-
公开(公告)号：US20120070985A1
公开(公告)日：2012-03-22
申请号：US13233971
申请日：2011-09-15
IPC分类号： H01L21/768 , G03B27/32
CPC分类号： H01L27/0207 , G03F1/50 , G03F7/70325 , H01L21/0274 , H01L21/31144 , H01L27/11519 , H01L27/11524
摘要： According to one embodiment, an exposure method is disclosed. The method can include applying light to a photomask by an illumination. The method can include converging diffracted beams emitted from the photomask by a lens. In addition, the method can include imaging a plurality of point images on an exposure surface. On the photomask, a light transmitting region is formed at a lattice point represented by nonorthogonal unit cell vectors, and in the illumination, a light emitting region is set so that three or more of the diffracted beams pass through positions equidistant from center of a pupil of the lens.
摘要翻译： 根据一个实施例，公开了曝光方法。 该方法可以包括通过照明将光照射到光掩模。 该方法可以包括通过透镜会聚从光掩模发射的衍射光束。 此外，该方法可以包括在曝光表面上成像多个点图像。 在光掩模上，在由非正交单元矢量表示的格点处形成光透射区域，在照明中，设定发光区域，使得三个以上的衍射光束通过与瞳孔中心等距的位置 的镜头。
-
公开(公告)号：US08865589B2
公开(公告)日：2014-10-21
申请号：US13614217
申请日：2012-09-13
申请人： Takaki Hashimoto , Yasunobu Kai , Toshiya Kotani
发明人： Takaki Hashimoto , Yasunobu Kai , Toshiya Kotani
IPC分类号： H01L21/027 , H01L21/768 , H01L21/311 , H01L23/528 , H01L21/033 , H01L27/115
CPC分类号： H01L23/528 , H01L21/0337 , H01L21/31144 , H01L21/768 , H01L21/76804 , H01L21/76816 , H01L21/76895 , H01L27/11519 , H01L2924/0002 , Y10S438/947 , H01L2924/00
摘要： According to one embodiment, a semiconductor device includes a plurality of wires arranged in parallel at a predetermined pitch, a plurality at first contacts that are each connected to an odd-numbered wire among the wires and are arranged in parallel in an orthogonal direction with respect to a wiring direction of the wires, and a plurality of second contacts that are each connected to an even-numbered wire among the wires and are arranged in parallel in an orthogonal direction with respect to the wiring direction of the wires in such a way as to be offset from the first contacts in the wiring direction of the wires, in which the first contacts are offset from the second contacts by a pitch of the wires in an orthogonal direction with respect to the wiring direction of the wires.
摘要翻译： 根据一个实施例，半导体器件包括以预定间距平行布置的多条导线，多个第一触点分别连接到导线之间的奇数编号，并且与正交方向平行布置，与 与导线的布线方向相连接的多个第二触点，以及多个第二触点，每个第二触点各自连接到电线中的偶数线，并且相对于线的布线方向在正交方向上平行布置， 在与导线的布线方向正交的方向上的第一触点相对于第二触点偏离线的间距的方式偏离布线方向的第一触点。
-
公开(公告)号：US20100202181A1
公开(公告)日：2010-08-12
申请号：US12561531
申请日：2009-09-17
申请人： Takaki HASHIMOTO , Hidefumi Mukai , Yasunobu Kai , Toshiya Kotani
发明人： Takaki HASHIMOTO , Hidefumi Mukai , Yasunobu Kai , Toshiya Kotani
IPC分类号： G11C5/06
摘要： A semiconductor memory device includes a semiconductor substrate on which memory cells are formed. Interconnects are arranged along a first direction above the semiconductor substrate, and have regular intervals along a second direction perpendicular to the first direction. Interconnect contacts connect the interconnects and the semiconductor substrate, are arranged on three or more rows. The center of each of two of the interconnect contacts which are connected to the interconnects adjacent in the second direction deviate from each other along the first direction.
摘要翻译： 半导体存储器件包括形成有存储单元的半导体衬底。 互连件沿着半导体衬底上方的第一方向布置，并且沿着垂直于第一方向的第二方向具有规则的间隔。 互连触点连接互连和半导体衬底，布置在三行或更多行上。 连接到在第二方向相邻的互连件的两个互连触点中的每一个的中心沿着第一方向彼此偏离。
-
公开(公告)号：US08293456B2
公开(公告)日：2012-10-23
申请号：US12390157
申请日：2009-02-20
IPC分类号： G03F1/00
CPC分类号： G03F1/00 , G03F1/36 , G03F7/70433
摘要： A semiconductor device manufacturing method includes applying illumination light to a photomask, and projecting diffracted light components from the photomask via a projection optical system to form a photoresist pattern on a substrate. The photomask includes a plurality of opening patterns which are arranged on each of a plurality of parallel lines at regular second intervals in a second direction and which have regular first intervals in a first direction perpendicular to the second direction. The plurality of opening patterns arranged on the adjacent ones of the plurality of parallel lines are displaced from each other half the second interval in the second direction. Moreover, the dimensions of the plurality of opening patterns and the complex amplitude transmittance of nontransparent region in the photomask are set so that three of the diffracted light components passing through the pupil of the projection optical system have equal amplitude.
