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公开(公告)号：US20070126914A1
公开(公告)日：2007-06-07
申请号：US11585891
申请日：2006-10-25
申请人： Tomoko Komatsu , Tomoki Masuda , Yasuo Takeuchi , Nobukazu Teranishi , Yutaka Harada , Kiyokazu Itoi , Akiyoshi Kohno
发明人： Tomoko Komatsu , Tomoki Masuda , Yasuo Takeuchi , Nobukazu Teranishi , Yutaka Harada , Kiyokazu Itoi , Akiyoshi Kohno
IPC分类号： H04N5/225
CPC分类号： H01L27/14618 , H01L27/14627 , H01L2224/48091 , H01L2924/00014
摘要： A solid state imaging element including light receiving elements and microlenses is placed in a recess of a ceramic package. A black resin fills space between the ceramic package and the solid state imaging element.
摘要翻译： 包括光接收元件和微透镜的固态成像元件放置在陶瓷封装的凹部中。 黑色树脂填充陶瓷封装和固态成像元件之间的空间。
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2.发明申请Manufacturing method for a solid-state imaging apparatus, and the solid-state imaging apparatus 审中-公开固体摄像装置的制造方法以及固体摄像装置公开(公告)号：US20070200944A1
公开(公告)日：2007-08-30
申请号：US11588419
申请日：2006-10-27
申请人： Yasuo Takeuchi , Tomoko Komatsu , Nobukazu Teranishi , Tomoki Masuda , Yutaka Harada , Mituru Harada , Takashi Ohbayashi
发明人： Yasuo Takeuchi , Tomoko Komatsu , Nobukazu Teranishi , Tomoki Masuda , Yutaka Harada , Mituru Harada , Takashi Ohbayashi
CPC分类号： H01L27/14618 , H01L27/14621 , H01L27/14627 , H01L27/14636 , H01L27/14683 , H01L27/14843 , H01L2224/05554 , H01L2224/32225 , H01L2224/48091 , H01L2224/49175 , H01L2224/73265 , H01L2224/83385 , H01L2924/01019 , H01L2924/16235 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： A light receiving region 21 and a floating diffusion region 22 are formed apart from each other in a semiconductor substrate 20 (S11), translucent adhesive 31 is applied to an area corresponding to the light receiving region 21 on the semiconductor substrate 20 (S22), and a translucent plate 30 is attached to the semiconductor substrate 20 on which the translucent adhesive 31 has been applied (S23). In this semiconductor manufacturing process, before the translucent adhesive 31 is applied, a dam member 24 is formed on the semiconductor substrate 20 so as to prevent the translucent adhesive 31 from flowing into an area corresponding to the floating diffusion region 22 on the semiconductor substrate 20 (S18).
摘要翻译： 在半导体衬底20中，将光接收区域21和浮动扩散区域22彼此分开地形成（S11），半导体衬底20上的与光接收区域21相对应的区域施加半透明粘合剂31（S22） ），并且半透明板30附接到其上施加有半透明粘合剂31的半导体衬底20（S23）。 在该半导体制造工序中，在施加半透明粘接剂31之前，在半导体基板20上形成有阻挡构件24，以防止半透明粘合剂31流入与半导体基板20上的浮动扩散区域22相对应的区域 （S18）。
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公开(公告)号：US07646539B2
公开(公告)日：2010-01-12
申请号：US12401904
申请日：2009-03-11
摘要： An optical device includes a substrate, a plurality of optical elements formed in an element formation region of the substrate, a plurality of lenses formed over the element formation region so as to correspond to the plurality of optical elements, and a protective layer formed so as to cover the plurality of lenses. A holding member is formed on the protective layer in a region outside the element formation region. The holding member holds a bottom surface of a transparent member. A gap between the protective layer and the transparent member is filled with an adhesive.
摘要翻译： 光学装置包括基板，形成在基板的元件形成区域中的多个光学元件，在元件形成区域上形成为与多个光学元件对应的多个透镜，以及形成为 以覆盖多个透镜。 在元件形成区域外的区域中的保护层上形成保持构件。 保持构件保持透明构件的底面。 保护层和透明构件之间的间隙填充有粘合剂。
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公开(公告)号：US20090237796A1
公开(公告)日：2009-09-24
申请号：US12401904
申请日：2009-03-11
摘要： An optical device includes a substrate, a plurality of optical elements formed in an element formation region of the substrate, a plurality of lenses formed over the element formation region so as to correspond to the plurality of optical elements, and a protective layer formed so as to cover the plurality of lenses. A holding member is formed on the protective layer in a region outside the element formation region. The holding member holds a bottom surface of a transparent member. A gap between the protective layer and the transparent member is filled with an adhesive.
