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公开(公告)号：US5639699A
公开(公告)日：1997-06-17
申请号：US420153
申请日：1995-04-11
申请人： Hiroko Nakamura , Haruki Komano , Kazuyoshi Sugihara , Keiji Horioka , Mitsuyo Kariya , Soichi Inoue , Ichiro Mori , Katsuya Okumura , Tadahiro Takigawa , Toru Watanabe , Motosuke Miyoshi , Yuichiro Yamazaki , Haruo Okano
发明人： Hiroko Nakamura , Haruki Komano , Kazuyoshi Sugihara , Keiji Horioka , Mitsuyo Kariya , Soichi Inoue , Ichiro Mori , Katsuya Okumura , Tadahiro Takigawa , Toru Watanabe , Motosuke Miyoshi , Yuichiro Yamazaki , Haruo Okano
CPC分类号： G03F1/74 , B05D5/005 , C23C16/047 , G03F1/26
摘要： According to this invention, there is provided a method of repairing a bump defect of a structure obtained by forming a predetermined pattern on a substrate, having the steps of forming a first thin film consisting of a material different from that of the substrate on the substrate around the bump defect or close to the bump defect, forming a second thin film on the bump defect and the first thin film to flatten an upper surface of the second thin film, performing simultaneous removal of the bump defect and the thin films on an upper portion of the projecting defect and around the bump defect using a charged particle beam, and performing removal of the thin films left in the step of performing simultaneous removal. According to this invention, there is provided to a method of repairing a divot defect of a structure obtained by forming a predetermined pattern on a substrate, having the steps of burying a material in the divot defect and forming a projecting portion projecting from a substrate surface, covering a region including the projecting portion with flattening films consisting of a material different from that of the substrate to flatten an upper surface of the region, performing simultaneous removal of the projecting portion and the flattening films around the projecting portion using a charged particle beam, and performing removal of the flattening films left in the step of performing simultaneous removal.
摘要翻译： 根据本发明，提供了一种修复通过在基板上形成预定图案而获得的结构的凸点缺陷的方法，该方法具有以下步骤：在基板上形成由不同于基板的材料构成的第一薄膜 在凸起缺陷附近或接近凸块缺陷的情况下，在凸起缺陷上形成第二薄膜和使第一薄膜平坦化第二薄膜的上表面，同时去除凸起缺陷和上部的薄膜 使用带电粒子束的突出缺陷的一部分和凸起缺陷周围，并且执行在执行同时移除的步骤中留下的薄膜的去除。 根据本发明，提供了一种修复通过在基板上形成预定图案而获得的结构的凹陷缺陷的方法，该方法具有以下步骤：将材料埋在凹陷缺陷中并形成从基板表面突出的突出部分 使用由与基板不同的材料构成的平坦化膜覆盖包括突出部分的区域，以平坦化该区域的上表面，使用带电粒子束同时移除突出部分周围的突出部分和平坦化膜 并且执行在执行同时去除的步骤中留下的平坦化膜的去除。
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公开(公告)号：US5429730A
公开(公告)日：1995-07-04
申请号：US144414
申请日：1993-11-02
申请人： Hiroko Nakamura , Haruki Komano , Kazuyoshi Sugihara , Keiji Horioka , Mitsuyo Kariya , Soichi Inoue , Ichiro Mori , Katsuya Okumura , Tadahiro Takigawa , Toru Watanabe , Motosuke Miyoshi , Yuichiro Yamazaki , Haruo Okano
发明人： Hiroko Nakamura , Haruki Komano , Kazuyoshi Sugihara , Keiji Horioka , Mitsuyo Kariya , Soichi Inoue , Ichiro Mori , Katsuya Okumura , Tadahiro Takigawa , Toru Watanabe , Motosuke Miyoshi , Yuichiro Yamazaki , Haruo Okano
CPC分类号： G03F1/74 , B05D5/005 , C23C16/047 , G03F1/26
摘要： According to this invention, there is provided a method of repairing a bump defect of a structure obtained by forming a predetermined pattern on a substrate, having the steps of forming a first thin film consisting of a material different from that of the substrate on the substrate around the bump defect or close to the bump defect, forming a second thin film on the bump defect and the first thin film to flatten an upper surface of the second thin film, performing simultaneous removal of the bump defect and the thin films on an upper portion of the projecting defect and around the bump defect using a charged particle beam, and performing removal of the thin films left in the step of performing simultaneous removal.
