97 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  Y10T29/49117 ,  H01L2224/85 ,  H01L2924/00014

摘要： An optical device includes a substrate, an optical element, a translucent component, a plurality of first terminals and a sealant. The sealant is located lower than the top surface of the translucent component. The top surface of the translucent component is exposed out of the sealant, while the side surface of the translucent component is covered with the sealant.

摘要翻译： 光学装置包括基板，光学元件，半透明部件，多个第一端子和密封剂。 密封剂位于比半透明组件的顶表面更低的位置。 半透明部件的顶面从密封剂露出，而半透明部件的侧表面被密封剂覆盖。

公开(公告)号：US07595540B2

公开(公告)日：2009-09-29

申请号：US11488062

申请日：2006-07-18

申请人： Toshiyuki Fukuda ,  Eizou Fujii ,  Yutaka Fukai ,  Yutaka Harada ,  Kiyokazu Itoi

发明人： Toshiyuki Fukuda ,  Eizou Fujii ,  Yutaka Fukai ,  Yutaka Harada ,  Kiyokazu Itoi

IPC分类号： H01L27/14 ,  H01L31/00

CPC分类号： H01L27/14618 ,  B81B7/0077 ,  B81C2203/0109 ,  B81C2203/058 ,  H01L21/50 ,  H01L23/057 ,  H01L23/10 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L27/14683 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48997 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16195 ,  H01L2924/16788 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device including a package (2) having a plurality of wall portions (9a) and a plurality of conductor portions (4), a semiconductor element such as a solid-state image pickup device (1) mounted in an internal space of the base, thin metal wires (5) electrically connecting the semiconductor element and the conductor portions (4) between the wall portions (9a), a resin sealing material (7) implanted in the spaces between the wall portions (9a), and a closing member such as a cover glass (6). The region for connecting the thin metal wires (5) and the wall portion (9a) region overlap each other, so that the device can be reduced in size and in height. The cover glass (6) can not move easily from the correct position because the wall portions (9a) serve as supporting columns, thereby improving the yield.

摘要翻译： 一种半导体器件，包括具有多个壁部分（9a）和多个导体部分（4）的封装（2），诸如固态图像拾取器件（1）的半导体元件，其安装在 电连接半导体元件和壁部分之间的导体部分（4）的薄金属线（5），植入在壁部分（9a）之间的空间中的树脂密封材料（7） 诸如盖玻璃（6）的构件。 用于连接细金属丝（5）和壁部（9a）区域的区域彼此重叠，使得该装置的尺寸和高度可以减小。 由于壁部（9a）作为支柱，因此盖玻璃（6）不能容易地从正确的位置移动，从而提高产量。

公开(公告)号：US20070018301A1

公开(公告)日：2007-01-25

申请号：US11488062

申请日：2006-07-18

申请人： Toshiyuki Fukuda ,  Eizou Fujii ,  Yutaka Fukai ,  Yutaka Harada ,  Kiyokazu Itoi

发明人： Toshiyuki Fukuda ,  Eizou Fujii ,  Yutaka Fukai ,  Yutaka Harada ,  Kiyokazu Itoi

IPC分类号： H01L23/02

CPC分类号： H01L27/14618 ,  B81B7/0077 ,  B81C2203/0109 ,  B81C2203/058 ,  H01L21/50 ,  H01L23/057 ,  H01L23/10 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L27/14683 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48997 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16195 ,  H01L2924/16788 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device including a package (2) having a plurality of wall portions (9a) and a plurality of conductor portions (4), a semiconductor element such as a solid-state image pickup device (1) mounted in an internal space of the base, thin metal wires (5) electrically connecting the semiconductor element and the conductor portions (4) between the wall portions (9a), a resin sealing material (7) implanted in the spaces between the wall portions (9a), and a closing member such as a cover glass (6). The region for connecting the thin metal wires (5) and the wall portion (9a) region overlap each other, so that the device can be reduced in size and in height. The cover glass (6) can not move easily from the correct position because the wall portions (9a) serve as supporting columns, thereby improving the yield.

摘要翻译： 一种半导体器件，包括具有多个壁部分（9a）和多个导体部分（4）的封装（2），诸如固态图像拾取器件（1）的半导体元件，其安装在 所述底座，将所述半导体元件与所述壁部（9a）之间的所述导体部（4）电连接的薄金属线（5），植入在所述壁部（9a）之间的空间中的树脂密封材料（7） 以及诸如盖玻璃（6）的封闭构件。 用于连接细金属丝（5）和壁部（9a）区域的区域彼此重叠，使得该装置的尺寸和高度可以减小。 由于壁部（9a）用作支柱，因此盖玻璃（6）不能容易地从正确的位置移动，从而提高产量。