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    LAMINATED CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR
    3.
    发明申请
    LAMINATED CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR 有权
    层压陶瓷电子元件及其制造方法

    公开(公告)号：US20100328843A1

    公开(公告)日：2010-12-30

    申请号：US12821305

    申请日：2010-06-23

    申请人： Masahito SARUBAN ,  Makoto OGAWA ,  Toshiyuki IWANAGA ,  Seiichi MATSUMOTO ,  Akihiro MOTOKI ,  Shunsuke TAKEUCHI ,  Seiichi NISHIHARA ,  Kenichi KAWASAKI

    发明人： Masahito SARUBAN ,  Makoto OGAWA ,  Toshiyuki IWANAGA ,  Seiichi MATSUMOTO ,  Akihiro MOTOKI ,  Shunsuke TAKEUCHI ,  Seiichi NISHIHARA ,  Kenichi KAWASAKI

    IPC分类号： H01G4/008 ,  B05D5/12

    CPC分类号： H01G4/2325 ,  H01G4/30 ,  H01L41/083 ,  H01L41/293

    摘要： In a method for manufacturing a laminated ceramic electronic component, after a plating layer for an external terminal electrode is formed by applying copper plating to an end surface of a component main body at which respective ends of a plurality of internal electrodes primarily including nickel are exposed, when a heat treatment at a temperature of about 800° C. or more is applied in order to improve adhesion strength and resistance to moisture of the external terminal electrode, voids may occur in the plating layer. The step of applying a heat treatment at a temperature of about 800° C. or more to a component main body with plating layers formed thereon includes not only a step of maintaining a top temperature of about 1000° C. or more but also a step of maintaining a temperature of about 600° C. to 900° C. at least once before the step of maintaining the top temperature. These steps preliminarily diffuse copper included in the plating layers, which has a relatively high diffusion velocity, into the internal electrodes primarily including nickel, thereby reducing a difference in diffusion velocity between copper and nickel at the top temperature, which causes the occurrence of voids.

    摘要翻译： 在层叠陶瓷电子部件的制造方法中，在将外部端子电极的镀覆层通过在主体的主体的多个内部电极的各端露出的部件主体的端面上进行镀铜而形成后， 为了提高外部端子电极的附着强度和耐潮湿性而在800℃以上的温度下进行热处理时，可能会在镀层中产生空隙。 在其上形成有镀层的组件主体上，在约800℃以上的温度下进行热处理的步骤不仅包括保持顶部温度为约1000℃以上的步骤，还包括步骤 在保持顶部温度的步骤之前至少保持约600℃至900℃的温度。 这些步骤将包含在具有较高扩散速度的镀层中的铜初步扩散到主要包括镍的内部电极中，从而减少了在最高温度下铜和镍之间扩散速度的差异，这导致空隙的发生。

    LAMINATED CERAMIC ELECTRONIC COMPONENT
    4.
    发明申请
    LAMINATED CERAMIC ELECTRONIC COMPONENT 有权
    层压陶瓷电子元件

    公开(公告)号：US20100118467A1

    公开(公告)日：2010-05-13

    申请号：US12616844

    申请日：2009-11-12

    申请人： Shunsuke TAKEUCHI ,  Kenichi KAWASAKI ,  Akihiro MOTOKI ,  Makoto OGAWA ,  Toshiyuki IWANAGA

    发明人： Shunsuke TAKEUCHI ,  Kenichi KAWASAKI ,  Akihiro MOTOKI ,  Makoto OGAWA ,  Toshiyuki IWANAGA

    IPC分类号： H01G4/228

    CPC分类号： H01G4/232 ,  H01G4/2325 ,  H01G4/30

    摘要： In a laminated ceramic electronic component, external terminal electrodes include plating films directly covering exposed portions of internal electrodes on end surfaces of a ceramic element assembly. On the boundaries between the end surfaces and principal surfaces of the ceramic element assembly, substantially rounded corners are provided, and the plating films are arranged such that the ends of the plating films stop at the corners and do not project from the principal surfaces.

