公开(公告)号：US08254081B2

公开(公告)日：2012-08-28

申请号：US12617879

申请日：2009-11-13

Applicant: Seiichi Nishihara ,  Shuji Matsumoto ,  Akihiro Motoki ,  Makoto Ogawa

Inventor： Seiichi Nishihara ,  Shuji Matsumoto ,  Akihiro Motoki ,  Makoto Ogawa

IPC: H01G4/00

CPC classification number: H01G4/2325 ,  H01G4/30

Abstract: In a laminated ceramic electronic component in which, by directly carrying out a plating process on an outer surface of a component main body, an external electrode is formed thereon, an attempt is made to improve the adhesion strength between a plated film forming the external electrode and the component main body. A brazing material containing Ti is applied to at least one portion of a surface on which external electrodes of a component main body is formed, and by baking this brazing material, a metal layer containing Ti is formed. Moreover, the external electrodes are formed by a plating process so as to coat at least the metal layer, and a heating process is then carried out so as to cause counter diffusion between the metal layer and the plated film that is to form the external electrodes.

Abstract translation: 在层叠陶瓷电子部件中，通过在部件主体的外表面上直接进行电镀处理，在其上形成外部电极，试图提高形成外部电极的镀膜之间的粘合强度 和组件主体。 将包含Ti的钎料施加到其上形成有组分主体的外部电极的表面的至少一部分，并且通过烘烤该钎焊材料，形成含有Ti的金属层。 此外，外部电极通过电镀工艺形成，以便至少涂覆金属层，然后进行加热处理，以使金属层和形成外部电极的镀膜之间产生反扩散 。

公开(公告)号：US08194391B2

公开(公告)日：2012-06-05

申请号：US12340570

申请日：2008-12-19

Applicant: Shunsuke Takeuchi ,  Kenichi Kawasaki ,  Akihiro Motoki ,  Makoto Ogawa ,  Shuji Matsumoto ,  Seiichi Nishihara

Inventor： Shunsuke Takeuchi ,  Kenichi Kawasaki ,  Akihiro Motoki ,  Makoto Ogawa ,  Shuji Matsumoto ,  Seiichi Nishihara

IPC: H01G4/20 ,  H01G4/06 ,  B05D5/12

CPC classification number: H01G4/12 ,  H01G4/005 ,  H01G4/232

Abstract: A multilayer ceramic electronic component including thin external terminal electrodes each having a superior bonding force to a ceramic base body is provided. In order to form the external terminal electrodes, after Cu plating films are deposited on exposed portions of internal electrodes by direct plating on a ceramic base body, a Cu liquid phase, an O2-containing liquid phase, and a Cu solid phase are generated between the Cu plating film and the ceramic base body by a heat treatment, so that Cu oxides are dispersed in the Cu plating film, at least near an interface with the ceramic base body. Since the Cu oxides function as an adhesive, a bonding force of the Cu plating film to the ceramic base body can be increased, and hence the external terminal electrode having a superior bonding force to the ceramic base body can be obtained.

Abstract translation: 提供了一种多层陶瓷电子部件，其包括对陶瓷基体具有优良的结合力的薄的外部端子电极。 为了形成外部端子电极，通过在陶瓷基体上直接电镀将Cu电镀膜沉积在内部电极的露出部分上之后，会产生Cu液相，含O2液相和Cu固相， Cu镀膜和陶瓷基体进行热处理，使得Cu氧化物至少在陶瓷基体的界面附近分散在Cu镀膜中。 由于Cu氧化物作为粘合剂发挥功能，所以可以提高Cu镀膜对陶瓷基体的结合力，因此能够获得与陶瓷基体的粘接力优异的外部端子电极。

公开(公告)号：US20110101913A1

公开(公告)日：2011-05-05

申请号：US12917542

申请日：2010-11-02

Applicant: Shuji MATSUMOTO ,  Youichi Kondou

Inventor： Shuji MATSUMOTO ,  Youichi Kondou

IPC: H02J7/00 ,  H02J7/04

CPC classification number: H01M10/441

Abstract: An electronic device including a first body having a first battery; and a second body having a second battery, the second body being configured to be electrically connected to the first body and separatable from the first body; the first body including: receiving a request for charge of battery from the first body or the second body; retrieving a remaining amount of battery inside the first body and the second body; comparing the battery of the first body and the battery of the second battery on the basis of the retrieved remaining amount of battery; carrying out a charging process for the requested battery indicated by the received request in case that a power source including the not-requested battery satisfies a predetermined requirement as a result of the comparing.

