Bipolar transistor manufacturing method, bipolar transistor and integrated circuit
    1.
    发明授权
    Bipolar transistor manufacturing method, bipolar transistor and integrated circuit 有权
    双极晶体管制造方法,双极晶体管和集成电路

    公开(公告)号:US08686424B2

    公开(公告)日:2014-04-01

    申请号:US13616400

    申请日:2012-09-14

    IPC分类号: H01L29/72

    摘要: Disclosed is a method of manufacturing a bipolar transistor, comprising providing a substrate (10) comprising a first isolation region (12) separated from a second isolation region by an active region (11) comprising a collector impurity; forming a layer stack over said substrate, said layer stack comprising a base layer (14, 14′), a silicon capping layer (15) over said base layer and a silicon-germanium (SiGe) base contact layer (40) over said silicon capping layer; etching the SiGe base contact layer to form an emitter window (50) over the collector impurity, wherein the silicon emitter cap layer is used as etch stop layer; forming sidewall spacers (22) in the emitter window; and filling the emitter window with an emitter material (24). A bipolar transistor manufactured in accordance with this method and an IC comprising one or more of such bipolar transistors are also disclosed.

    摘要翻译: 公开了一种制造双极晶体管的方法,包括提供包括通过包括集电极杂质的有源区(11)与第二隔离区分离的第一隔离区(12)的衬底(10) 在所述衬底上形成层堆叠,所述层堆叠包括基底层(14,14'),所述基底层上的硅覆盖层(15)和位于所述硅上的硅 - 锗(SiGe)基接触层(40) 盖层; 蚀刻SiGe基极接触层以在集电极杂质上形成发射极窗口(50),其中硅发射极盖层用作蚀刻停止层; 在发射器窗口中形成侧壁间隔物(22); 以及用发射体材料(24)填充发射器窗口。 还公开了根据该方法制造的双极晶体管和包括一个或多个这样的双极晶体管的IC。

    Heterojunction bipolar transistor manufacturing method and integrated circuit comprising a heterojunction bipolar transistor
    2.
    发明授权
    Heterojunction bipolar transistor manufacturing method and integrated circuit comprising a heterojunction bipolar transistor 有权
    异质结双极晶体管制造方法和包括异质结双极晶体管的集成电路

    公开(公告)号:US08872237B2

    公开(公告)日:2014-10-28

    申请号:US13299755

    申请日:2011-11-18

    摘要: Disclosed is a method of manufacturing a heterojunction bipolar transistor comprising a substrate, an upper region of said substrate comprising an active region of the bipolar transistor bordered by shallow trench insulation, said active region comprising a buried collector region extending to a depth beyond the depth of the shallow trench insulation, the method comprising forming a trench in the substrate adjacent to said active region, said trench extending through the shallow trench insulation; at least partially filling said trench with an impurity; and forming a collector sinker in the substrate by developing said impurity to extend into the substrate to a depth beyond the depth of the shallow trench insulation. An IC comprising a heterojunction bipolar transistor manufactured by this method is also disclosed.

    摘要翻译: 公开了一种制造包括衬底的异质结双极晶体管的方法,所述衬底的上部区域包括由浅沟槽绝缘体界定的双极晶体管的有源区,所述有源区包括延伸到超过深度 所述浅沟槽绝缘体,所述方法包括在所述衬底中邻近所述有源区形成沟槽,所述沟槽延伸穿过所述浅沟槽绝缘体; 至少部分地用杂质填充所述沟槽; 以及通过使所述杂质显影而在衬底中形成收集器沉降片,以延伸到衬底中深度超过浅沟槽绝缘深度的深度。 还公开了一种包括通过该方法制造的异质结双极晶体管的IC。

    HETEROJUNCTION BIPOLAR TRANSISTOR MANUFACTURING METHOD AND INTEGRATED CIRCUIT COMPRISING A HETEROJUNCTION BIPOLAR TRANSISTOR
    3.
    发明申请
    HETEROJUNCTION BIPOLAR TRANSISTOR MANUFACTURING METHOD AND INTEGRATED CIRCUIT COMPRISING A HETEROJUNCTION BIPOLAR TRANSISTOR 有权
    异相双极晶体管制造方法和包含异相双极晶体管的集成电路

    公开(公告)号:US20120132961A1

    公开(公告)日:2012-05-31

    申请号:US13299755

    申请日:2011-11-18

    IPC分类号: H01L29/737 H01L21/328

    摘要: Disclosed is a method of manufacturing a heterojunction bipolar transistor comprising a substrate, an upper region of said substrate comprising an active region of the bipolar transistor bordered by shallow trench insulation, said active region comprising a buried collector region extending to a depth beyond the depth of the shallow trench insulation, the method comprising forming a trench in the substrate adjacent to said active region, said trench extending through the shallow trench insulation; at least partially filling said trench with an impurity; and forming a collector sinker in the substrate by developing said impurity to extend into the substrate to a depth beyond the depth of the shallow trench insulation. An IC comprising a heterojunction bipolar transistor manufactured by this method is also disclosed.