    摘要翻译： 在层叠陶瓷电子部件中，外部端子电极包括直接覆盖陶瓷元件组件的端面上的内部电极的露出部分的电镀膜。 在陶瓷元件组件的端面和主面之间的边界上，设置大致圆角，并且镀膜被布置成使得镀膜的端部停止在角部并且不从主表面突出。

    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MAKING THE SAME
    5.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MAKING THE SAME 有权
    多层陶瓷电子元件及其制造方法

    公开(公告)号：US20090323253A1

    公开(公告)日：2009-12-31

    申请号：US12490471

    申请日：2009-06-24

    申请人： Tatsunori KOBAYASHI ,  Akihiro MOTOKI ,  Makoto OGAWA ,  Toshiyuki IWANAGA ,  Shunsuke TAKEUCHI ,  Kenichi KAWASAKI

    发明人： Tatsunori KOBAYASHI ,  Akihiro MOTOKI ,  Makoto OGAWA ,  Toshiyuki IWANAGA ,  Shunsuke TAKEUCHI ,  Kenichi KAWASAKI

    IPC分类号： H01G4/30 ,  B05D5/12

    CPC分类号： H01G4/005 ,  H01G4/232 ,  H01G4/30 ,  Y10T29/435

    摘要： A multilayer ceramic electronic component includes external terminal electrodes that are formed by depositing metal plating films on exposed portions of internal conductors embedded in a ceramic body, depositing a copper plating films that cover the metal plating films and make contact with the ceramic body around the metal plating films, and heat-treating the ceramic body to generate a copper liquid phase, an oxygen liquid phase, and a copper solid phase between the copper plating films and the ceramic body. The mixed phase including these phases forms a region at which a copper oxide is present in a discontinuous manner inside the copper plating film at least at the interfaces between the ceramic body and the copper plating films. The copper oxide securely attaches the copper plating films to the ceramic body and enhances the bonding force of the external terminal electrodes.

    摘要翻译： 多层陶瓷电子部件包括外部端子电极，其通过在嵌入陶瓷体的内部导体的露出部分上沉积金属电镀膜而形成，沉积覆盖金属电镀膜的铜电镀膜并与金属周围的陶瓷体接触 并对该陶瓷体进行热处理，以在铜镀膜和陶瓷体之间产生铜液相，氧液相，铜固相。 包括这些相的混合相至少在陶瓷体和镀铜膜之间的界面处形成铜镀层内不连续地存在氧化铜的区域。 铜氧化物将铜电镀膜牢固地附着在陶瓷体上，提高外部端子电极的结合力。

    LAMINATED ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR
    6.
    发明申请
    LAMINATED ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR 有权
    层压电子元件及其制造方法

    公开(公告)号：US20100302704A1

    公开(公告)日：2010-12-02

    申请号：US12788340

    申请日：2010-05-27

    申请人： Makoto OGAWA ,  Akihiro MOTOKI ,  Masahito SARUBAN ,  Toshiyuki IWANAGA ,  Shunsuke TAKEUCHI ,  Kenichi KAWASAKI

    发明人： Makoto OGAWA ,  Akihiro MOTOKI ,  Masahito SARUBAN ,  Toshiyuki IWANAGA ,  Shunsuke TAKEUCHI ,  Kenichi KAWASAKI

    IPC分类号： H01G4/228 ,  B05D5/12

    CPC分类号： H01G4/30 ,  H01G4/2325

    摘要： A method for manufacturing a laminated electronic component includes the steps of preparing a component main body having a laminated structure, the component main body including a plurality of internal electrodes formed therein, and each of the internal electrodes being partially exposed on an external surface of the component main body, and forming an external terminal electrode on the external surface of the component main body such that the external terminal electrode is electrically connected to the internal electrodes. The step of forming the external terminal electrode includes the steps of forming a metal layer on exposed surfaces of the internal electrodes of the component main body, applying a water repellant on at least a surface of the metal layer and on a section of the external surface of the component main body at which an end edge of the metal layer is located, and then forming a conductive resin layer on the metal layer having the water repellant applied thereon.

