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公开(公告)号:US20080274338A1
公开(公告)日:2008-11-06
申请号:US12056959
申请日:2008-03-27
申请人: Toshihiko KANEDA , Satoshi KIMURA , Hidemichi FURIHATA , Jun AMAKO , Daisuke SAWAKI , Takeshi KIJIMA
发明人: Toshihiko KANEDA , Satoshi KIMURA , Hidemichi FURIHATA , Jun AMAKO , Daisuke SAWAKI , Takeshi KIJIMA
CPC分类号: H05K3/185 , C23C18/08 , C23C18/14 , C23C18/1608 , C23C18/1692 , C23C18/1844 , C23C18/2086 , C23C18/30 , C23C18/36 , H05K3/125 , H05K3/243 , H05K3/245 , H05K3/389 , H05K2201/09909 , H05K2203/0113 , H05K2203/013 , H05K2203/1105 , H05K2203/308 , Y10T428/24802
摘要: A method for manufacturing a wiring substrate includes the steps of: (a) forming a sacrificial layer in a first pattern on a substrate; (b) forming a catalyst layer in a second pattern on the substrate; (c) immersing the substrate in an electroless plating liquid, thereby depositing a metal layer on the catalyst layer in the second pattern; and (d) heating to remove the sacrificial layer and to form a metal layer in a third pattern, wherein the third pattern is a region where the first pattern and the second pattern overlap each other.
摘要翻译: 制造布线基板的方法包括以下步骤:(a)在基板上形成第一图案的牺牲层; (b)在基板上形成第二图案的催化剂层; (c)将基板浸渍在化学镀液中,由此以第二图案在催化剂层上沉积金属层; 和(d)加热以除去牺牲层并形成第三图案中的金属层,其中第三图案是第一图案和第二图案彼此重叠的区域。
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公开(公告)号:US20070218191A1
公开(公告)日:2007-09-20
申请号:US11680846
申请日:2007-03-01
IPC分类号: B05D5/12
CPC分类号: H05K3/184 , C23C18/1608 , C23C18/1651 , C23C18/1692 , C23C18/1879 , C23C18/30 , C23C18/31 , C23C18/36 , H05K3/24 , H05K2203/0565 , H05K2203/072 , H05K2203/088 , H05K2203/1476
摘要: A method for manufacturing a wiring substrate by an electroless plating method that precipitates metal without using a plating resist is provided. The method includes the steps of: (a) providing a catalyst layer having a predetermined pattern on a substrate; (b) dipping the substrate in an electroless plating solution to thereby precipitate metal on the catalyst layer to provide a first metal layer; (c) exposing a top surface of the substrate to steam; and (d) dipping the substrate in an electroless plating solution to thereby precipitate metal on the first metal layer to provide a second metal layer.
摘要翻译: 提供一种通过化学镀方法制造布线基板的方法,该方法使不使用电镀抗蚀剂的金属沉淀。 该方法包括以下步骤:(a)在衬底上提供具有预定图案的催化剂层; (b)将基板浸渍在化学镀溶液中,从而使金属沉淀在催化剂层上以提供第一金属层; (c)将基板的顶表面暴露于蒸汽; 和(d)将基板浸入化学镀溶液中,从而在第一金属层上沉淀金属,以提供第二金属层。
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公开(公告)号:US20080299356A1
公开(公告)日:2008-12-04
申请号:US11866038
申请日:2007-10-02
CPC分类号: H05K3/185 , C23C18/1608 , C23C18/1641 , C23C18/1879 , C23C18/1882 , C23C18/204 , C23C18/208 , C23C18/2086 , C23C18/30 , C23C18/36 , H05K3/182 , H05K3/387 , H05K2203/0113 , H05K2203/0514 , Y10T428/24851
摘要: A plated substrate includes a substrate, a resin formed body having a specified pattern including catalytic metal that functions as a catalyst for electroless plating, and a metal layer formed on a top surface of the resin layer.
摘要翻译: 电镀基板包括基板,具有特定图案的树脂成型体,包括用作化学镀的催化剂的催化金属,以及形成在树脂层的顶表面上的金属层。
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