摘要翻译： 根据本发明，提供了一种修复通过在基板上形成预定图案而获得的结构的凸点缺陷的方法，该方法具有以下步骤：在基板上形成由不同于基板的材料构成的第一薄膜 在凸起缺陷附近或接近凸块缺陷的情况下，在凸起缺陷上形成第二薄膜和使第一薄膜平坦化第二薄膜的上表面，同时去除凸起缺陷和上部的薄膜 使用带电粒子束的突出缺陷的一部分和凸起缺陷周围，并且执行在执行同时移除的步骤中留下的薄膜的去除。
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3.发明授权Exposure mask, exposure mask substrate, method for fabricating the same, and method for forming pattern based on exposure mask 失效曝光掩模，曝光掩模基板，其制造方法以及基于曝光掩模形成图案的方法
公开(公告)号：US5620815A
公开(公告)日：1997-04-15
申请号：US471782
申请日：1995-06-06
申请人： Shinichi Ito , Haruo Okano , Toru Watanabe , Katsuya Okumura
发明人： Shinichi Ito , Haruo Okano , Toru Watanabe , Katsuya Okumura
摘要： An exposure mask having an excellent alignment accuracy between patterns, which is prepared by first forming on a light transmissive substrate a light shielding film or a semi-transparent film pattern (first pattern) somewhat larger than a desired dimension, forming thereon a semi-transparent film or a light transmissive film pattern (second pattern) so as to include all patterns of the desired dimensions made up of a light shielding part, a semi-transparent part and a light transmissive part, and then removing a projected part of the first pattern with use of the second pattern as a mask.The semi-transparent film is formed of at least two layers each of which contains a common element, thus the semi-transparent film can be made with use of the same apparatus and when patterning, etching process can be carried out with use of the same etchant.Further, since in a mask including the semi-transparent pattern, at least that area of a non-pattern zone where light reaches a wafer through the transfer, acts to shield the exposure light, too narrowed pattern or insufficient focal depth can be prevented.
摘要翻译： 通过首先在透光性基板上形成稍大于所需尺寸的遮光膜或半透明膜图案（第一图案）而制成的图案之间具有优异的取向精度的曝光掩模，在其上形成半透明 膜或透光膜图案（第二图案），以便包括由遮光部分，半透明部分和透光部分组成的所需尺寸的所有图案，然后去除第一图案的突出部分 使用第二种图案作为掩模。 半透明膜由至少两层形成，每层均含有共同的元素，因此可以使用相同的装置制造半透明膜，并且当图案化时，可以使用它们进行蚀刻工艺 蚀刻剂 此外，由于在包括半透明图案的掩模中，至少通过转印光到达晶片的非图案区域的面积起到屏蔽曝光光的作用，可以防止太窄的图案或不充分的焦深。
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公开(公告)号：US5536603A
公开(公告)日：1996-07-16
申请号：US359547
申请日：1994-12-20
摘要： A photoresist pattern is formed on a quartz substrate. The quartz substrate is dipped into a silicon oxide supersaturated solution of hydrofluoric acid, and a silicon oxide is precipitated out of the supersaturated solution, thereby forming an SiO.sub.2 film on that exposed surface of the quartz substrate which is not covered with the photoresist pattern. After that, the photoresist pattern is ashed by oxygen plasma, and the ashed pattern is removed. The SiO.sub.2 film remaining on the quartz substrate serves as a phase shifter.
摘要翻译： 光刻胶图案形成在石英基片上。 将石英衬底浸入氢氟酸的氧化硅过饱和溶液中，从过饱和溶液中沉淀出氧化硅，由此在未被光致抗蚀剂图案覆盖的石英衬底的暴露表面上形成SiO 2膜。 之后，通过氧等离子体将光致抗蚀剂图案灰化，除去灰化图案。 保留在石英衬底上的SiO 2膜用作移相器。
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5.发明授权Semiconductor device with a dual damascene type via contact structure and method for the manufacture of same 失效具有双镶嵌型通孔接触结构的半导体器件及其制造方法公开(公告)号：US06433428B1
公开(公告)日：2002-08-13
申请号：US09086958
申请日：1998-05-29
申请人： Toru Watanabe , Katsuya Okumura
发明人： Toru Watanabe , Katsuya Okumura
IPC分类号： H01L2348
CPC分类号： H01L21/76847 , H01L21/76805 , H01L21/76807 , H01L21/76877 , H01L21/76882 , H01L23/53214 , H01L23/53257 , H01L2924/0002 , H01L2924/00
摘要： The via contact structure is rendered into a dual damascene type via contact structure having a wide groove and a via contact hole lying below the wide groove, and the interior of the lower via contact hole is filled up with a filling material composed of tungsten, while, the interior of the upper groove is filled up with aluminum. Since the interior of the lower via contact hole is thus filled up with a filling material comprising tungsten, aluminum which has a low reflowability may be used only in the upper groove. As for the filling material for filling up the wide groove, the wide groove can be filled up sufficiently well even with aluminum which is not high in reflowability. By combining the filling of the via contact hole with tungsten and the filling of the groove with aluminum as mentioned above, a via contact filling with a high aspect ratio can be realized. Further, the problem or drawback that, at the time of forming the second metal wiring layer, the first metal wiring layer may be melted due to the high-temperature heat treatment performed for depositing the metal material is eliminated, and thus, it becomes possible to realize a dual damascene type via contact structure which can be applied to a multi-layer wiring structure.
