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公开(公告)号：US06281575B1
公开(公告)日：2001-08-28
申请号：US09348260
申请日：1999-07-07
申请人： Toru Nishikawa , Masahide Harada , Kaoru Katayama , Takeshi Miitsu , Takayuki Uda , Takahiro Daikoku
发明人： Toru Nishikawa , Masahide Harada , Kaoru Katayama , Takeshi Miitsu , Takayuki Uda , Takahiro Daikoku
IPC分类号： H01L2310
CPC分类号： H01L23/433 , H01L24/31 , H01L2224/16225 , H01L2224/73253 , H01L2224/73257 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/14 , H01L2924/15312 , H01L2924/16152 , H01L2224/0401
摘要： A multi-chip module is provided with a structure for disposing of a large amount of surplus solder at soldered portions. In this multi-chip module, a cooling member (structure) is soldered directly at the back side of heat generating member such as a semiconductor integrated circuit element. In order to dispose of the surplus solder, the present invention has a first metallized part formed at a cooling member which is larger than a second metallized part formed at the back side of semiconductor integrated circuit element which is solder with the first metallized part.
摘要翻译： 多芯片模块具有用于在焊接部分处设置大量剩余焊料的结构。 在该多芯片模块中，冷却构件（结构）直接焊接在诸如半导体集成电路元件的发热构件的背面。 为了配置剩余焊料，本发明具有形成在冷却部件处的第一金属化部分，其大于形成在与第一金属化部件焊接的半导体集成电路元件的背面的第二金属化部分。
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公开(公告)号：US20080284946A1
公开(公告)日：2008-11-20
申请号：US12120358
申请日：2008-05-14
申请人： Makoto ABE , Akitoyo Konno , Kaoru Katayama , Takeshi Miitsu
发明人： Makoto ABE , Akitoyo Konno , Kaoru Katayama , Takeshi Miitsu
IPC分类号： G02F1/13357 , H05B33/02
CPC分类号： G02F1/133615 , G02F2001/133612 , H01L2224/48091 , H01L2924/00014
摘要： A lighting system has light-emitting diodes as light sources mounted on a circuit board, in which the light-emitting diodes include a red light-emitting diode, blue light-emitting diode and a green light-emitting diode, the light-emitting diodes are constituted of one single unit including one for each of the red, blue and green light-emitting diodes, and the one single unit is repeatedly arranged as plural pieces on the same circuit board, and each of the red, blue and green light-emitting diodes is individually connected electrically to emit a light.
摘要翻译： 照明系统具有安装在电路板上的发光二极管，其中发光二极管包括红色发光二极管，蓝色发光二极管和绿色发光二极管，发光二极管 由包括红色，蓝色和绿色发光二极管中的每一个的单个单元构成，并且一个单一单元在同一电路板上重复布置成多个片，并且红色，蓝色和绿色发光二极管中的每一个， 发光二极管分别电连接以发光。
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公开(公告)号：US08284350B2
公开(公告)日：2012-10-09
申请号：US12120358
申请日：2008-05-14
申请人： Makoto Abe , Akitoyo Konno , Kaoru Katayama , Takeshi Miitsu
发明人： Makoto Abe , Akitoyo Konno , Kaoru Katayama , Takeshi Miitsu
IPC分类号： G02F1/1335
CPC分类号： G02F1/133615 , G02F2001/133612 , H01L2224/48091 , H01L2924/00014
摘要： A lighting system has light-emitting diodes as light sources mounted on a circuit board, in which the light-emitting diodes include a red light-emitting diode, blue light-emitting diode and a green light-emitting diode, the light-emitting diodes are constituted of one single unit including one for each of the red, blue and green light-emitting diodes, and the one single unit is repeatedly arranged as plural pieces on the same circuit board, and each of the red, blue and green light-emitting diodes is individually connected electrically to emit a light.