摘要翻译： 一种半导体器件制造方法，包括将照明光施加到光掩模，以及经由投影光学系统从光掩模投射衍射光成分，以在基板上形成光刻胶图案。 光掩模包括多个开口图案，其以在第二方向上的规则的第二间隔布置在多条平行线中的每一条上，并且在垂直于第二方向的第一方向上具有规则的第一间隔。 布置在多条平行线上相邻的多个平行线上的多个开口图案在第二方向上相互偏移第二间隔的一半。 此外，设置多个开口图案的尺寸和光掩模中的非透明区域的复振幅透射率，使得穿过投影光学系统的光瞳的三个衍射光分量具有相等的幅度。
-
公开(公告)号：US20120328992A1
公开(公告)日：2012-12-27
申请号：US13606834
申请日：2012-09-07
IPC分类号： G03F7/20
CPC分类号： G03F1/00 , G03F1/36 , G03F7/70433
摘要： A semiconductor device manufacturing method includes applying illumination light to a photomask, and projecting diffracted light components from the photomask via a projection optical system to form a photoresist pattern on a substrate. The photomask includes a plurality of opening patterns which are arranged on each of a plurality of parallel lines at regular second intervals in a second direction and which have regular first intervals in a first direction perpendicular to the second direction. The plurality of opening patterns arranged on the adjacent ones of the plurality of parallel lines are displaced from each other half the second interval in the second direction. Moreover, the dimensions of the plurality of opening patterns and the complex amplitude transmittance of nontransparent region in the photomask are set so that three of the diffracted light components passing through the pupil of the projection optical system have equal amplitude.
摘要翻译： 一种半导体器件制造方法，包括将照明光施加到光掩模，以及经由投影光学系统从光掩模投射衍射光成分，以在基板上形成光刻胶图案。 光掩模包括多个开口图案，其以在第二方向上的规则的第二间隔布置在多条平行线中的每一条上，并且在垂直于第二方向的第一方向上具有规则的第一间隔。 布置在多条平行线上相邻的多个平行线上的多个开口图案在第二方向上相互偏移第二间隔的一半。 此外，设置多个开口图案的尺寸和光掩模中的非透明区域的复振幅透射率，使得穿过投影光学系统的光瞳的三个衍射光分量具有相等的幅度。
-
公开(公告)号：US20130241073A1
公开(公告)日：2013-09-19
申请号：US13614217
申请日：2012-09-13
申请人： Takaki Hashimoto , Yasunobu Kai , Toshiya Kotani
发明人： Takaki Hashimoto , Yasunobu Kai , Toshiya Kotani
IPC分类号： H01L23/528 , H01L21/768
CPC分类号： H01L23/528 , H01L21/0337 , H01L21/31144 , H01L21/768 , H01L21/76804 , H01L21/76816 , H01L21/76895 , H01L27/11519 , H01L2924/0002 , Y10S438/947 , H01L2924/00
摘要： According to one embodiment, a semiconductor device includes a plurality of wires arranged in parallel at a predetermined pitch, a plurality at first contacts that are each connected to an odd-numbered wire among the wires and are arranged in parallel in an orthogonal direction with respect to a wiring direction of the wires, and a plurality of second contacts that are each connected to an even-numbered wire among the wires and are arranged in parallel in an orthogonal direction with respect to the wiring direction of the wires in such a way as to be offset from the first contacts in the wiring direction of the wires, in which the first contacts are offset from the second contacts by a pitch of the wires in an orthogonal direction with respect to the wiring direction of the wires.