Abstract translation: 一种电子设备，包括具有第一电池的第一主体; 以及具有第二电池的第二主体，所述第二主体被构造成电连接到所述第一主体并且可与所述第一主体分离; 所述第一主体包括：从所述第一主体或所述第二主体接收对电池的充电请求; 检索所述第一主体和所述第二主体内的剩余电量; 基于检索到的电池剩余量，比较第一机体的电池和第二电池的电池; 作为比较的结果，在包括未请求电池的电源满足预定要求的情况下，对由所接收的请求指示的请求电池进行充电处理。

公开(公告)号：US4570969A

公开(公告)日：1986-02-18

申请号：US567904

申请日：1984-01-03

Applicant: Takashi Tsutsumi ,  Shuji Matsumoto

Inventor： Takashi Tsutsumi ,  Shuji Matsumoto

IPC: B60G3/28 ,  B60G3/26 ,  B60G11/18 ,  B60G11/20

CPC classification number: B60G11/181 ,  B60G3/26 ,  B60G2202/132 ,  B60G2204/4307 ,  B60G2204/82 ,  B60G2204/8302

Abstract: A torsion bar suspension is provided with a torsion bar connected to a lower suspension arm and independent of the connection between the lower suspension arm and a vehicle body. The torsion arm is connected to the lower arm at a position remote from the position in which the lower arm is connected to the vehicle body. The torsion bar suspension also includes a compression rod connecting the lower suspension arm to the vehicle body, which compression arm is located outward of the torsion bar and is connected to the vehicle body at a point rearward of its connection to the lower arm. A bushing assembly is provided between the vehicle body and the lower arm allowing lateral and vertical movement of the lower arm relative to the vehicle body.

Abstract translation: 扭杆悬架设置有连接到下悬架臂的扭杆，并且与下悬架臂和车身之间的连接无关。 扭臂在远离下臂与车身连接的位置的位置处连接到下臂。 扭杆悬架还包括将下悬架臂连接到车体的压缩杆，该压缩臂位于扭力杆的外侧，并且在其与下臂的连接的后方相连接到车体。 衬套组件设置在车身和下臂之间，允许下臂相对于车身的侧向和垂直运动。

公开(公告)号：US09123469B2

公开(公告)日：2015-09-01

申请号：US13050977

申请日：2011-03-18

Applicant: Akihiro Motoki ,  Syunsuke Takeuchi ,  Makoto Ogawa ,  Seiichi Nishihara ,  Kenichi Kawasaki ,  Shuji Matsumoto

Inventor： Akihiro Motoki ,  Syunsuke Takeuchi ,  Makoto Ogawa ,  Seiichi Nishihara ,  Kenichi Kawasaki ,  Shuji Matsumoto

IPC: H01G4/005 ,  H01G4/228 ,  H01G4/12 ,  H01G4/30

CPC classification number: H01G4/248 ,  B32B18/00 ,  B32B37/18 ,  B32B2307/202 ,  B32B2315/02 ,  B32B2457/00 ,  C23C18/40 ,  H01G4/005 ,  H01G4/012 ,  H01G4/12 ,  H01G4/228 ,  H01G4/30

Abstract: In a method of forming a plating layer for an external terminal electrode by applying, for example, copper plating to an end surface of a component main body with respective ends of internal electrodes exposed, and then applying a heat treatment at a temperature of about 1000° C. or more in order to improve the adhesion strength and moisture resistance of the external terminal electrode, the plating layer may be partially melted to decrease the bonding strength of the plating layer. In the step of applying a heat treatment at a temperature of about 1000° C. or more to a component main body with plating layers formed thereon, the average rate of temperature increase from room temperature to the temperature of about 1000° C. or more is set to about 100° C./minute or more. This average rate of temperature increase maintains a moderate eutectic state in the plating layer and ensures a sufficient bonding strength of the plating layer.