摘要翻译： 通孔接触结构被制成具有宽槽的通孔接触结构和位于宽槽下方的通孔接触孔的双镶嵌型通孔接触结构，并且下通孔接触孔的内部填充有由钨构成的填充材料，同时 ，上槽的内部填充有铝。 由于下通孔接触孔的内部填充有包含钨的填充材料，所以具有低回流性的铝可以仅在上槽中使用。 对于用于填充宽槽的填充材料，即使使用不可回流的铝的情况下，也可以充分地填充宽槽。 通过将通孔接触孔的填充与钨结合，并且如上所述用铝填充槽，可以实现填充高纵横比的通孔接头。 此外，在形成第二金属布线层时，第一金属布线层由于进行用于沉积金属材料的高温热处理而可能熔化的问题和缺陷被消除，因此， 实现可以应用于多层布线结构的双镶嵌型通孔接触结构。
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公开(公告)号：US5679484A
公开(公告)日：1997-10-21
申请号：US757957
申请日：1996-11-25
申请人： Shinichi Ito , Haruo Okano , Toru Watanabe , Katsuya Okumura
发明人： Shinichi Ito , Haruo Okano , Toru Watanabe , Katsuya Okumura
摘要： An exposure mask having an excellent alignment accuracy between patterns, which is prepared by first forming on a light transmissive substrate a light shielding film or a semi-transparent film pattern (first pattern) somewhat larger than a desired dimension, forming thereon a semi-transparent film or a light transmissive film pattern (second pattern) so as to include all patterns of the desired dimensions made up of a light shielding part, a semi-transparent part and a light transmissive part, and then removing a projected part of the first pattern with use of the second pattern as a mask. The semi-transparent film is formed of at least two layers each of which contains a common element, thus the semi-transparent film can be made with use of the same apparatus and when patterning, etching process can be carried out with use of the same etchant. Further, since in a mask including the semi-transparent pattern, at least that area of a non-pattern zone where light reaches a wafer through the transfer, acts to shield the exposure light, too narrowed pattern or insufficient focal depth can be prevented.
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7.发明授权Apparatus for evaluating characteristics of semiconductor device and method of evaluating characteristics of semiconductor device using the same 失效用于评估半导体器件的特性的装置和使用其的半导体器件的特性评估方法
公开(公告)号：US5491425A
公开(公告)日：1996-02-13
申请号：US215774
申请日：1994-03-22
申请人： Toru Watanabe , Yuri Yonekura , Katsuya Okumura
发明人： Toru Watanabe , Yuri Yonekura , Katsuya Okumura
CPC分类号： G01R1/06783
摘要： A probe is attached to a support plate vertically to the surface of the support plate. A drop of a molten metal is formed at a tip portion of the probe. The support plate has a heater for setting the temperature of the probe and the drop of the molten metal at the tip portion of the probe. The probe is situated at a position corresponding to a position of an electrode of an LSI. The probe is connected to a measuring device for evaluating characteristics of the LSI by wiring. The drop of the molten metal connects the probe and the electrode of the LSI electrically.
摘要翻译： 探针垂直于支撑板的表面附接到支撑板。 在探针的尖端处形成一滴熔融金属。 支撑板具有用于将探针的温度和熔融金属的液滴设置在探针的尖端部分的加热器。 探针位于与LSI的电极的位置对应的位置。 探头连接到用于通过布线评估LSI的特性的测量装置。 熔融金属液滴将探针和LSI的电极电连接。
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公开(公告)号：US06124189A
公开(公告)日：2000-09-26
申请号：US818079
申请日：1997-03-14
申请人： Toru Watanabe , Katsuya Okumura , Katsuhiko Hieda
发明人： Toru Watanabe , Katsuya Okumura , Katsuhiko Hieda
IPC分类号： H01L29/78 , H01L21/336 , H01L21/768 , H01L21/8234 , H01L27/088 , H01L21/3205
CPC分类号： H01L29/6659 , H01L21/768 , H01L29/66545
摘要： A method for forming a metal-strapped polysilicon gate and for simultaneously forming a strapped-metal polysilicon gate and a metal contact filling includes the steps of forming a gate dielectric layer on a surface of a silicon substrate; forming a polysilicon layer on the gate dielectric layer; forming a first insulating layer on the polysilicon layer; forming insulating spacers on either side of the polysilicon layer and the first insulating layer; and forming ion implantation regions in the surface of the silicon substrate. Next, a second insulating layer is deposited on the silicon substrate, and the second insulating layer is polished using chemical mechanical polishing to planarize the upper surface of the second insulating layer with the upper surface of the first insulating layer as a polishing stopper. Then, a contact hole is formed in the second insulating film, wherein the contact hole is laterally spaced from the polysilicon layer and the first insulating layer. Subsequent steps include: removing the first insulating layer, thereby forming an unfilled region above the polysilicon layer; depositing a metal such as tungsten in the unfilled region and the contact hole; and polishing the deposited metal layer to planarize the upper surface of the metal with the upper surface of the second insulating layer.