摘要翻译： 照明系统具有安装在电路板上的发光二极管，其中发光二极管包括红色发光二极管，蓝色发光二极管和绿色发光二极管，发光二极管 由包括红色，蓝色和绿色发光二极管中的每一个的单个单元构成，并且一个单一单元在同一电路板上重复布置成多个片，并且红色，蓝色和绿色发光二极管中的每一个， 发光二极管分别电连接以发光。
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公开(公告)号：US07401393B2
公开(公告)日：2008-07-22
申请号：US10847991
申请日：2004-05-17
CPC分类号： B23K1/018 , Y10T29/49144 , Y10T29/49149 , Y10T29/49815 , Y10T29/49822
摘要： The present invention provides a method for removing solder adhering to an LSI. In this method, a plate-shaped first member for causing molten solder to adhere thereto is mounted on top of a heater. An LSI is placed on top of the first member with the surface on which solder is attached facing downward. A second member for adding a load to the LSI is placed on top of the LSI. The heater is heated up to heat the first member and the LSI, and to melt the solder. The molten solder is transferred to the first member. A suction mechanism is positioned at a location a predetermined distance away from the top surface of the second member. The second member and the LSI are attracted by the suction mechanism, and the LSI is pulled away from the first member. The solder is thereby removed from the LSI.
摘要翻译： 本发明提供一种去除附着在LSI上的焊料的方法。 在该方法中，将用于使熔融焊料粘附到其上的板状第一构件安装在加热器的顶部。 将LSI放置在第一构件的顶部上，其上焊接有焊料的表面朝下。 用于向LSI添加负载的第二构件放置在LSI的顶部。 将加热器加热以加热第一构件和LSI，并熔化焊料。 熔融的焊料被转移到第一部件。 抽吸机构定位在距离第二构件的顶表面预定距离的位置。 第二部件和LSI被吸引机构吸引，LSI被从第一部件拉出。 从而从LSI中除去焊料。
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公开(公告)号：US06739045B2
公开(公告)日：2004-05-25
申请号：US10192478
申请日：2002-07-09
IPC分类号： H05K334
CPC分类号： B23K1/018 , Y10T29/49144 , Y10T29/49149 , Y10T29/49815 , Y10T29/49822
摘要： The present invention provides a method for removing solder adhering to an LSI. In this method, a plate-shaped first member for causing molten solder to adhere thereto is mounted on top of a heater. An LSI is placed on top of the first member with the surface on which solder is attached facing downward. A second member for adding a load to the LSI is placed on top of the LSI. The heater is heated up to heat the first member and the LSI, and to melt the solder. The molten solder is transferred to the first member. A suction mechanism is positioned at a location a predetermined distance away from the top surface of the second member. The second member and the LSI are attracted by the suction mechanism, and the LSI is pulled away from the first member. The solder is thereby removed from the LSI.
摘要翻译： 本发明提供一种去除附着在LSI上的焊料的方法。 在该方法中，将用于使熔融焊料粘附到其上的板状第一构件安装在加热器的顶部。 将LSI放置在第一构件的顶部上，其上焊接有焊料的表面朝下。 用于向LSI添加负载的第二构件放置在LSI的顶部。 将加热器加热以加热第一构件和LSI，并熔化焊料。 熔融的焊料被转移到第一部件。 抽吸机构定位在距离第二构件的顶表面预定距离的位置。 第二部件和LSI被吸引机构吸引，LSI被从第一部件拉出。 从而从LSI中除去焊料。
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公开(公告)号：US06435401B1
公开(公告)日：2002-08-20
申请号：US09618456
申请日：2000-07-18
IPC分类号： B23K1018
CPC分类号： H01L21/67259 , B23K1/018 , H01L21/681
摘要： A solder-removing apparatus includes a heating portion for heating the object having the solder adhered thereto, a measuring portion for measuring the distance from the measuring portion to the object, a solder-drawing portion for drawing the molten solder on the object by suction, an X-Y moving portion for moving the object in an X-direction or a Y-direction, a Z moving portion for moving the object relative to the solder-drawing portion in a Z-direction, and a control portion for controlling the X-Y moving portion and the Z moving portion. During the time when the molten solder on the object is drawn by the solder-drawing portion, the control portion causes the X-Y moving portion to move the object, and also causes the Z moving portion to move the object relative to the solder-drawing portion in accordance with the distance, measured by the measuring portion, so that the distance between the solder-drawing portion and the object can be kept constant.