    摘要翻译: 公开了一种制造包括衬底的异质结双极晶体管的方法,所述衬底的上部区域包括由浅沟槽绝缘体界定的双极晶体管的有源区,所述有源区包括延伸到超过深度 所述浅沟槽绝缘体,所述方法包括在所述衬底中邻近所述有源区形成沟槽,所述沟槽延伸穿过所述浅沟槽绝缘体; 至少部分地用杂质填充所述沟槽; 以及通过使所述杂质显影而在衬底中形成收集器沉降片,以延伸到衬底中深度超过浅沟槽绝缘深度的深度。 还公开了一种包括通过该方法制造的异质结双极晶体管的IC。

    HETEROJUNCTION BIOPOLAR TRANSISTOR AND MANUFACTURING METHOD
    7.
    发明申请
    HETEROJUNCTION BIOPOLAR TRANSISTOR AND MANUFACTURING METHOD 有权
    异源双极晶体管和制造方法

    公开(公告)号:US20120037914A1

    公开(公告)日:2012-02-16

    申请号:US13205932

    申请日:2011-08-09

    IPC分类号: H01L29/737 H01L21/331

    摘要: A method of manufacturing a heterojunction bipolar transistor, including providing a substrate comprising an active region bordered by shallow trench insulation regions; depositing a stack of a dielectric layer and a polysilicon layer over the substrate; forming a base window in the stack, the base window extending over the active region and part of the shallow trench insulation regions, the base window having a trench extending vertically between the active region and one of the shallow trench insulation regions; growing an epitaxial base material inside the base window; forming a spacer on the exposed side walls of the base material; and filling the base window with an emitter material. A HBT manufactured in this manner and an IC including such an HBT.

    摘要翻译: 一种制造异质结双极晶体管的方法,包括提供包括由浅沟槽绝缘区域界定的有源区的衬底; 在衬底上沉积介电层和多晶硅层的堆叠; 在所述堆叠中形成基窗,所述基窗在所述有源区和所述浅沟槽绝缘区的一部分上延伸,所述基窗具有在所述有源区和所述浅沟绝缘区之间的垂直延伸的沟槽; 在基座窗内生长外延基底材料; 在基材的暴露的侧壁上形成间隔物; 并用发射体材料填充基座窗口。 以这种方式制造的HBT和包括这种HBT的IC。

    Heterojunction biopolar transistor and manufacturing method
    8.
    发明授权
    Heterojunction biopolar transistor and manufacturing method 有权
    异质结生物极晶体管及其制造方法

    公开(公告)号:US08803156B2

    公开(公告)日:2014-08-12

    申请号:US13205932

    申请日:2011-08-09

    IPC分类号: H01L29/00 H01L31/036

    摘要: A method of manufacturing a heterojunction bipolar transistor, including providing a substrate comprising an active region bordered by shallow trench insulation regions; depositing a stack of a dielectric layer and a polysilicon layer over the substrate; forming a base window in the stack, the base window extending over the active region and part of the shallow trench insulation regions, the base window having a trench extending vertically between the active region and one of the shallow trench insulation regions; growing an epitaxial base material inside the base window; forming a spacer on the exposed side walls of the base material; and filling the base window with an emitter material. A HBT manufactured in this manner and an IC including such an HBT.

    摘要翻译: 一种制造异质结双极晶体管的方法,包括提供包括由浅沟槽绝缘区域界定的有源区的衬底; 在衬底上沉积介电层和多晶硅层的堆叠; 在所述堆叠中形成基窗,所述基窗在所述有源区和所述浅沟槽绝缘区的一部分上延伸,所述基窗具有在所述有源区和所述浅沟绝缘区之间的垂直延伸的沟槽; 在基座窗内生长外延基体材料; 在基材的暴露的侧壁上形成间隔物; 并用发射体材料填充基座窗口。 以这种方式制造的HBT和包括这种HBT的IC。

    SPACER FORMATION IN THE FABRICATION OF PLANAR BIPOLAR TRANSISTORS
    10.
    发明申请
    SPACER FORMATION IN THE FABRICATION OF PLANAR BIPOLAR TRANSISTORS 有权
    平面双极晶体管制造中的间隙形成

    公开(公告)号:US20120168908A1

    公开(公告)日:2012-07-05

    申请号:US13076290

    申请日:2011-03-30

    IPC分类号: H01L29/70 H01L21/328

    摘要: A bipolar transistor is fabricated having a collector (52) in a substrate (1) and a base (57, 58) and an emitter (59) formed over the substrate. The base has a stack region (57) which is laterally separated from the emitter (59) by an electrically insulating spacer (71). The insulating spacer (71) has a width dimension at its top end at least as large as the width dimension at its bottom end and forms a Γ-shape or an oblique shape. The profile reduces the risk of silicide bridging at the top of the spacer in subsequent processing, while maintaining the width of emitter window.

    摘要翻译: 制造了在衬底(1)中具有集电体(52)和形成在衬底上的基极(57,58)和发射极(59)的双极晶体管。 底座具有通过电绝缘间隔件(71)与发射器(59)横向分开的堆叠区域(57)。 绝缘间隔件(71)的顶端的宽度尺寸至少与其底端的宽度尺寸一样大,并形成一个“G”形或一个倾斜的形状。 该轮廓降低了后续处理中间隔物顶部的硅化物桥接的风险,同时保持了发射器窗口的宽度。