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公开(公告)号：US06281575B1
公开(公告)日：2001-08-28
申请号：US09348260
申请日：1999-07-07
申请人： Toru Nishikawa , Masahide Harada , Kaoru Katayama , Takeshi Miitsu , Takayuki Uda , Takahiro Daikoku
发明人： Toru Nishikawa , Masahide Harada , Kaoru Katayama , Takeshi Miitsu , Takayuki Uda , Takahiro Daikoku
IPC分类号： H01L2310
CPC分类号： H01L23/433 , H01L24/31 , H01L2224/16225 , H01L2224/73253 , H01L2224/73257 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/14 , H01L2924/15312 , H01L2924/16152 , H01L2224/0401
摘要： A multi-chip module is provided with a structure for disposing of a large amount of surplus solder at soldered portions. In this multi-chip module, a cooling member (structure) is soldered directly at the back side of heat generating member such as a semiconductor integrated circuit element. In order to dispose of the surplus solder, the present invention has a first metallized part formed at a cooling member which is larger than a second metallized part formed at the back side of semiconductor integrated circuit element which is solder with the first metallized part.
摘要翻译： 多芯片模块具有用于在焊接部分处设置大量剩余焊料的结构。 在该多芯片模块中，冷却构件（结构）直接焊接在诸如半导体集成电路元件的发热构件的背面。 为了配置剩余焊料，本发明具有形成在冷却部件处的第一金属化部分，其大于形成在与第一金属化部件焊接的半导体集成电路元件的背面的第二金属化部分。
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公开(公告)号：US20080284946A1
公开(公告)日：2008-11-20
申请号：US12120358
申请日：2008-05-14
申请人： Makoto ABE , Akitoyo Konno , Kaoru Katayama , Takeshi Miitsu
发明人： Makoto ABE , Akitoyo Konno , Kaoru Katayama , Takeshi Miitsu
IPC分类号： G02F1/13357 , H05B33/02
CPC分类号： G02F1/133615 , G02F2001/133612 , H01L2224/48091 , H01L2924/00014
摘要： A lighting system has light-emitting diodes as light sources mounted on a circuit board, in which the light-emitting diodes include a red light-emitting diode, blue light-emitting diode and a green light-emitting diode, the light-emitting diodes are constituted of one single unit including one for each of the red, blue and green light-emitting diodes, and the one single unit is repeatedly arranged as plural pieces on the same circuit board, and each of the red, blue and green light-emitting diodes is individually connected electrically to emit a light.
摘要翻译： 照明系统具有安装在电路板上的发光二极管，其中发光二极管包括红色发光二极管，蓝色发光二极管和绿色发光二极管，发光二极管 由包括红色，蓝色和绿色发光二极管中的每一个的单个单元构成，并且一个单一单元在同一电路板上重复布置成多个片，并且红色，蓝色和绿色发光二极管中的每一个， 发光二极管分别电连接以发光。
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公开(公告)号：US08284350B2
公开(公告)日：2012-10-09
申请号：US12120358
申请日：2008-05-14
申请人： Makoto Abe , Akitoyo Konno , Kaoru Katayama , Takeshi Miitsu
发明人： Makoto Abe , Akitoyo Konno , Kaoru Katayama , Takeshi Miitsu
IPC分类号： G02F1/1335
CPC分类号： G02F1/133615 , G02F2001/133612 , H01L2224/48091 , H01L2924/00014
摘要： A lighting system has light-emitting diodes as light sources mounted on a circuit board, in which the light-emitting diodes include a red light-emitting diode, blue light-emitting diode and a green light-emitting diode, the light-emitting diodes are constituted of one single unit including one for each of the red, blue and green light-emitting diodes, and the one single unit is repeatedly arranged as plural pieces on the same circuit board, and each of the red, blue and green light-emitting diodes is individually connected electrically to emit a light.
摘要翻译： 照明系统具有安装在电路板上的发光二极管，其中发光二极管包括红色发光二极管，蓝色发光二极管和绿色发光二极管，发光二极管 由包括红色，蓝色和绿色发光二极管中的每一个的单个单元构成，并且一个单一单元在同一电路板上重复布置成多个片，并且红色，蓝色和绿色发光二极管中的每一个， 发光二极管分别电连接以发光。
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公开(公告)号：US07401393B2
公开(公告)日：2008-07-22
申请号：US10847991
申请日：2004-05-17
CPC分类号： B23K1/018 , Y10T29/49144 , Y10T29/49149 , Y10T29/49815 , Y10T29/49822
摘要： The present invention provides a method for removing solder adhering to an LSI. In this method, a plate-shaped first member for causing molten solder to adhere thereto is mounted on top of a heater. An LSI is placed on top of the first member with the surface on which solder is attached facing downward. A second member for adding a load to the LSI is placed on top of the LSI. The heater is heated up to heat the first member and the LSI, and to melt the solder. The molten solder is transferred to the first member. A suction mechanism is positioned at a location a predetermined distance away from the top surface of the second member. The second member and the LSI are attracted by the suction mechanism, and the LSI is pulled away from the first member. The solder is thereby removed from the LSI.