Abstract translation: 在形成外部端子电极用镀层的方法中，例如通过对内部电极的两端露出的部件主体的端面进行镀铜，然后在约1000℃的温度下进行热处理 ℃以上，为了提高外部端子电极的粘合强度和耐湿性，可以使镀层部分熔融，降低镀层的接合强度。 在其上形成有镀层的组件主体上，在约1000℃以上的温度下进行热处理的步骤中，平均温度从室温升高至约1000℃以上的温度 设定为约100℃/分钟以上。 该平均升温速率在镀层中保持中等的共晶状态，并确保镀层的充分的接合强度。

公开(公告)号：US08471139B2

公开(公告)日：2013-06-25

申请号：US12978008

申请日：2010-12-23

Applicant: Takanori Nakamura ,  Shuji Matsumoto

Inventor： Takanori Nakamura ,  Shuji Matsumoto

IPC: H01L35/02 ,  H01L35/34

CPC classification number: H01L35/32 ,  H01L35/34

Abstract: A thermoelectric conversion module which has a P-type thermoelectric conversion material and an N-type thermoelectric conversion material electrically connected to each other. The P-type thermoelectric conversion material and the N-type thermoelectric conversion material are joined with insulating material particles (ceramic spherical particles) interposed therebetween, so as not to be electrically connected to each other. The insulating material particles are joined to the P-type thermoelectric conversion material with a first adhesive material interposed therebetween and to the N-type thermoelectric conversion material with a second adhesive material interposed therebetween, and the P-type thermoelectric conversion material and the N-type thermoelectric conversion material are electrically connected to each other in a region other than the region in which the thermoelectric conversion materials are joined with the first and second adhesive material and the insulating material particles interposed therebetween.

Abstract translation: 具有彼此电连接的P型热电转换材料和N型热电转换材料的热电转换模块。 P型热电转换材料和N型热电转换材料之间插入绝缘材料颗粒（陶瓷球形颗粒），以便不彼此电连接。 绝缘材料颗粒与插入其间的第一粘合材料的P型热电转换材料和介于其间的第二粘合材料的N型热电转换材料接合，并且P型热电转换材料和N-型热电转换材料， 型热电转换材料在热电转换材料与第一和第二粘合材料接合的区域之外的区域中以及介于其间的绝缘材料颗粒彼此电连接。

公开(公告)号：US20120183682A1

公开(公告)日：2012-07-19

申请号：US13433320

申请日：2012-03-29

Applicant: Shunsuke Takeuchi ,  Kenichi Kawasaki ,  Akihiro Motoki ,  Makoto Ogawa ,  Shuji Matsumoto ,  Seiichi Nishihara

Inventor： Shunsuke Takeuchi ,  Kenichi Kawasaki ,  Akihiro Motoki ,  Makoto Ogawa ,  Shuji Matsumoto ,  Seiichi Nishihara

IPC: B05D5/00 ,  B05D3/02

CPC classification number: H01G4/12 ,  H01G4/005 ,  H01G4/232

Abstract: A multilayer ceramic electronic component including thin external terminal electrodes each having a superior bonding force to a ceramic base body is provided. In order to form the external terminal electrodes, after Cu plating films are deposited on exposed portions of internal electrodes by direct plating on a ceramic base body, a Cu liquid phase, an O2-containing liquid phase, and a Cu solid phase are generated between the Cu plating film and the ceramic base body by a heat treatment, so that Cu oxides are dispersed in the Cu plating film, at least near an interface with the ceramic base body. Since the Cu oxides function as an adhesive, a bonding force of the Cu plating film to the ceramic base body can be increased, and hence the external terminal electrode having a superior bonding force to the ceramic base body can be obtained.

Abstract translation: 提供了一种多层陶瓷电子部件，其包括对陶瓷基体具有优良的结合力的薄的外部端子电极。 为了形成外部端子电极，通过在陶瓷基体上直接电镀将Cu电镀膜沉积在内部电极的露出部分上之后，会产生Cu液相，含O2液相和Cu固相， Cu镀膜和陶瓷基体进行热处理，使得Cu氧化物至少在陶瓷基体的界面附近分散在Cu镀膜中。 由于Cu氧化物作为粘合剂发挥功能，所以可以提高Cu镀膜对陶瓷基体的结合力，因此能够获得与陶瓷基体的粘接力优异的外部端子电极。

公开(公告)号：US08077445B2

公开(公告)日：2011-12-13

申请号：US12405370

申请日：2009-03-17

Applicant: Toshiyuki Iwanaga ,  Akihiro Motoki ,  Makoto Ogawa ,  Kenichi Kawasaki ,  Shunsuke Takeuchi ,  Seiichi Nishihara ,  Shuji Matsumoto

Inventor： Toshiyuki Iwanaga ,  Akihiro Motoki ,  Makoto Ogawa ,  Kenichi Kawasaki ,  Shunsuke Takeuchi ,  Seiichi Nishihara ,  Shuji Matsumoto

IPC: H01G4/00

CPC classification number: H01G4/30 ,  B32B18/00 ,  C04B2237/346 ,  C04B2237/66 ,  C04B2237/68 ,  C04B2237/704 ,  H01C1/142 ,  H01C7/008 ,  H01G4/232 ,  Y10T428/265 ,  Y10T428/31678

Abstract: A method for manufacturing a monolithic ceramic electronic component includes a plating substep of depositing precipitates primarily composed of a specific metal on an end of each of internal electrodes exposed at a predetermined surface of a laminate and growing the precipitates to coalesce into a continuous plated layer, wherein the specific metal is different from that of the internal electrodes, and the same or substantially the same metal that defines the internal electrodes is distributed throughout the plated layer.

