公开(公告)号：US20110023679A1

公开(公告)日：2011-02-03

申请号：US12794904

申请日：2010-06-07

申请人： Toshiyuki MAJIMA ,  Kazuo Nishimura

发明人： Toshiyuki MAJIMA ,  Kazuo Nishimura

IPC分类号： B26D5/16

CPC分类号： B26D5/16 ,  B26F1/0092 ,  B26F1/02 ,  Y10T83/8828 ,  Y10T83/8831 ,  Y10T83/8843 ,  Y10T83/9423 ,  Y10T83/943 ,  Y10T83/944

摘要： There is provided a punching unit capable of punching holes in high-performance by increasing a punching force and by rotating a punch while keeping the same basic structure with that of a prior art unit. A guide hole that guides the punch in the vertical direction is formed to have a narrow upper part, a wider narrow part and inclined surfaces between them. An actuation pin engages with a cam and the punch moves up and down to punch a hole when a cam member reciprocates. The actuation pin abuts with the inclined surface of the guide hole at the punching position, so that the punch is rotated and a cam inclined angle is reduced by an inclined angle of the guide hole, allowing a large punching force.

摘要翻译： 提供了一种能够通过增加冲压力并且通过旋转冲头同时保持与现有技术单元的基本结构相同的基本结构来冲孔高性能的冲孔单元。 引导冲头在垂直方向上的引导孔形成为具有窄的上部，较窄的窄部分和它们之间的倾斜表面。 致动销与凸轮接合，并且当凸轮构件往复运动时，冲头上下移动以冲孔。 致动销在冲孔位置与导向孔的倾斜面抵接，使得冲头旋转，并且凸轮倾斜角度减小导向孔的倾斜角度，允许大的冲压力。

公开(公告)号：US20080020498A1

公开(公告)日：2008-01-24

申请号：US11861089

申请日：2007-09-25

申请人： Masayoshi OKAMOTO ,  Yoshiaki HASEGAWA ,  Yasuhiro MOTOYAMA ,  Hideyuki MATSUMOTO ,  Shingo YORISAKI ,  Akio HASEBE ,  Ryuji SHIBATA ,  Yasunori NARIZUKA ,  Akira YABUSHITA ,  Toshiyuki MAJIMA

发明人： Masayoshi OKAMOTO ,  Yoshiaki HASEGAWA ,  Yasuhiro MOTOYAMA ,  Hideyuki MATSUMOTO ,  Shingo YORISAKI ,  Akio HASEBE ,  Ryuji SHIBATA ,  Yasunori NARIZUKA ,  Akira YABUSHITA ,  Toshiyuki MAJIMA

IPC分类号： H01L21/66

CPC分类号： H01L22/14 ,  G01R1/06711 ,  G01R1/06744 ,  G01R1/07307 ,  G01R3/00 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/45144 ,  H01L2224/48453 ,  H01L2224/48463 ,  H01L2224/49171 ,  H01L2924/014 ,  H01L2924/3011 ,  H01L2924/00

摘要： To permit electrical testing of a semiconductor integrated circuit device having test pads disposed at narrow pitches probes in a pyramid or trapezoidal pyramid form are formed from metal films formed by stacking a rhodium film and a nickel film successively. Via through-holes are formed in a polyimide film between interconnects and the metal films, and the interconnects are electrically connected to the metal films. A plane pattern of one of the metal films equipped with one probe and through-hole is obtained by turning a plane pattern of the other metal film equipped with the other probe and through-hole through a predetermined angle.

摘要翻译： 为了允许具有金字塔或梯形金字塔形式的窄间距探针设置的测试焊盘的半导体集成电路器件进行电气测试，是由依次层叠铑膜和镍膜而形成的金属膜形成的。 在互连和金属膜之间的聚酰亚胺膜中形成通孔，并且互连电连接到金属膜。 通过将配备有另一个探针和通孔的另一金属膜的平面图案转过预定角度，获得装配有一个探针和通孔的金属膜之一的平面图案。

公开(公告)号：US20110136272A1

公开(公告)日：2011-06-09

申请号：US13019166

申请日：2011-02-01

申请人： Masayoshi OKAMOTO ,  Yoshiaki HASEGAWA ,  Yasuhiro MOTOYAMA ,  Hideyuki MATSUMOTO ,  Shingo YORISAKI ,  Akio HASEBE ,  Ryuji SHIBATA ,  Yasunori NARIZUKA ,  Akira YABUSHITA ,  Toshiyuki MAJIMA

发明人： Masayoshi OKAMOTO ,  Yoshiaki HASEGAWA ,  Yasuhiro MOTOYAMA ,  Hideyuki MATSUMOTO ,  Shingo YORISAKI ,  Akio HASEBE ,  Ryuji SHIBATA ,  Yasunori NARIZUKA ,  Akira YABUSHITA ,  Toshiyuki MAJIMA

IPC分类号： H01L21/66

CPC分类号： H01L22/14 ,  G01R1/06711 ,  G01R1/06744 ,  G01R1/07307 ,  G01R3/00 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/45144 ,  H01L2224/48453 ,  H01L2224/48463 ,  H01L2224/49171 ,  H01L2924/014 ,  H01L2924/3011 ,  H01L2924/00

摘要： To permit electrical testing of a semiconductor integrated circuit device having test pads disposed at narrow pitches probes in a pyramid or trapezoidal pyramid form are formed from metal films formed by stacking a rhodium film and a nickel film successively. Via through-holes are formed in a polyimide film between interconnects and the metal films, and the interconnects are electrically connected to the metal films. A plane pattern of one of the metal films equipped with one probe and through-hole is obtained by turning a plane pattern of the other metal film equipped with the other probe and through-hole through a predetermined angle.

摘要翻译： 为了允许具有金字塔或梯形金字塔形式的窄间距探针设置的测试焊盘的半导体集成电路器件进行电气测试，是由依次层叠铑膜和镍膜而形成的金属膜形成的。 在互连和金属膜之间的聚酰亚胺膜中形成通孔，并且互连电连接到金属膜。 通过将配备有另一个探针和通孔的另一金属膜的平面图案转过预定角度，获得装配有一个探针和通孔的金属膜之一的平面图案。