摘要翻译： 根据一个实施例，半导体器件包括以预定间距平行布置的多条导线，多个第一触点分别连接到导线之间的奇数编号，并且与正交方向平行布置，与 与导线的布线方向相连接的多个第二触点，以及多个第二触点，每个第二触点各自连接到电线中的偶数线，并且相对于线的布线方向在正交方向上平行布置， 在与导线的布线方向正交的方向上的第一触点相对于第二触点偏离线的间距的方式偏离布线方向的第一触点。
-
公开(公告)号：US08679731B2
公开(公告)日：2014-03-25
申请号：US13606834
申请日：2012-09-07
IPC分类号： G03F7/20
CPC分类号： G03F1/00 , G03F1/36 , G03F7/70433
摘要： A semiconductor device manufacturing method includes applying illumination light to a photomask, and projecting diffracted light components from the photomask via a projection optical system to form a photoresist pattern on a substrate. The photomask includes a plurality of opening patterns which are arranged on each of a plurality of parallel lines at regular second intervals in a second direction and which have regular first intervals in a first direction perpendicular to the second direction. The plurality of opening patterns arranged on the adjacent ones of the plurality of parallel lines are displaced from each other half the second interval in the second direction. Moreover, the dimensions of the plurality of opening patterns and the complex amplitude transmittance of nontransparent region in the photomask are set so that three of the diffracted light components passing through the pupil of the projection optical system have equal amplitude.
摘要翻译： 一种半导体器件制造方法，包括将照明光施加到光掩模，以及经由投影光学系统从光掩模投射衍射光成分，以在基板上形成光刻胶图案。 光掩模包括多个开口图案，其以在第二方向上的规则的第二间隔布置在多条平行线中的每一条上，并且在垂直于第二方向的第一方向上具有规则的第一间隔。 布置在多条平行线上相邻的多个平行线上的多个开口图案在第二方向上相互偏移第二间隔的一半。 此外，设置多个开口图案的尺寸和光掩模中的非透明区域的复振幅透射率，使得穿过投影光学系统的光瞳的三个衍射光分量具有相等的幅度。
-
8.发明授权Parameter adjustment method, semiconductor device manufacturing method, and recording medium 有权参数调整方法，半导体器件制造方法和记录介质公开(公告)号：US07934175B2
公开(公告)日：2011-04-26
申请号：US12062859
申请日：2008-04-04
申请人： Toshiya Kotani , Yasunobu Kai , Soichi Inoue , Satoshi Tanaka , Shigeki Nojima , Kazuyuki Masukawa , Koji Hashimoto
发明人： Toshiya Kotani , Yasunobu Kai , Soichi Inoue , Satoshi Tanaka , Shigeki Nojima , Kazuyuki Masukawa , Koji Hashimoto
IPC分类号： G06F17/50
CPC分类号： G03F7/70625 , G03F7/70525 , H01L22/12 , H01L22/20 , H01L2924/0002 , H01L2924/00
摘要： A parameter adjustment method for a plurality of manufacturing devices to form a pattern of a semiconductor device on a substrate using the manufacturing devices includes: adjusting a parameter adjustable for a manufacturing device serving as a reference manufacturing device; obtaining a first shape of a pattern of a semiconductor device to be formed on a substrate; defining an adjustable parameter of another to-be-adjusted manufacturing; obtaining a second shape of the pattern formed on the substrate; calculating a difference amount between a reference finished shape and a to-be-adjusted finished shape; repeatedly calculating the difference amount by changing the to-be-adjusted parameter until the difference amount becomes equal to or less than a predetermined reference value; and outputting as a parameter of the to-be-adjusted manufacturing device the to-be-adjusted parameter.
摘要翻译： 用于使用该制造装置在基板上形成半导体器件的图案的多个制造装置的参数调整方法包括：调整可用于作为参考制造装置的制造装置的参数; 获得要在基板上形成的半导体器件的图案的第一形状; 定义另一个待调整制造的可调参数; 获得形成在所述基板上的所述图案的第二形状; 计算参考完成形状和待调整完成形状之间的差值; 通过改变待调整参数重复计算差值，直到差值变得等于或小于预定参考值; 并作为待调整制造装置的参数输出待调整参数。
-
9.发明申请PARAMETER ADJUSTMENT METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND RECORDING MEDIUM 有权参数调整方法，半导体器件制造方法和记录介质公开(公告)号：US20080250381A1
公开(公告)日：2008-10-09
申请号：US12062859
申请日：2008-04-04
申请人： Toshiya KOTANI , Yasunobu Kai , Soichi Inoue , Satoshi Tanaka , Shigeki Nojima , Kazuyuki Masukawa , Koji Hashimoto
发明人： Toshiya KOTANI , Yasunobu Kai , Soichi Inoue , Satoshi Tanaka , Shigeki Nojima , Kazuyuki Masukawa , Koji Hashimoto
IPC分类号： G06F17/50
CPC分类号： G03F7/70625 , G03F7/70525 , H01L22/12 , H01L22/20 , H01L2924/0002 , H01L2924/00