    摘要翻译： 层叠电子部件的制造方法包括以下步骤：制备具有层叠结构的部件主体，所述部件主体包括形成在其中的多个内部电极，所述内部电极部分地露出在所述内部电极的外表面上 并且在所述部件主体的外表面上形成外部端子电极，使得所述外部端子电极与所述内部电极电连接。 形成外部端子电极的步骤包括以下步骤：在组件主体的内部电极的暴露表面上形成金属层，在金属层的至少一个表面上以及外部表面的一部分上施加斥水剂 在金属层的端缘所在的部件主体上形成导电性树脂层，并且在其上涂敷斥水剂的金属层上形成导电性树脂层。

    LAMINATED ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
    8.
    发明申请
    LAMINATED ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权
    层压电子元件及其制造方法

    公开(公告)号：US20120058257A1

    公开(公告)日：2012-03-08

    申请号：US13295151

    申请日：2011-11-14

    申请人： Shunsuke TAKEUCHI ,  Kenichi KAWASAKI ,  Akihiro MOTOKI ,  Makoto OGAWA ,  Toshiyuki IWANAGA

    发明人： Shunsuke TAKEUCHI ,  Kenichi KAWASAKI ,  Akihiro MOTOKI ,  Makoto OGAWA ,  Toshiyuki IWANAGA

    IPC分类号： B05D5/12

    CPC分类号： H01G4/008 ,  H01G4/005 ,  H01G4/2325 ,  Y10T29/417 ,  Y10T29/43 ,  Y10T29/435

    摘要： A laminated electronic component is configured to include substrate plating films disposed on outer surfaces of an electronic component main body through direct plating such that external terminal electrodes are connected to exposed portions of internal conductors (internal electrodes), and the average particle diameter of metal particles defining the substrate plating film is at least about 1.0 μm. The external terminal electrode includes at least one layer of an upper plating film disposed on the substrate plating film. The metal particles defining the substrate plating film are Cu particles.

    摘要翻译： 层叠电子部件被配置为包括通过直接电镀设置在电子部件主体的外表面上的基板镀膜，使得外部端子电极与内部导体（内部电极）的露出部分连接，金属粒子的平均粒径 限定衬底镀膜至少约1.0μm。 外部端子电极包括设置在基板镀膜上的至少一层上镀层。 限定衬底镀膜的金属颗粒是Cu颗粒。

    LAMINATED ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
    9.
    发明申请
    LAMINATED ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权
    层压电子元件及其制造方法

    公开(公告)号：US20090291317A1

    公开(公告)日：2009-11-26

    申请号：US12466435

    申请日：2009-05-15

    申请人： Kenichi KAWASAKI ,  Shunsuke TAKEUCHI ,  Akihiro MOTOKI ,  Makoto OGAWA ,  Toshiyuki IWANAGA

    发明人： Kenichi KAWASAKI ,  Shunsuke TAKEUCHI ,  Akihiro MOTOKI ,  Makoto OGAWA ,  Toshiyuki IWANAGA

    IPC分类号： B32B5/16 ,  B05D5/12

    CPC分类号： H01G4/005 ,  H01G4/008 ,  H01G4/232

    摘要： A laminated electronic component includes outer terminal electrodes including lower plating films including metal particles having an average size of 0.5 μm or less, the lower plating films being formed by directly plating an outer surface of an electronic component body such that the lower plating films are electrically connected to exposed portions of inner conductors. The outer terminal electrodes may further include upper plating films formed on the lower plating films, the upper plating films being defined by one or more layers. Metal particles defining the upper plating films may have an average size of 0.5 μm or less. The metal particles defining the lower plating films may be Cu particles.

    摘要翻译： 层叠电子部件包括外部端子电极，其包括具有平均尺寸为0.5μm以下的金属粒子的下部电镀膜，下部电镀膜通过直接电镀电子部件主体的外表面而形成，使得下部电镀膜为电气 连接到内部导体的暴露部分。 外部端子电极还可以包括形成在下部镀膜上的上部镀膜，上部镀膜由一层或多层限定。 限定上镀膜的金属颗粒可以具有0.5μm或更小的平均尺寸。 限定下镀层的金属颗粒可以是Cu颗粒。