摘要翻译： 用于形成金属带状多晶硅栅极并用于同时形成带状金属多晶硅栅极和金属接触填充的方法包括以下步骤：在硅衬底的表面上形成栅极电介质层; 在栅介质层上形成多晶硅层; 在所述多晶硅层上形成第一绝缘层; 在所述多晶硅层和所述第一绝缘层的任一侧上形成绝缘间隔物; 以及在所述硅衬底的表面中形成离子注入区。 接下来，在硅衬底上沉积第二绝缘层，并且使用化学机械抛光来抛光第二绝缘层，以使第二绝缘层的上表面与第一绝缘层的上表面平坦化作为抛光停止件。 然后，在第二绝缘膜中形成接触孔，其中接触孔与多晶硅层和第一绝缘层横向隔开。 随后的步骤包括：去除第一绝缘层，从而在多晶硅层上形成未填充区域; 在未填充区域和接触孔中沉积诸如钨的金属; 并且研磨沉积的金属层以使第二绝缘层的上表面平坦化金属的上表面。
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9.发明授权Exposure mask, exposure mask substrate, method for fabricating the same, and method for forming pattern based on exposure mask 失效曝光掩模，曝光掩模基板，其制造方法以及基于曝光掩模形成图案的方法
公开(公告)号：US5547787A
公开(公告)日：1996-08-20
申请号：US49788
申请日：1993-04-21
申请人： Shinichi Ito , Haruo Okano , Toru Watanabe , Katsuya Okumura
发明人： Shinichi Ito , Haruo Okano , Toru Watanabe , Katsuya Okumura
摘要： An exposure mask having an excellent alignment accuracy between patterns, which is prepared by first forming on a light transmissive substrate a light shielding film or a semi-transparent film pattern (first pattern) somewhat larger than a desired dimension, forming thereon a semi-transparent film or a light transmissive film pattern (second pattern) so as to include all patterns of the desired dimensions made up of a light shielding part, a semi-transparent part and a light transmissive part, and then removing a projected part of the first pattern with use of the second pattern as a mask.The semi-transparent film is formed of at least two layers each of which contains a common element, thus the semi-transparent film can be made with use of the same apparatus and when patterning, etching process can be carried out with use of the same etchant.Further, since in a mask including the semi-transparent pattern, at least that area of non-pattern zone where light reaches a wafer through the transfer, acts to shield the exposure light, too narrowed pattern or insufficient focal depth can be prevented.
摘要翻译： 通过首先在透光性基板上形成稍大于所需尺寸的遮光膜或半透明膜图案（第一图案）而制成的图案之间具有优异的取向精度的曝光掩模，在其上形成半透明 膜或透光膜图案（第二图案），以便包括由遮光部分，半透明部分和透光部分组成的所需尺寸的所有图案，然后去除第一图案的突出部分 使用第二种图案作为掩模。 半透明膜由至少两层形成，每层均含有共同的元素，因此可以使用相同的装置制造半透明膜，并且当图案化时，可以使用它们进行蚀刻工艺 蚀刻剂 此外，由于在包括半透明图案的掩模中，至少通过转印光到达晶片的非图案区域的区域起着屏蔽曝光光的作用，可以防止太窄的图案或不足的焦深。
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公开(公告)号：US10428268B2
公开(公告)日：2019-10-01
申请号：US13522126
申请日：2010-12-28
申请人： Toshihiro Ise , Tetsu Kitamura , Toru Watanabe
发明人： Toshihiro Ise , Tetsu Kitamura , Toru Watanabe
摘要： A light emitting organic thin film including at least one compound represented by Formula (PQ-1) and at least one compound represented by Formula (BN-1). In Formula (PQ-1), each of Ra, Rb and Rc independently represents a hydrogen atom or an alkyl group, wherein any one of Ra, Rb and Rc represents a hydrogen atom and the remaining two represent an alkyl group. Each of R1 to R5 independently represents a hydrogen atom, an alkyl group, an aryl group, a fluorine atom or a cyano group. Each of Rx and Ry independently represents an alkyl group or a phenyl group. In Formula (BN-1), Ar1 represents an arylene group that may have a substituent Z. Ar2 represents a condensed hydrocarbyl group that may have a substituent Z. Each of R101 to R113 independently represents a phenyl group, or the like.
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