摘要翻译： 光学装置包括基板，形成在基板的元件形成区域中的多个光学元件，在元件形成区域上形成为与多个光学元件对应的多个透镜，以及形成为 以覆盖多个透镜。 在元件形成区域外的区域中的保护层上形成保持构件。 保持构件保持透明构件的底面。 保护层和透明构件之间的间隙填充有粘合剂。
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公开(公告)号：US07595540B2
公开(公告)日：2009-09-29
申请号：US11488062
申请日：2006-07-18
申请人： Toshiyuki Fukuda , Eizou Fujii , Yutaka Fukai , Yutaka Harada , Kiyokazu Itoi
发明人： Toshiyuki Fukuda , Eizou Fujii , Yutaka Fukai , Yutaka Harada , Kiyokazu Itoi
CPC分类号： H01L27/14618 , B81B7/0077 , B81C2203/0109 , B81C2203/058 , H01L21/50 , H01L23/057 , H01L23/10 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L27/14683 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48997 , H01L2224/49175 , H01L2224/73265 , H01L2224/8592 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/10253 , H01L2924/12041 , H01L2924/15153 , H01L2924/1517 , H01L2924/16195 , H01L2924/16788 , H01L2924/181 , H01L2924/19042 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/30107 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device including a package (2) having a plurality of wall portions (9a) and a plurality of conductor portions (4), a semiconductor element such as a solid-state image pickup device (1) mounted in an internal space of the base, thin metal wires (5) electrically connecting the semiconductor element and the conductor portions (4) between the wall portions (9a), a resin sealing material (7) implanted in the spaces between the wall portions (9a), and a closing member such as a cover glass (6). The region for connecting the thin metal wires (5) and the wall portion (9a) region overlap each other, so that the device can be reduced in size and in height. The cover glass (6) can not move easily from the correct position because the wall portions (9a) serve as supporting columns, thereby improving the yield.
摘要翻译： 一种半导体器件，包括具有多个壁部分（9a）和多个导体部分（4）的封装（2），诸如固态图像拾取器件（1）的半导体元件，其安装在 电连接半导体元件和壁部分之间的导体部分（4）的薄金属线（5），植入在壁部分（9a）之间的空间中的树脂密封材料（7） 诸如盖玻璃（6）的构件。 用于连接细金属丝（5）和壁部（9a）区域的区域彼此重叠，使得该装置的尺寸和高度可以减小。 由于壁部（9a）作为支柱，因此盖玻璃（6）不能容易地从正确的位置移动，从而提高产量。
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公开(公告)号：US20070018301A1
公开(公告)日：2007-01-25
申请号：US11488062
申请日：2006-07-18
申请人： Toshiyuki Fukuda , Eizou Fujii , Yutaka Fukai , Yutaka Harada , Kiyokazu Itoi
发明人： Toshiyuki Fukuda , Eizou Fujii , Yutaka Fukai , Yutaka Harada , Kiyokazu Itoi
IPC分类号： H01L23/02
CPC分类号： H01L27/14618 , B81B7/0077 , B81C2203/0109 , B81C2203/058 , H01L21/50 , H01L23/057 , H01L23/10 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L27/14683 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48997 , H01L2224/49175 , H01L2224/73265 , H01L2224/8592 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/10253 , H01L2924/12041 , H01L2924/15153 , H01L2924/1517 , H01L2924/16195 , H01L2924/16788 , H01L2924/181 , H01L2924/19042 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/30107 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device including a package (2) having a plurality of wall portions (9a) and a plurality of conductor portions (4), a semiconductor element such as a solid-state image pickup device (1) mounted in an internal space of the base, thin metal wires (5) electrically connecting the semiconductor element and the conductor portions (4) between the wall portions (9a), a resin sealing material (7) implanted in the spaces between the wall portions (9a), and a closing member such as a cover glass (6). The region for connecting the thin metal wires (5) and the wall portion (9a) region overlap each other, so that the device can be reduced in size and in height. The cover glass (6) can not move easily from the correct position because the wall portions (9a) serve as supporting columns, thereby improving the yield.
摘要翻译： 一种半导体器件，包括具有多个壁部分（9a）和多个导体部分（4）的封装（2），诸如固态图像拾取器件（1）的半导体元件，其安装在 所述底座，将所述半导体元件与所述壁部（9a）之间的所述导体部（4）电连接的薄金属线（5），植入在所述壁部（9a）之间的空间中的树脂密封材料（7） 以及诸如盖玻璃（6）的封闭构件。 用于连接细金属丝（5）和壁部（9a）区域的区域彼此重叠，使得该装置的尺寸和高度可以减小。 由于壁部（9a）用作支柱，因此盖玻璃（6）不能容易地从正确的位置移动，从而提高产量。
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公开(公告)号：US20110083322A1
公开(公告)日：2011-04-14
申请号：US12970407
申请日：2010-12-16
IPC分类号： H01R43/00
CPC分类号： H01L27/14618 , H01L24/97 , H01L27/14683 , H01L2224/48091 , H01L2224/49171 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , Y10T29/49117 , H01L2224/85 , H01L2924/00014
摘要： An optical device includes a substrate, an optical element, a translucent component, a plurality of first terminals and a sealant. The sealant is located lower than the top surface of the translucent component. The top surface of the translucent component is exposed out of the sealant, while the side surface of the translucent component is covered with the sealant.