摘要翻译： 焊料除去装置包括用于加热粘附有焊料的物体的加热部分，用于测量从测量部分到物体的距离的测量部分，用于通过抽吸将熔融焊料吸附在物体上的焊接部分， 用于在X方向或Y方向上移动物体的XY移动部分，用于沿Z方向相对于焊料牵引部移动物体的Z移动部分，以及用于控制XY移动部分的控制部分 和Z移动部分。 在物体上的熔融焊料被焊锡部分牵引的时间期间，控制部分使XY移动部分移动物体，并且还使Z移动部分相对于焊接部分移动物体 根据由测量部分测量的距离，使得焊接部分与物体之间的距离可以保持恒定。
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公开(公告)号：US20100079942A1
公开(公告)日：2010-04-01
申请号：US12426616
申请日：2009-04-20
申请人： Taku Yamamoto , Katsunari Sato , Yoshiharu Yamashita , Takeshi Miitsu , Hiroyoshi Ogura , Hiroki Hosono , Koichi Sato
发明人： Taku Yamamoto , Katsunari Sato , Yoshiharu Yamashita , Takeshi Miitsu , Hiroyoshi Ogura , Hiroki Hosono , Koichi Sato
CPC分类号： G02F1/133308 , G02F2001/133314 , G02F2201/54
摘要： The present invention provides a simply usable shield cover capable of enhancing the mechanical strength of a set even if a display device is decreased in thickness. In a video display apparatus including a base chassis on a front surface of which a displaying member is arranged and on a back surface of which a unit for driving and controlling the display device is arranged, and a plurality of frames arranged on the back surface of the base chassis in parallel with each other, a shield cover is attached to the plurality of frames to extend over those to form a crosslink structure.
摘要翻译： 本发明提供即使显示装置的厚度减小，也能够提高一组的机械强度的简单可用的屏蔽罩。 在包括在其前表面上布置有显示构件的基底框架和其背面上布置有用于驱动和控制显示装置的单元的视频显示装置中，并且布置在多个框架的背面上的多个框架 基底架彼此平行，屏蔽盖附接到多个框架以延伸到那些以形成交联结构。
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公开(公告)号：US20100053049A1
公开(公告)日：2010-03-04
申请号：US12429231
申请日：2009-04-24
申请人： Katsunari Sato , Yoshiharu Yamashita , Takeshi Miitsu , Hiroyoshi Ogura , Hiroki Hosono , Koichi Sato
发明人： Katsunari Sato , Yoshiharu Yamashita , Takeshi Miitsu , Hiroyoshi Ogura , Hiroki Hosono , Koichi Sato
IPC分类号： G09G3/36
CPC分类号： G02F1/133308 , G02F1/133615 , G02F2001/133317 , G02F2001/133325 , G02F2001/133328
摘要： A liquid crystal display has a liquid crystal panel, a gate chip on film (COF) disposed at a side of a side surface of the liquid crystal panel, side-edge-type backlights having a light emitting diode disposed on left and right side surfaces of the liquid crystal panel, and a cover and a frame that hold the liquid crystal panel and the backlights, the frame has an opening disposed at a position corresponding to the position of the gate COF into which the gate COF is inserted, and a lid for covering the gate COF inserted in the opening is connected to the frame in such a manner that the lid is capable of being opened and closed.
