Method of determining photo mask, method of manufacturing semiconductor device, and computer program product
    1.
    发明授权
    Method of determining photo mask, method of manufacturing semiconductor device, and computer program product 失效
    确定光掩模的方法,制造半导体器件的方法以及计算机程序产品

    公开(公告)号:US07925090B2

    公开(公告)日:2011-04-12

    申请号:US11601797

    申请日:2006-11-20

    IPC分类号: G06K9/34

    CPC分类号: G03F7/70441

    摘要: A method of determining a photo mask, includes specifying a mask pattern for a photo mask for a first exposure apparatus, specifying a plurality of exposure conditions allowed to be set for a second exposure apparatus, predicting a projection image of the mask pattern to be projected on a substrate by the second exposure apparatus, for each of the exposure conditions, predicting a processed pattern to be formed on a substrate surface on the basis of the projection image, for each of the exposure conditions, determining whether or not the processed pattern meets a predetermined condition for each of the exposure conditions, and determining that the photo mask is applicable to the second exposure apparatus if the processed pattern meets the predetermined condition for at least one of the exposure conditions.

    摘要翻译: 一种确定光掩模的方法包括:为第一曝光装置指定用于光掩模的掩模图案,指定允许为第二曝光装置设置的多个曝光条件,预测要投影的掩模图案的投影图像 在第二曝光装置的基板上,对于每个曝光条件,对于每个曝光条件,基于投影图像预测要在基板表面上形成的处理图案,确定处理图案是否满足 对于每个曝光条件的预定条件,并且如果处理的图案满足至少一个曝光条件的预定条件,则确定光掩模适用于第二曝光装置。

    Method of determining photo mask, method of manufacturing semiconductor device, and computer program product
    2.
    发明申请
    Method of determining photo mask, method of manufacturing semiconductor device, and computer program product 失效
    确定光掩模的方法,制造半导体器件的方法以及计算机程序产品

    公开(公告)号:US20070130560A1

    公开(公告)日:2007-06-07

    申请号:US11601797

    申请日:2006-11-20

    IPC分类号: G06F17/50

    CPC分类号: G03F7/70441

    摘要: A method of determining a photo mask, includes specifying a mask pattern for a photo mask for a first exposure apparatus, specifying a plurality of exposure conditions allowed to be set for a second exposure apparatus, predicting a projection image of the mask pattern to be projected on a substrate by the second exposure apparatus, for each of the exposure conditions, predicting a processed pattern to be formed on a substrate surface on the basis of the projection image, for each of the exposure conditions, determining whether or not the processed pattern meets a predetermined condition for each of the exposure conditions, and determining that the photo mask is applicable to the second exposure apparatus if the processed pattern meets the predetermined condition for at least one of the exposure conditions.

    摘要翻译: 一种确定光掩模的方法包括:为第一曝光装置指定用于光掩模的掩模图案,指定允许为第二曝光装置设置的多个曝光条件,预测要投影的掩模图案的投影图像 在第二曝光装置的基板上,对于每个曝光条件,对于每个曝光条件,基于投影图像预测要在基板表面上形成的处理图案,确定处理图案是否满足 对于每个曝光条件的预定条件,并且如果处理的图案满足至少一个曝光条件的预定条件,则确定光掩模适用于第二曝光装置。

    EXPOSURE DETERMINING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND COMPUTER PROGRAM PRODUCT
    3.
    发明申请
    EXPOSURE DETERMINING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND COMPUTER PROGRAM PRODUCT 有权
    曝光测定方法,制造半导体器件的方法和计算机程序产品

    公开(公告)号:US20110177458A1

    公开(公告)日:2011-07-21

    申请号:US13007238

    申请日:2011-01-14

    IPC分类号: G03F7/20 G06F17/50

    CPC分类号: G03F7/70425 G03F7/70558

    摘要: According to one embodiment, a deviation amount distribution of a two-dimensional shape parameter between a mask pattern formed on a mask and a desired mask pattern is acquired as a mask pattern map. Such that a deviation amount of the two-dimensional shape parameter between a pattern on substrate formed when the mask is subjected to exposure shot to form a pattern on a substrate and a desired pattern on substrate fits within a predetermined range, an exposure is determined for each position in the exposure shot in forming the pattern on substrate based on the mask pattern map.

