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    Semiconductor device with buffer and replica circuits
    1.
    发明授权
    Semiconductor device with buffer and replica circuits 有权

    公开(公告)号：US08547138B2

    公开(公告)日：2013-10-01

    申请号：US12969030

    申请日：2010-12-15

    申请人： Toru Hatakeyama ,  Toru Ishikawa

    发明人： Toru Hatakeyama ,  Toru Ishikawa

    IPC分类号： H03K19/0175

    CPC分类号： H03K19/0027 ,  G11C5/06 ,  G11C7/1087

    摘要： A semiconductor device includes a first input buffer adjusting a logic threshold voltage, a first replica circuit, a first reference voltage generating circuit, and a first comparator circuit. The first replica circuit is identical in circuit configuration to the first input buffer. The first replica circuit has an input and an output connected to the input. The first replica circuit generates the logic threshold voltage as an output voltage. The first reference voltage generating circuit generates a first reference voltage. The first comparator circuit compares the logic threshold voltage as an output voltage of the first replica circuit to the first reference voltage to generate a first threshold adjustment signal. The first comparator circuit supplies the first threshold adjustment signal to the first input buffer and the first replica circuit. The first threshold adjustment signal allows the first input buffer to adjust the logic threshold voltage.

    Method for producing flexible circuit boards
    2.
    发明授权
    Method for producing flexible circuit boards 失效
    柔性电路板的制造方法

    公开(公告)号：US5603158A

    公开(公告)日：1997-02-18

    申请号：US554484

    申请日：1995-11-07

    申请人： Katsuhiro Murata ,  Mitsumasa Shibata ,  Toru Hatakeyama ,  Tadaaki Isono

    发明人： Katsuhiro Murata ,  Mitsumasa Shibata ,  Toru Hatakeyama ,  Tadaaki Isono

    IPC分类号： H01B5/14 ,  H01B13/00 ,  H01R11/00 ,  H01R43/00 ,  H05K1/00 ,  H05K3/24 ,  H05K3/28 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/38 ,  H05K3/02

    CPC分类号： H05K3/28 ,  H05K3/361 ,  H05K1/0393 ,  H05K2201/09881 ,  H05K2203/0723 ,  H05K3/244 ,  H05K3/323 ,  H05K3/3473 ,  H05K3/386 ,  Y10T29/49155

    摘要： An adhesive is applied onto a flexible resistive film 1 and dried to form an adhesive layer 2. A metal foil 3 is contacted onto the layer 2, which is subjected to a heat and pressing treatment. The foil 3 is polished. An ultraviolet light curable ink is applied on the foil 3 and dried to form a first layer 4. A negative film is placed on or over the layer 4 and ultraviolet light is irradiated thereto through the film so that the layer 4 is cured. Uncured portions of the layer 4 is removed so that cured portions thereof remain and the foil 3 is exposed between the remaining cured portions. The metal foil 3 is subjected to an etching treatment to remove exposed portions of the foil 3 so that unexposed portions of the foil 3 remain and form conductors 3A. The cured portions of the layer 4 is removed from the conductors 3A. A metal plating film 5 is formed on each conductor 3A to form each electrical conductive circuit 9. An ultraviolet light curable ink is applied on the layer 2 and dried to form a second layer 7. Ultraviolet light is irradiated to the layer 7 through the film 1 so that the layer 7 is cured in gaps 6 between the circuits 9. Uncured portions of the layer 7 is removed so that the circuits 9 are exposed and cured portions of the layer 7 remain in the gaps 6. The cured portions of the layer 7 is subjected to a heat treatment. The resulting flexible circuit board comprises the film 1, the adhesive layer 2, the circuits 9 and cured films 8 filling the gaps 6.

    摘要翻译： 将粘合剂施加到柔性电阻膜1上并干燥以形成粘合剂层2.金属箔3与进行热压处理的层2接触。 箔3被抛光。 将紫外光固化油墨施加在箔3上并干燥以形成第一层4.将负片放置在层4上或其上方，并通过膜照射紫外光，使得层4固化。 去除层4的未固化部分，使其固化部分保留，并且箔3暴露在剩余的固化部分之间。 对金属箔3进行蚀刻处理以去除箔3的暴露部分，使得箔3的未曝光部分保留并形成导体3A。 层4的固化部分从导体3A去除。 在每个导体3A上形成金属镀膜5以形成每个导电电路9.将紫外光固化油墨施加到层2上并干燥以形成第二层7.紫外线通过膜照射到层7 1，使得层7在电路9之间的间隙6中固化。去除层7的未固化部分，使得电路9暴露，并且层7的固化部分保留在间隙6中。层的固化部分 7进行热处理。 所得到的柔性电路板包括膜1，粘合剂层2，电路9和填充间隙6的固化膜8。