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1.发明授权Materials and methods for immobilization of catalysts on surfaces and for selective electroless metallization 有权用于固定催化剂在表面上和用于选择性无电镀金属化的材料和方法公开(公告)号：US07862860B2
公开(公告)日：2011-01-04
申请号：US11438248
申请日：2006-05-22
CPC分类号： B01J31/2404 , B01J23/72 , B01J23/755 , B01J31/06 , B01J31/1658 , B01J31/185 , B01J31/2409 , B01J35/04 , B01J37/0217 , B01J2231/4205 , B01J2231/4261 , B01J2531/824 , C23C18/1608 , C23C18/1893 , C23C18/2086 , C23C18/30
摘要： A method of immobilizing a catalyst on a substrate surface involves providing novel ligating copolymers comprising functional groups capable of binding to a substrate surface and functional groups capable of ligating to catalysts such as metal ions, metal complexes, nanoparticles, or colloids; applying the ligating copolymer to a substrate surface to cause the ligating copolymer to bind thereto, and contacting the modified substrate surface with a solution of a catalyst, causing the catalyst to be ligated by the ligating copolymer and thus immobilized on the substrate surface. The ligating copolymer may be patterned on the substrate surface using a method such as microcontact printing. A method of selectively metallizing a substrate in a desired pattern involves using a ligating chemical agent comprising functional groups capable of binding to a substrate surface and functional groups capable of ligating to electroless plating catalysts; applying the ligating chemical agent to a substrate in a desired pattern using microcontact printing to cause the ligating chemical agent to bind thereto; contacting the modified substrate surface with a solution of an electroless plating catalyst, causing the catalyst to be ligated by the ligating chemical agent and thus bound to the surface; and metallizing the catalyzed regions of the substrate surface using electroless plating.
摘要翻译： 将催化剂固定在基材表面上的方法包括提供包含能够结合底物表面的官能团和能够连接到催化剂如金属离子，金属络合物，纳米颗粒或胶体的官能团的新型连接共聚物; 将连接共聚物施加到基材表面以使连接共聚物与其结合，并使改性的基材表面与催化剂的溶液接触，使催化剂通过连接共聚物连接，从而固定在基材表面上。 连接共聚物可以使用诸如微接触印刷的方法在基材表面上图案化。 以期望的图案选择性地金属化基底的方法包括使用包含能够结合底物表面的官能团和能够连接到化学镀催化剂的官能团的连接化学试剂; 使用微接触印刷将结合的化学试剂以期望的图案施加到基底上以使结合的化学试剂与其结合; 使改性的基材表面与化学镀催化剂的溶液接触，使催化剂被连接的化学试剂连接并因此结合到表面上; 以及使用化学镀将金属化衬底表面的催化区域。
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2.发明授权Materials and methods for immobilization of catalysts on surfaces and for selective electroless metallization 有权用于固定催化剂在表面上和用于选择性无电镀金属化的材料和方法公开(公告)号：US08574680B2
公开(公告)日：2013-11-05
申请号：US12982014
申请日：2010-12-30
CPC分类号： B01J31/2404 , B01J23/72 , B01J23/755 , B01J31/06 , B01J31/1658 , B01J31/185 , B01J31/2409 , B01J35/04 , B01J37/0217 , B01J2231/4205 , B01J2231/4261 , B01J2531/824 , C23C18/1608 , C23C18/1893 , C23C18/2086 , C23C18/30
摘要： A method of rendering a substrate catalytic to electroless metal deposition comprising the steps of: (a) depositing a ligating chemical agent on the substrate, which is capable of both binding to the substrate and ligating to an electroless plating catalyst; and (b) ligating the electroless plating catalyst to the ligating chemical agent,wherein the ligating chemical agent has the chemical structure:
摘要翻译： 一种将底物催化成无电金属沉积的方法，包括以下步骤：（a）在基材上沉积连接的化学试剂，其能够结合底物并与无电镀催化剂连接; 和（b）将化学镀催化剂连接到连接化学试剂上，其中连接化学试剂具有以下化学结构：
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公开(公告)号：US07087267B2
公开(公告)日：2006-08-08
申请号：US09998007
申请日：2001-11-29
CPC分类号： B01J31/1658 , B01J23/72 , B01J23/755 , B01J31/06 , B01J31/185 , B01J31/2409 , B01J35/04 , B01J37/0217 , B01J2231/4205 , B01J2231/4261 , B01J2531/824 , C23C18/1608 , C23C18/285 , C23C18/30 , Y10T428/24917
摘要： A method of immobilizing a catalyst on a substrate surface involves providing novel ligating copolymers comprising functional groups capable of binding to a substrate surface and functional groups capable of ligating to catalysts such as metal ions, metal complexes, nanoparticles, or colloids; applying the ligating copolymer to a substrate surface to cause the ligating copolymer to bind thereto, and contacting the modified substrate surface with a solution of a catalyst, causing the catalyst to be ligated by the ligating copolymer and thus immobilized on the substrate surface. The ligating copolymer may be patterned on the substrate surface using a method such as microcontact printing. A method of selectively metallizing a substrate in a desired pattern involves using a ligating chemical agent comprising functional groups capable of binding to a substrate surface and functional groups capable of ligating to electroless plating catalysts; applying the ligating chemical agent to a substrate in a desired pattern using microcontact printing to cause the ligating chemical agent to bind thereto; contacting the modified substrate surface with a solution of an electroless plating catalyst, causing the catalyst to be ligated by the ligating chemical agent and thus bound to the surface; and metallizing the catalyzed regions of the substrate surface using electroless plating.
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