    摘要翻译: 根据一个实施例,获取形成在掩模上的掩模图案与期望的掩模图案之间的二维形状参数的偏差量分布作为掩模图案图。 使得当在掩模经受曝光拍摄以形成基板上的图案和在基板上形成图案之后形成的基板上的图案之间的二维形状参数的偏移量适合在预定范围内时,确定曝光 基于掩模图案图,在基板上形成图案的曝光中的每个位置。

    EXPOSURE METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    4.
    发明申请
    EXPOSURE METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开
    曝光方法和制造半导体器件的方法

    公开(公告)号:US20120070985A1

    公开(公告)日:2012-03-22

    申请号:US13233971

    申请日:2011-09-15

    IPC分类号: H01L21/768 G03B27/32

    摘要: According to one embodiment, an exposure method is disclosed. The method can include applying light to a photomask by an illumination. The method can include converging diffracted beams emitted from the photomask by a lens. In addition, the method can include imaging a plurality of point images on an exposure surface. On the photomask, a light transmitting region is formed at a lattice point represented by nonorthogonal unit cell vectors, and in the illumination, a light emitting region is set so that three or more of the diffracted beams pass through positions equidistant from center of a pupil of the lens.

    摘要翻译: 根据一个实施例,公开了曝光方法。 该方法可以包括通过照明将光照射到光掩模。 该方法可以包括通过透镜会聚从光掩模发射的衍射光束。 此外,该方法可以包括在曝光表面上成像多个点图像。 在光掩模上,在由非正交单元矢量表示的格点处形成光透射区域,在照明中,设定发光区域,使得三个以上的衍射光束通过与瞳孔中心等距的位置 的镜头。

    Mask pattern correcting method
    5.
    发明授权
    Mask pattern correcting method 有权
    掩模图案校正方法

    公开(公告)号:US08122385B2

    公开(公告)日:2012-02-21

    申请号:US12129167

    申请日:2008-05-29

    IPC分类号: G06F17/50

    CPC分类号: G03F1/36

    摘要: In a model-based OPC which makes a suitable mask correction for each mask pattern using an optical image intensity simulator, a mask pattern is divided into subregions and the model of optical image intensity simulation is changed according to the contents of the pattern in each subregion. When the minimum dimensions of the mask pattern are smaller than a specific threshold value set near the exposure wavelength, the region is calculated using a high-accuracy model and the other regions are calculated using a high-speed model.

    摘要翻译: 在基于模型的OPC中,使用光学图像强度模拟器对每个掩模图案进行适当的掩模校正,将掩模图案划分为子区域,并且根据每个子区域中的图案的内容来改变光学图像强度模拟模型 。 当掩模图案的最小尺寸小于在曝光波长附近设置的特定阈值时,使用高精度模型计算该区域,并且使用高速模型来计算其它区域。

    Exposure determining method, method of manufacturing semiconductor device, and computer program product
    6.
    发明授权
    Exposure determining method, method of manufacturing semiconductor device, and computer program product 有权
    曝光确定方法,制造半导体器件的方法和计算机程序产品

    公开(公告)号:US08440376B2

    公开(公告)日:2013-05-14

    申请号:US13007238

    申请日:2011-01-14

    IPC分类号: G03F9/00 G03C5/00

    CPC分类号: G03F7/70425 G03F7/70558

    摘要: According to one embodiment, a deviation amount distribution of a two-dimensional shape parameter between a mask pattern formed on a mask and a desired mask pattern is acquired as a mask pattern map. Such that a deviation amount of the two-dimensional shape parameter between a pattern on substrate formed when the mask is subjected to exposure shot to form a pattern on a substrate and a desired pattern on substrate fits within a predetermined range, an exposure is determined for each position in the exposure shot in forming the pattern on substrate based on the mask pattern map.

    摘要翻译: 根据一个实施例,获取形成在掩模上的掩模图案与期望的掩模图案之间的二维形状参数的偏差量分布作为掩模图案图。 使得当在掩模经受曝光拍摄以形成基板上的图案和在基板上形成图案之后形成的基板上的图案之间的二维形状参数的偏移量适合在预定范围内时,确定曝光 基于掩模图案图,在基板上形成图案的曝光中的每个位置。

    System, method and program for generating mask data, exposure mask and semiconductor device in consideration of optical proximity effects
    7.
    发明授权
    System, method and program for generating mask data, exposure mask and semiconductor device in consideration of optical proximity effects 失效
    考虑到光学邻近效应,产生掩模数据,曝光掩模和半导体器件的系统,方法和程序

    公开(公告)号:US07716628B2

    公开(公告)日:2010-05-11

    申请号:US11298840

    申请日:2005-12-12

    IPC分类号: G06F17/50

    CPC分类号: G03F1/36 G03F1/68

    摘要: A system for generating mask data includes an extracting module extracting a block necessary to correct process proximity effects as a wide correction area from a plurality of blocks by comparing parameter, a wide correction data generator generating wide correction data to make the correction applied to the wide correction area, and a mask data generator generating mask data by applying the wide correction data to the wide correction area.