摘要翻译： 本发明提供一种去除附着在LSI上的焊料的方法。 在该方法中，将用于使熔融焊料粘附到其上的板状第一构件安装在加热器的顶部。 将LSI放置在第一构件的顶部上，其上焊接有焊料的表面朝下。 用于向LSI添加负载的第二构件放置在LSI的顶部。 将加热器加热以加热第一构件和LSI，并熔化焊料。 熔融的焊料被转移到第一部件。 抽吸机构定位在距离第二构件的顶表面预定距离的位置。 第二部件和LSI被吸引机构吸引，LSI被从第一部件拉出。 从而从LSI中除去焊料。
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公开(公告)号：US06739045B2
公开(公告)日：2004-05-25
申请号：US10192478
申请日：2002-07-09
IPC分类号： H05K334
CPC分类号： B23K1/018 , Y10T29/49144 , Y10T29/49149 , Y10T29/49815 , Y10T29/49822
摘要： The present invention provides a method for removing solder adhering to an LSI. In this method, a plate-shaped first member for causing molten solder to adhere thereto is mounted on top of a heater. An LSI is placed on top of the first member with the surface on which solder is attached facing downward. A second member for adding a load to the LSI is placed on top of the LSI. The heater is heated up to heat the first member and the LSI, and to melt the solder. The molten solder is transferred to the first member. A suction mechanism is positioned at a location a predetermined distance away from the top surface of the second member. The second member and the LSI are attracted by the suction mechanism, and the LSI is pulled away from the first member. The solder is thereby removed from the LSI.
摘要翻译： 本发明提供一种去除附着在LSI上的焊料的方法。 在该方法中，将用于使熔融焊料粘附到其上的板状第一构件安装在加热器的顶部。 将LSI放置在第一构件的顶部上，其上焊接有焊料的表面朝下。 用于向LSI添加负载的第二构件放置在LSI的顶部。 将加热器加热以加热第一构件和LSI，并熔化焊料。 熔融的焊料被转移到第一部件。 抽吸机构定位在距离第二构件的顶表面预定距离的位置。 第二部件和LSI被吸引机构吸引，LSI被从第一部件拉出。 从而从LSI中除去焊料。
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公开(公告)号：US06435401B1
公开(公告)日：2002-08-20
申请号：US09618456
申请日：2000-07-18
IPC分类号： B23K1018
CPC分类号： H01L21/67259 , B23K1/018 , H01L21/681
摘要： A solder-removing apparatus includes a heating portion for heating the object having the solder adhered thereto, a measuring portion for measuring the distance from the measuring portion to the object, a solder-drawing portion for drawing the molten solder on the object by suction, an X-Y moving portion for moving the object in an X-direction or a Y-direction, a Z moving portion for moving the object relative to the solder-drawing portion in a Z-direction, and a control portion for controlling the X-Y moving portion and the Z moving portion. During the time when the molten solder on the object is drawn by the solder-drawing portion, the control portion causes the X-Y moving portion to move the object, and also causes the Z moving portion to move the object relative to the solder-drawing portion in accordance with the distance, measured by the measuring portion, so that the distance between the solder-drawing portion and the object can be kept constant.
摘要翻译： 焊料除去装置包括用于加热粘附有焊料的物体的加热部分，用于测量从测量部分到物体的距离的测量部分，用于通过抽吸将熔融焊料吸附在物体上的焊接部分， 用于在X方向或Y方向上移动物体的XY移动部分，用于沿Z方向相对于焊料牵引部移动物体的Z移动部分，以及用于控制XY移动部分的控制部分 和Z移动部分。 在物体上的熔融焊料被焊锡部分牵引的时间期间，控制部分使XY移动部分移动物体，并且还使Z移动部分相对于焊接部分移动物体 根据由测量部分测量的距离，使得焊接部分与物体之间的距离可以保持恒定。
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公开(公告)号：US06590097B1
公开(公告)日：2003-07-08
申请号：US09913599
申请日：2001-08-16
申请人： Takeshi Sakai , Hitomi Kimura , Kaoru Kojima , Kaoru Katayama , Kazuo Shimanaka , Katsushige Ikai , Ikunoshin Kato
发明人： Takeshi Sakai , Hitomi Kimura , Kaoru Kojima , Kaoru Katayama , Kazuo Shimanaka , Katsushige Ikai , Ikunoshin Kato
IPC分类号： C08B3700
CPC分类号： C08B37/006 , C12N9/2402 , C12P19/04
摘要： Sulfated fucogalactan or its salt useful as a reagent for sugar chain engineering or an HGF-production inducer; a degraded product or its salt obtained by treating the sulfated fucogalactan with a sulfated fucogalactan digesting enzyme; the sulfated fucogalactan digesting enzyme useful in sugar chain engineering; a process for producing the degraded product by treating sulfated fucogalactan or its salt with the above enzyme; and a process for producing the sulfated fucogalactan digesting enzyme.