摘要翻译： 光学装置包括基板，光学元件，半透明部件，多个第一端子和密封剂。 密封剂位于比半透明组件的顶表面更低的位置。 半透明部件的顶面从密封剂露出，而半透明部件的侧表面被密封剂覆盖。
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公开(公告)号：US20070206455A1
公开(公告)日：2007-09-06
申请号：US11708472
申请日：2007-02-21
IPC分类号： G11B7/00
CPC分类号： H01L27/14618 , H01L24/97 , H01L27/14683 , H01L2224/48091 , H01L2224/49171 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , Y10T29/49117 , H01L2224/85 , H01L2924/00014
摘要： An optical device includes a substrate, an optical element, a translucent component, a plurality of first terminals and a sealant. The sealant is located lower than the top surface of the translucent component. The top surface of the translucent component is exposed out of the sealant, while the side surface of the translucent component is covered with the sealant.
摘要翻译： 光学装置包括基板，光学元件，半透明部件，多个第一端子和密封剂。 密封剂位于比半透明组件的顶表面更低的位置。 半透明部件的顶面从密封剂露出，而半透明部件的侧表面被密封剂覆盖。
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公开(公告)号：US08137788B2
公开(公告)日：2012-03-20
申请号：US11663948
申请日：2005-09-26
CPC分类号： C08J7/047 , C08J2367/02 , C08J2433/00 , Y10T428/24355 , Y10T428/25 , Y10T428/26 , Y10T428/265 , Y10T428/269 , Y10T428/28 , Y10T428/31504 , Y10T428/31551 , Y10T428/31565 , Y10T428/31786 , Y10T428/31797 , Y10T428/31855 , Y10T428/31935
摘要： A laminated film including a thermoplastic resin film and an laminated layer that is formed on at least one side of the thermoplastic resin film and comprises (A) a composition, (B) an epoxy crosslinking agent and (C) an acrylic resin having an alkyl chain of 18 to 25 carbon atoms is characterized in that the composition (A) is a composition containing at least a polythiophene and a polyanion and/or a composition containing a polythiophene derivative and a polyanion, the laminated layer contains 15 to 100 parts by weight of the acrylic resin (C) having an alkyl chain of 18 to 25 carbon atoms based on 100 parts by weight of the sum of the composition (A) and the crosslinking agent (B) and/or its reaction product, at least one side of the laminated film has a three-dimensional average surface roughness (SRa) of 3 to 50 nm, and the laminated film contains less than 10 internal contaminant particles with an average particle size of at least 100 μm per 1 m2, so that it has high level of electrical conductivity, good releasability and water resistance, and also has oligomer precipitation-preventing properties during heating.
摘要翻译： 一种层压膜，包括热塑性树脂膜和层压层，所述层压层形成在所述热塑性树脂膜的至少一侧上，并且包含（A）组合物，（B）环氧交联剂和（C）具有烷基 18至25个碳原子的链的特征在于，组合物（A）是至少含有聚噻吩和聚阴离子的组合物和/或含有聚噻吩衍生物和聚阴离子的组合物，层叠层含有15〜100重量份 的丙烯酸树脂（C），基于100重量份的组合物（A）和交联剂（B）和/或其反应产物的总和，具有18至25个碳原子的烷基链的丙烯酸树脂（C）和/或其反应产物，至少一个侧面 层叠膜的三维平均表面粗糙度（SRa）为3〜50nm，层叠膜含有少于10个平均粒径为1m 2以上的平均粒径为100μm以上的内部污染物粒子， 高水平的el 导电性，良好的脱模性和耐水性，并且在加热时也具有低聚物防止沉淀的性质。
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公开(公告)号：US07950292B2
公开(公告)日：2011-05-31
申请号：US12447690
申请日：2007-08-03
申请人： Yutaka Harada , Ichiro Mitsutake , Kouji Okuda , Taka Inoue , Tetsuya Kajita
发明人： Yutaka Harada , Ichiro Mitsutake , Kouji Okuda , Taka Inoue , Tetsuya Kajita
摘要： In a constant current circuit, a constant current is caused to flow through a resistor, thereby causing a constant voltage to occur across the resistor. This constant voltage is then superimposed on an output signal of an operational amplifier that is to be fed back to the drain of a field effect transistor, thereby maintaining the same potential in an AC manner between the output terminal of the operational amplifier and the drain of the field effect transistor. In this way, the gate and drain of the field effect transistor is caused to exhibit the same potential in an AC manner, so that no current will occur through the stray capacitance between the gate and drain of the field effect transistor. As a result, similarly to a case of using a feedback capacitor, the input impedance of the field effect transistor can be raised.
摘要翻译： 在恒流电路中，使恒定电流流过电阻器，从而在电阻器两端产生恒定的电压。 然后将该恒定电压叠加在要反馈到场效应晶体管的漏极的运算放大器的输出信号上，从而在运算放大器的输出端和漏极之间以AC方式保持相同的电位 场效应晶体管。 以这种方式，使场效应晶体管的栅极和漏极以交流方式呈现相同的电位，使得不会通过场效应晶体管的栅极和漏极之间的杂散电容发生电流。 结果，与使用反馈电容器的情况类似，可以提高场效应晶体管的输入阻抗。
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