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公开(公告)号:US20180158785A1
公开(公告)日:2018-06-07
申请号:US15718919
申请日:2017-09-28
发明人: Wenjian ZHANG , Qingjun ZHANG , Yuanjing LI , Zhiqiang CHEN , Ziran ZHAO , Yinong LIU , Yaohong LIU , Xiang ZOU , Huishao HE , Weishu LI , Nan BAI
IPC分类号: H01L23/00 , H01L31/02 , H01L31/024 , H01L31/18 , H01L23/15 , H01L23/498
摘要: The present disclosure proposes a packaging structure for a metallic bonding based opto-electronic device and a manufacturing method thereof. According to the embodiments, the packaging structure for an opto-electronic device may comprise an opto-electronic chip and a packaging base. The opto-electronic chip comprises: a substrate having a first substrate surface and a second substrate surface opposite to each other; an opto-electronic device formed on the substrate; and electrodes for the opto-electronic device which are formed on the first substrate surface. The packaging base has a first base surface and a second base surface opposite to each other, and comprises conductive channels extending from the first base surface to the second base surface. The opto-electronic chip is stacked on the packaging base in such a manner that the first substrate surface faces the packaging base, and the electrodes formed on the first substrate surface of the opto-electronic chip are bonded with corresponding conductive channels in the packaging base.
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公开(公告)号:US20170068003A1
公开(公告)日:2017-03-09
申请号:US15258209
申请日:2016-09-07
发明人: Qingjun ZHANG , Yuanjing LI , Zhiqiang CHEN , Ziran ZHAO , Yinong LIU , Yaohong LIU , Xiang ZOU , Huishao HE , Shuwei LI , Jianping CHANG , Wenjian ZHANG
CPC分类号: G01T7/00 , G01J1/0271 , G01J2001/0276
摘要: The invention discloses a safety inspection detector and a goods safety inspection system. The safety inspection detector at least comprises a circuit board, a first housing, a second housing, a detection module and a connecting interface. The detection module and the connecting interface are mounted on the circuit board. The first housing is pressed and connected to a first surface of the circuit board, and the second housing is pressed and connected to a second surface of the circuit board. The first housing and the second housing can hermetically wrap the detection module and electronic devices on the circuit board, but bypass the connecting interface to realize leading-out and connection with related interconnected cables by utilizing the connecting interface. The housings can be used for sealing and protecting sensitive electronic devices in the detector, thus being moisture proof and preventing interference.
摘要翻译: 本发明公开了一种安全检查检测器和货物安全检查系统。 安全检查检测器至少包括电路板,第一壳体,第二壳体,检测模块和连接接口。 检测模块和连接接口安装在电路板上。 第一壳体被按压并连接到电路板的第一表面,并且第二壳体被按压并连接到电路板的第二表面。 第一壳体和第二壳体可以将检测模块和电子设备封装在电路板上,但绕过连接接口,通过利用连接接口实现与相关互连电缆的导出和连接。 这些外壳可用于密封和保护检测器中敏感的电子设备,从而防潮并防止干扰。
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公开(公告)号:US20160187500A1
公开(公告)日:2016-06-30
申请号:US14983411
申请日:2015-12-29
发明人: Yanchun WANG , Qingjun ZHANG , Yuanjing LI , Zhiqiang CHEN , Ziran ZHAO , Yinong LIU , Yaohong LIU , Jianping CHANG , Wenjian ZHANG , Shuqing ZHAO , Xiang ZOU , Yongqiang WANG
IPC分类号: G01T1/202
CPC分类号: G01T1/2018
摘要: A method for processing a ceramic scintillator array, characterized in that, comprising the following steps: (a) forming, in a first direction, a predetermined number of straight first-direction through-cuts which are parallel to each other and spaced from each other on a scintillator substrate by using laser; (b) adequately filling the first-direction through-cuts with an adhesive and solidifying the adhesive; (c) forming, in a second direction. a predetermined number of second direction through-cuts which are parallel to each other at a predetermined interval on the scintillator substrate by using laser, wherein the second direction is perpendicular to the first direction; and (d) adequately filling the second direction through-cuts with the adhesive and solidifying the adhesive bond.
摘要翻译: 一种用于处理陶瓷闪烁体阵列的方法,其特征在于包括以下步骤:(a)在第一方向上形成预定数量的彼此平行并且彼此间隔开的直的第一方向贯穿切口 通过使用激光在闪烁体衬底上; (b)用粘合剂充分填充第一方向贯穿切割并固化粘合剂; (c)在第二方向上形成。 通过使用激光在闪烁体基板上以预定间隔彼此平行的预定数量的第二方向贯穿切割,其中所述第二方向垂直于所述第一方向; 和(d)用粘合剂充分填充第二方向贯穿切割并固化粘合剂粘结。
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公开(公告)号:US20180188388A1
公开(公告)日:2018-07-05
申请号:US15856303
申请日:2017-12-28
发明人: Bozhen ZHAO , Qingjun ZHANG , Ziran ZHAO , Shuwei LI , Lifeng SUN , Wenjian ZHANG
IPC分类号: G01T1/20
摘要: A radiation detector assembly and a method of manufacturing the same are provided. The radiation detector assembly includes a base and an outer encapsulation layer. The base includes a scintillator having a light-entering surface and a light-exiting surface on both ends thereof, respectively; a reflection layer provided on the light-entering surface and an outer peripheral surface of the scintillator; a photosensor comprising a photosensitive surface and an encapsulation housing, the photosensitive surface is coupled to the light-exiting surface via an optical adhesive; and an inner encapsulation layer adhered to an outer surface of the reflection layer and hermetically encapsulates a coupling portion where the scintillator and the photosensor connected with each other. the outer encapsulation layer is provided on the outer surface of the base.
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公开(公告)号:US20190302281A1
公开(公告)日:2019-10-03
申请号:US16365910
申请日:2019-03-27
发明人: Shuwei LI , Qingjun ZHANG , Xiang ZOU , Bozhen ZHAO , Junxiao WANG , Weibin ZHU , Yongqiang WANG , Wenjian ZHANG
摘要: The present disclosure provides a dual-energy detection apparatus and method. The dual-energy detection apparatus includes an X-ray source configured to send a first X-ray beam to an object to be measured; a scintillation detector configured to work in an integration mode, and receive a second X-ray beam penetrating through the object to be measured to generate a first electrical signal; a Cherenkov detector configured to be located behind the scintillation detector, work in a counting mode, and receive a third X-ray beam penetrating through the scintillation detector to generate a second electrical signal; and a processor configured to output image, thickness and material information of the object to be measured according to the first electrical signal and the second electrical signal. The dual-energy detection method provided by the present disclosure may acquire an image of the object to be measured that is clearer and contains more information.
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