    摘要翻译: 一种用于生成掩模数据的系统,包括提取模块,通过比较参数,从多个块中提取校正过程邻近效应所需的块作为宽的校正区域;广泛的校正数据生成器,产生宽的校正数据,使校正应用于宽 校正区域,以及掩模数据生成器,通过将宽校正数据应用于宽校正区域来生成掩模数据。

    System, method and program for generating mask data, exposure mask and semiconductor device in consideration of optical proximity effects
    8.
    发明申请
    System, method and program for generating mask data, exposure mask and semiconductor device in consideration of optical proximity effects 失效
    考虑到光学邻近效应,产生掩模数据,曝光掩模和半导体器件的系统,方法和程序

    公开(公告)号:US20060129967A1

    公开(公告)日:2006-06-15

    申请号:US11298840

    申请日:2005-12-12

    IPC分类号: G06F17/50

    CPC分类号: G03F1/36 G03F1/68

    摘要: A system for generating mask data includes an extracting module extracting a block necessary to correct process proximity effects as a wide correction area from a plurality of blocks by comparing parameter, a wide correction data generator generating wide correction data to make the correction applied to the wide correction area, and a mask data generator generating mask data by applying the wide correction data to the wide correction area.

    摘要翻译: 一种用于生成掩模数据的系统,包括提取模块,通过比较参数,从多个块中提取校正过程邻近效应所需的块作为宽的校正区域;广泛的校正数据生成器,产生宽的校正数据,使校正应用于宽 校正区域,以及掩模数据生成器,通过将宽校正数据应用于宽校正区域来生成掩模数据。

    Semiconductor device manufacturing method
    9.
    发明授权
    Semiconductor device manufacturing method 有权
    半导体器件制造方法

    公开(公告)号:US08293456B2

    公开(公告)日:2012-10-23

    申请号:US12390157

    申请日:2009-02-20

    IPC分类号: G03F1/00

    CPC分类号: G03F1/00 G03F1/36 G03F7/70433

    摘要: A semiconductor device manufacturing method includes applying illumination light to a photomask, and projecting diffracted light components from the photomask via a projection optical system to form a photoresist pattern on a substrate. The photomask includes a plurality of opening patterns which are arranged on each of a plurality of parallel lines at regular second intervals in a second direction and which have regular first intervals in a first direction perpendicular to the second direction. The plurality of opening patterns arranged on the adjacent ones of the plurality of parallel lines are displaced from each other half the second interval in the second direction. Moreover, the dimensions of the plurality of opening patterns and the complex amplitude transmittance of nontransparent region in the photomask are set so that three of the diffracted light components passing through the pupil of the projection optical system have equal amplitude.

    摘要翻译: 一种半导体器件制造方法,包括将照明光施加到光掩模,以及经由投影光学系统从光掩模投射衍射光成分,以在基板上形成光刻胶图案。 光掩模包括多个开口图案,其以在第二方向上的规则的第二间隔布置在多条平行线中的每一条上,并且在垂直于第二方向的第一方向上具有规则的第一间隔。 布置在多条平行线上相邻的多个平行线上的多个开口图案在第二方向上相互偏移第二间隔的一半。 此外,设置多个开口图案的尺寸和光掩模中的非透明区域的复振幅透射率,使得穿过投影光学系统的光瞳的三个衍射光分量具有相等的幅度。

    Exposure apparatus inspection method and method for manufacturing semiconductor device
    10.
    发明授权
    Exposure apparatus inspection method and method for manufacturing semiconductor device 失效
    曝光装置检查方法及制造半导体装置的方法

    公开(公告)号:US08085393B2

    公开(公告)日:2011-12-27

    申请号:US12554782

    申请日:2009-09-04

    IPC分类号: G01N11/00

    CPC分类号: G03F7/70641

    摘要: A mask pattern includes a first pattern having a line-and-space pattern extending in a first direction, a second pattern formed as a line-and-space pattern having a larger period than the first pattern and extending in the first direction, a third pattern having a line-and-space pattern extending in a second direction, and a fourth pattern formed as a line-and-space pattern having a larger period than the third pattern and extending in the second direction. Illumination light is obliquely incident on the first pattern and the second pattern from a first oblique direction, illumination light is obliquely incident on the third pattern and the fourth pattern from a second oblique direction, and a relative distance from the first pattern to the second pattern transferred on to an image receptor and a relative distance from the third pattern to the fourth pattern transferred onto the image receptor are measured and an optical characteristic of an exposure apparatus is ascertained based on the relative distances.

    摘要翻译: 掩模图案包括具有沿第一方向延伸的线间距图案的第一图案,形成为具有比第一图案更长的周期并沿第一方向延伸的线间距图案的第二图案,第三图案 图案具有沿第二方向延伸的线间距图案,以及形成为具有比第三图案更大的周期并沿第二方向延伸的线间距图案的第四图案。 照明光从第一倾斜方向倾斜入射在第一图案和第二图案上,照明光从第二倾斜方向倾斜入射在第三图案和第四图案上,并且从第一图案到第二图案的相对距离 转印到图像接收器上,并且测量从第三图案到转印到图像接收器上的第四图案的相对距离,并且基于相对距离确定曝光设备的光学特性。