摘要翻译： 硫酸化的赖卡半乳糖或其盐可用作糖链工程或HGF生产诱导剂的试剂; 通过用硫酸化的福卡美凝乳消化酶处理硫酸化的核糖乳聚糖获得的降解产物或其盐; 用于糖链工程的硫酸岩藻糖半乳糖消化酶; 通过用上述酶处理硫酸化的赖氨酰半乳糖或其盐来生产降解产物的方法; 以及生产硫酸化的赖卡半乳聚糖消化酶的方法。
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8.发明授权Method and apparatus for producing reference image in glass bottle inspecting apparatus 失效玻璃瓶检验仪器参考图像制作方法及装置公开(公告)号：US07330251B2
公开(公告)日：2008-02-12
申请号：US10531535
申请日：2002-10-18
申请人： Kaoru Katayama , Toru Ishikura , Hiroyuki Fukuchi
发明人： Kaoru Katayama , Toru Ishikura , Hiroyuki Fukuchi
IPC分类号： G01N21/88
CPC分类号： G06K9/6255 , G01N21/8903 , G01N21/896 , G01N21/9054 , G01N21/93 , G01N2021/1776 , G01N2021/8455 , G01N2021/8887 , G06T7/001
摘要： The present invention relates to a method and apparatus for producing a reference image (template) used in a glass bottle inspecting apparatus for detecting a defect at a specific location of a bottle-mouth portion and the like of a glass bottle, and used for being compared with the image obtained from the glass bottle to be inspected in the inspecting apparatus. According to a method of producing a reference image of the present invention, plural images are formed by using a CCD camera to image a plurality of glass bottles as samples which may contain defective glass bottles, and a reference image is provided from the obtained plural images, a range of brightness when light is applied to a non-defective glass bottle being specified in said reference image.
摘要翻译： 本发明涉及一种用于检测玻璃瓶检查装置的参考图像（模板）的方法和装置，用于检测玻璃瓶的瓶口部等的特定位置处的缺陷，并用于 与在检查装置中检查的玻璃瓶获得的图像相比。 根据本发明的参考图像的制造方法，通过使用CCD照相机形成多个图像，将多个玻璃瓶作为可能含有有缺陷的玻璃瓶的样品成像，并且从所获得的多个图像中提供参考图像 当在所述参考图像中指定的光被施加到无缺陷玻璃瓶时的亮度范围。
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公开(公告)号：US07329855B2
公开(公告)日：2008-02-12
申请号：US10531521
申请日：2002-10-18
CPC分类号： G01N21/9054
摘要： A glass bottle inspecting apparatus is presented which can detect a defect at a specific location of a bottle-mouth portion of a glass bottle. An inspecting apparatus detects a defect of a glass bottle by imaging light from the glass bottle while the glass bottle (2) is illuminated and rotated, and processes the obtained image. A glass bottle inspecting apparatus includes a lighting device (7) disposed at a predetermined position with respect to the glass bottle, a plurality of CCD cameras (11-20) disposed around the glass bottle for imaging a specific part of the glass bottle, an angle detection device (10) for detecting a rotation angle of the glass bottle with respect to a reference position, and an image processor (8) for processing the images obtained by the CCD cameras. The image processor stores rotation angle information detected by the angle detection device in such a manner that the rotation angle information corresponds to the image imaged by each of the CCD cameras.
摘要翻译： 本发明提供一种玻璃瓶检查装置，其能够检测玻璃瓶的瓶口部的特定位置处的缺陷。 检查装置通过在玻璃瓶（2）被照亮和旋转时对来自玻璃瓶的光进行成像来检测玻璃瓶的缺陷，并处理所获得的图像。 玻璃瓶检查装置包括：设置在相对于玻璃瓶的预定位置的照明装置（7），设置在玻璃瓶周围的多个CCD照相机（11-20），用于对玻璃瓶的特定部分进行成像; 角度检测装置（10），用于检测玻璃瓶相对于基准位置的旋转角度;以及图像处理器（8），用于处理由CCD照相机获得的图像。 图像处理器存储由角度检测装置检测的旋转角度信息，使得旋转角度信息对应于由每个CCD照相机成像的图像。
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公开(公告)号：US06795105B2
公开(公告)日：2004-09-21
申请号：US10095577
申请日：2002-03-13
IPC分类号： B41J245
CPC分类号： B41M5/262 , B41M5/26 , H05K1/0266
摘要： A laser printing apparatus is formed by a laser oscillator 10, galvano mirrors 42, 44 for scanning the laser light emitted from the laser oscillator 10, and an f&thgr; lens 40 for focusing the laser light emitted from the laser oscillator 10 on MCCs 32, 34 serving as the member to be printed. The laser oscillator 10 is an YLF laser oscillator which emits the laser light of the third harmonics in the ultraviolet range. The laser printing is performed on the MCCs 32, 34 serving as the member to be printed by using the laser light emitted from the laser oscillator 10.
摘要翻译： 激光打印装置由激光振荡器10，用于扫描从激光振荡器10发射的激光的电流镜42,44以及用于将从激光振荡器10发射的激光聚焦在MCC32,34上的焦距透镜40 作为要印刷的成员。 激光振荡器10是发射紫外线范围内的三次谐波的激光的YLF激光振荡器。 通过使用从激光振荡器10发射的激光，作为要打印的构件的MCC 32,34进行激光打印。
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