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公开(公告)号：US5591993A
公开(公告)日：1997-01-07
申请号：US410136
申请日：1995-03-23
申请人： Toshihiro Nomura , Masaaki Hisamoto , Iwao Kurata
发明人： Toshihiro Nomura , Masaaki Hisamoto , Iwao Kurata
IPC分类号： H02M1/00 , H03K17/12 , H01L23/48 , H01L29/417
CPC分类号： H02M1/00 , H03K17/122 , H03K17/127 , H01L2924/0002
摘要： A connection structure for connecting a plurality of semiconductor switches in parallel includes a pressed contact for a semiconductor switch. The pressed contact includes a layered structure which connects a drain conductor to a plurality of drain electrodes, a source conductor to a plurality of source electrodes, a gate conductor to a plurality of gate electrodes, and an insulating film between the gate conductor and the source conductor. The gate electrodes are a plurality of resilient elastic wings which are pressed upward against the gate conductor, thereby ensuring a good electrical connection.
摘要翻译： 用于并联连接多个半导体开关的连接结构包括用于半导体开关的按压接触。 按压接触包括将漏极导体连接到多个漏电极的层状结构，到多个源电极的源极导体，到多个栅电极的栅极导体以及栅极导体和源极之间的绝缘膜 导体。 栅电极是多个弹性弹性翼片，其向上压靠在栅极导体上，从而确保良好的电连接。
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公开(公告)号：US5629562A
公开(公告)日：1997-05-13
申请号：US649473
申请日：1996-05-17
申请人： Toshihiro Nomura , Masaaki Hisamoto
发明人： Toshihiro Nomura , Masaaki Hisamoto
IPC分类号： H01L23/473 , H01L23/13 , H01L23/40 , H01L23/42 , H01L23/48 , H05K7/20 , H01L23/16 , H01L23/10 , H01L23/34
CPC分类号： H01L23/40 , H01L23/13 , H01L23/42 , H01L24/72 , H01L2224/48091 , H01L2224/49175 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01023 , H01L2924/01033 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/04953 , H01L2924/3511
摘要： In a conductive contact structure for two conductors, a lower electrode also serves as a cooling element, and two grooves are formed in the lower surface of an electrode. A grease-like insulating material high in thermal conductivity is applied to the lower surface of the electrode except the middle region thereof which is defined by the two grooves; that is, it is applied only to the right and left regions of the lower surface which are located on both sides of the middle region. A pressurizing force is applied through an upper conductor to an electrode whose lower surface is fixed through an insulating board to the upper surface of the electrode. The middle region of the lower surface of the electrode is in contact with the surface of the lower conductor, and the right and left regions are elastically deformed in such a manner that they are slightly raised above the surface of the lower conductor, thus forming spaces therebetween. The spaces thus formed are filled with the insulating material. Thermal conduction; i.e., heat radiation is effected through the right and left regions to which the insulating material have been applied, and electrical conduction is ensured through the middle region to which the insulating material is not applied.
摘要翻译： 在用于两个导体的导电接触结构中，下电极也用作冷却元件，并且在电极的下表面中形成两个凹槽。 除了由两个槽限定的中间区域以外，向电极的下表面施加导热性高的油脂状绝缘材料; 也就是说，它仅适用于位于中间区域两侧的下表面的左右区域。 加压力通过上导体施加到其下表面通过绝缘板固定到电极的上表面的电极。 电极的下表面的中间区域与下导体的表面接触，并且左右区域弹性变形，使得它们稍微升高到下导体的表面之上，从而形成空间 之间。 由此形成的空间填充有绝缘材料。 导热; 即通过施加了绝缘材料的左右区域进行热辐射，并且通过不施加绝缘材料的中间区域确保导电。
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公开(公告)号：US5671134A
公开(公告)日：1997-09-23
申请号：US523215
申请日：1995-09-05
IPC分类号： H02M7/00 , H02M7/5387 , H02M7/538 , H02M1/00
CPC分类号： H02M7/003
摘要： An inverter unit of the invention converts a DC current to a high frequency AC current. The inverter unit is formed of a metal conductor base plate connected to a positive terminal of a DC power supply; and switching elements arranged on both surfaces of the base plate. Each switching element situated on each surface of the base plate includes an upper arm and a lower arm of the inverter unit to form an arm pair. The arm pairs formed on both surfaces of the base plate constitute a single phase bridge circuit.
摘要翻译： 本发明的逆变器单元将DC电流转换为高频AC电流。 逆变器单元由与直流电源的正极端子连接的金属导体基板形成， 以及布置在基板的两个表面上的开关元件。 位于基板的每个表面上的每个开关元件包括逆变器单元的上臂和下臂，以形成臂对。 形成在基板的两个表面上的臂对构成单相桥式电路。
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