Abstract translation: 一种用于制造单块陶瓷电子部件的方法包括：在层叠体的预定表面露出的每个内部电极的端部上沉积主要由特定金属构成的析出物的电镀子步骤，并使析出物凝聚成连续镀层， 其中特定金属与内部电极不同，并且限定内部电极的相同或基本相同的金属分布在整个镀层中。

公开(公告)号：US06468447B2

公开(公告)日：2002-10-22

申请号：US09842222

申请日：2001-04-25

Applicant: Shuji Matsumoto

Inventor： Shuji Matsumoto

IPC: H01B116

CPC classification number: H05K1/092 ,  C03C8/18 ,  H01B1/16 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10S428/901 ,  H01L2924/00

Abstract: Provided is an electroconductive paste comprising copper powders, a glass powder, and an organic vehicle, wherein: the copper powders comprise (1) from about 50% to 90% by weight of a copper powder A containing from about 1% to 3% by weight of oxygen and having an average particle size of from about 0.9 to 1.5 &mgr;m; and (2) from about 10% to 50% by weight of a copper powder B containing from about 0.2% to 3% by weight of oxygen and having an average particle size of not more than about 0.6 &mgr;m. It has an excellent electroconductivity as well as a sufficiently large bonding strength to a board.

Abstract translation: 本发明提供一种包含铜粉末，玻璃粉末和有机载体的导电浆料，其中：所述铜粉末包含（1）约50重量％至90重量％的含有约1重量％至3重量％ 氧的重量，其平均粒度为约0.9至1.5μm; 和（2）约10重量％至50重量％的含有约0.2重量％至3重量％氧的平均粒度不超过约0.6微米的铜粉B。 它具有优异的导电性以及对板的足够大的粘结强度。

公开(公告)号：US20100021509A1

公开(公告)日：2010-01-28

申请号：US12311697

申请日：2007-07-31

Applicant: Shuji Matsumoto ,  Naoyuki Enomoto ,  Yasutaka Miyoshi ,  Takumi Miyazaki

Inventor： Shuji Matsumoto ,  Naoyuki Enomoto ,  Yasutaka Miyoshi ,  Takumi Miyazaki

IPC: A61K8/02 ,  A61K8/19 ,  A61K8/29 ,  A61Q90/00

CPC classification number: A61K8/29 ,  A61K8/0258 ,  A61K8/19 ,  A61K8/26 ,  A61K2800/412 ,  A61K2800/43 ,  A61K2800/621 ,  A61Q1/12 ,  C01P2004/61 ,  C09C1/0015 ,  C09C1/0081 ,  C09C2200/102 ,  C09C2200/505

Abstract: This invention provides cosmetics containing a multi-functional composite powder having the properties of (a) an excellent adhesiveness, (b) an excellent extendability, (c) an appropriate glossy effect, (d) a homogeneous cosmetic film, (e) an appropriate covering capability, (f) a cosmetic film not causing a white masking, (g) a high compatibility between a color appearance of cosmetics and a color tone of the cosmetic film, (h) an excellent soft-focusing capability, (i) an excellent ultraviolet protective effect, and the like. The multi-functional composite powder is constituted by a scale-like base material, a group of particles comprising at least fine particles of titanium dioxide deposited on a surface of the scale-like base material, and a thin film of a composite oxide containing titanium and iron coated thereon.

Abstract translation: 本发明提供了含有（a）优异粘合性，（b）优异的延展性，（c）适当的光泽效果，（d）均匀的化妆品膜，（e）适当的 覆盖能力，（f）不引起白色掩蔽的化妆品膜，（g）化妆品的外观和化妆品膜的色调之间的高相容性，（h）优异的软聚焦能力，（i） 优异的紫外线防护效果等。 多功能复合粉末由鳞状基材构成，一组至少包含沉积在鳞状基材表面上的二氧化钛的细颗粒和含有钛的复合氧化物的薄膜 并在其上涂覆铁。