摘要： A parameter adjustment method for a plurality of manufacturing devices to form a pattern of a semiconductor device on a substrate using the manufacturing devices includes: adjusting a parameter adjustable for a manufacturing device serving as a reference manufacturing device so as to fall within a range of a predetermined permissible variation and defining the adjusted parameter as a reference parameter of the reference manufacturing device; obtaining a first shape of a pattern of a semiconductor device to be formed on a substrate using the reference manufacturing device from a mask to form the pattern on the substrate when the reference parameter is set to the reference manufacturing device and defining the obtained first shape as a reference finished shape; defining an adjustable parameter of another to-be-adjusted manufacturing device as a to-be-adjusted parameter of the to-be-adjusted manufacturing device; obtaining a second shape of the pattern formed on the substrate using the to-be-adjusted manufacturing device from the mask when the defined to-be-adjusted parameter is set to the to-be-adjusted manufacturing device and defining the obtained second shape as a to-be-adjusted finished shape; calculating a difference amount between the reference finished shape and the to-be-adjusted finished shape; repeatedly calculating the difference amount by changing the to-be-adjusted parameter until the difference amount becomes equal to or less than a predetermined reference value; outputting as a parameter of the to-be-adjusted manufacturing device the to-be-adjusted parameter having the difference amount equal to or less than the predetermined reference value or the to-be-adjusted parameter having the difference amount which becomes equal to or less than the predetermined reference value through the repeated calculation.
摘要翻译： 用于使用该制造装置在基板上形成半导体器件的图案的多个制造装置的参数调整方法包括：调整作为参考制造装置的制造装置可调节的参数，使其落在 预定的允许变化并将调整参数定义为参考制造装置的参考参数; 使用参考制造装置从掩模获得要在基板上形成的半导体器件的图案的第一形状，以在将参考参数设置为参考制造装置并将所获得的第一形状定义为 参考完成形状; 将另一个待调节制造装置的可调参数定义为待调整制造装置的待调整参数; 当将所述规定的待调整参数设定为所述待调节制造装置并且将所获得的第二形状定义为所述第二形状时，从所述掩模获得使用所述待调节制造装置在所述基板上形成的所述图案的第二形状 一个待调整的成品形状; 计算参考完成形状和待调整完成形状之间的差值; 通过改变待调整参数重复计算差值，直到差值变得等于或小于预定参考值; 作为待调整制造装置的参数输出具有等于或小于预定参考值的差值的待调整参数或具有等于或等于或等于或等于 通过重复计算小于预定的参考值。
-
公开(公告)号：US08288812B2
公开(公告)日：2012-10-16
申请号：US12871271
申请日：2010-08-30
申请人： Yasunobu Kai , Takaki Hashimoto
发明人： Yasunobu Kai , Takaki Hashimoto
IPC分类号： H01L29/788
CPC分类号： H01L27/0207 , H01L21/31144 , H01L21/76816 , H01L27/11521 , H01L27/11524
摘要： According to one embodiment, a semiconductor device includes a substrate, conductive members, an interlayer insulating film, and a plurality of contacts. The conductive members are provided in an upper portion of the substrate or above the substrate to extend in one direction. The interlayer insulating film is provided on the substrate and the conductive members. The plurality of contacts is provided in the interlayer insulating film. In a first region on the substrate, the contacts are located at some of lattice points of an imaginary first lattice. In a second region on the substrate, the contacts are located at some of lattice points of an imaginary second lattice. The second lattice is different from the first lattice. Each of the first lattice and the second lattice includes some of the lattice points located on the conductive members or on an extension region extended in the one direction of the conductive members. A position of each of the lattice points located on the conductive members and the extension region in the one direction is periodically displaced based on every n consecutively-arranged conductive members (n is a natural number).
摘要翻译： 根据一个实施例，半导体器件包括衬底，导电构件，层间绝缘膜和多个触点。 导电构件设置在基板的上部或基板上方，以在一个方向上延伸。 层间绝缘膜设置在基板和导电构件上。 多个触点设置在层间绝缘膜中。 在基板上的第一区域中，触点位于虚构的第一格子的某个格点。 在衬底上的第二区域中，触点位于虚构的第二晶格的一些晶格点处。 第二格子与第一格子不同。 第一晶格和第二晶格中的每一个包括位于导电构件上或在导电构件的一个方向上延伸的延伸区域上的一些晶格点。 基于每n个连续排列的导电构件（n是自然数），位于导电构件上的每个晶格点和沿一个方向的延伸区域的位置周期性地移位。
-
-
-
-
-
-
-
-
-
搜索结果
24 条记录 (耗时 0.026 秒)