摘要翻译： 液晶显示器具有液晶面板，设置在液晶面板侧面的膜（COF）上的栅极芯片，具有设置在左右侧面的发光二极管的侧边型背光源 以及保持液晶面板和背光灯的盖和框架，框架具有设置在与对应于门COF插入的门COF的位置对应的位置的开口，盖子 用于覆盖插入开口中的门COF以能够打开和关闭盖的方式连接到框架。
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公开(公告)号：US08188967B2
公开(公告)日：2012-05-29
申请号：US12429231
申请日：2009-04-24
申请人： Katsunari Sato , Yoshiharu Yamashita , Takeshi Miitsu , Hiroyoshi Ogura , Hiroki Hosono , Koichi Sato
发明人： Katsunari Sato , Yoshiharu Yamashita , Takeshi Miitsu , Hiroyoshi Ogura , Hiroki Hosono , Koichi Sato
IPC分类号： G09G3/36
CPC分类号： G02F1/133308 , G02F1/133615 , G02F2001/133317 , G02F2001/133325 , G02F2001/133328
摘要： A liquid crystal display has a liquid crystal panel, a gate chip on film (COF) disposed at a side of a side surface of the liquid crystal panel, side-edge-type backlights having a light emitting diode disposed on left and right side surfaces of the liquid crystal panel, and a cover and a frame that hold the liquid crystal panel and the backlights, the frame has an opening disposed at a position corresponding to the position of the gate COF into which the gate COF is inserted, and a lid for covering the gate COF inserted in the opening is connected to the frame in such a manner that the lid is capable of being opened and closed.
摘要翻译： 液晶显示器具有液晶面板，设置在液晶面板侧面的膜（COF）上的栅极芯片，具有设置在左右侧面的发光二极管的侧边型背光源 以及保持液晶面板和背光灯的盖和框架，框架具有设置在与对应于门COF插入的门COF的位置对应的位置的开口，盖子 用于覆盖插入开口中的门COF以能够打开和关闭盖的方式连接到框架。
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公开(公告)号：US08159629B2
公开(公告)日：2012-04-17
申请号：US12473459
申请日：2009-05-28
申请人： Yoshiharu Yamashita , Akitoshi Morishima , Katsunari Sato , Noriyo Nishijima , Shigeo Ohashi , Takeshi Miitsu , Hiroyoshi Ogura , Hiroki Hosono , Koichi Sato
发明人： Yoshiharu Yamashita , Akitoshi Morishima , Katsunari Sato , Noriyo Nishijima , Shigeo Ohashi , Takeshi Miitsu , Hiroyoshi Ogura , Hiroki Hosono , Koichi Sato
IPC分类号： G02F1/1333 , G02F1/1335
CPC分类号： G02B6/0085 , G02B6/0031 , G02B6/0073
摘要： There is provided a slim liquid crystal display unit having a large screen by providing a slim structure capable of sufficiently radiating the heat from a light source. The liquid crystal display unit according to the present invention includes: a liquid crystal panel; an optical guiding board installed on a rear face thereof; a pair of light source-mounted substrate disposed, opposing right and left side faces thereof; a light source mounted on the light source-mounted substrate; a metal frame connected on the opposite side to the optical guiding board of the light source-mounted substrate; a chassis member for supporting the optical guiding board and a reflection sheet group; and a thermal diffusion member fixed onto the metal frame along with the chassis member. The chassis member has a stepped portion in the vicinity of the light source. Between the stepped portion and the reflection sheet group, a thermal insulation member is attached.
摘要翻译： 通过提供能够充分地辐射来自光源的热量的纤细结构，提供了具有大屏幕的薄型液晶显示单元。 根据本发明的液晶显示单元包括：液晶面板; 安装在其后表面上的光导板; 一对光源安装基板，设置在其相对的左右侧面上; 安装在光源安装基板上的光源; 连接在与光源安装基板的光导板相反的一侧的金属框架; 用于支撑导光板的底盘部件和反射片组; 以及与所述底座部件一起固定在所述金属框架上的热扩散部件。 底盘部件在光源附近具有阶梯部。 在阶梯部和反射片组之间，安装有隔热构件。
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