Abstract:
A package structure for an LED is disclosed. The structure includes a first substrate, an LED chip, a second substrate, a protection layer and a replaceable optical element. The LED chip is disposed on the first substrate. The second substrate is disposed on the first substrate, and surrounds the LED chip. The second substrate has a first thread. The protection layer covers the LED chip. The replaceable optical element has a second thread, and is fastened to the second substrate through the first thread. An interior wall of the optical element corresponds to a surface of the protection layer in arc shape.
Abstract:
An optical system for sensing, identification and driving is applied to drive a working system executing at least one preset assignment. The optical system comprises an optical identification card and a driving unit. The identification card comprises at least one driving light source for projecting at least one driving light beam having a driving optical property. The driving unit has a standard optical property for representing the preset assignment. When the driving optical property complies with the standard optical property, the driving light beam drives the working system executing the preset assignment that the standard optical property represents.
Abstract:
A heat dissipating apparatus for lighting utility includes a casing, a light-focusing unit, a light-reflecting unit, a heat-dissipating unit, a light generator, a wind generator, a cover and a circuit board. The heat-dissipating unit absorbs a heat generated from the light generator, the wind generator circulates air outside the casing and inside the casing, whereby the heat absorbed by the heat-dissipating unit is dissipated outside the casing.
Abstract:
A rotor type orientation sensor includes a housing, a plurality of light emitters, two light receivers and a rotor. The housing has a circular tunnel and a plurality of first openings connecting to the tunnel and two second openings located on two sides of the first openings. The light emitters emit light into the tunnel through the first openings. The light receivers receive light from the tunnel through the second openings. The rotor is arranged in the tunnel, whereby while the rotor type orientation sensor is tilting, the rotor rotates toward the direction of gravity force, at least a portion of light emitted from the light emitters is blocked by the rotor, one of the light receivers is blocked by the rotor, the light receivers can respectively receive light with predetermined intensity and correspondingly output electric signals with predetermined strength.
Abstract:
A modulated lighting device is applied to provide modulated illumination toward a selected region. The device comprises a light box shell, a plurality of Light Emitting Diodes (LEDs), and a plurality of modulation assemblies. The light box shell comprises at least one illumination opening, the LEDs are arranged within the shell for providing a plurality of injection light beams, and the modulation assemblies are arranged in a preset array and pivotally connected with the light box shell neighboring to the illumination opening. Each modulation assembly comprises at least one reflection element to reflect the injection light beams for generating at least one illumination light beam. Thereafter, the illuminating light beams generated from the modulation assemblies pass through the illumination opening, and each of the illuminating light beams is modulated with the neighbor illuminating light beams to provide modulated illuminating toward the selected region.
Abstract:
A method of manufacturing aluminum oxide (Al2O3) substrate is disclosed. In this method, an aluminum planking is provided first, and then proceeding a chemical reaction is proceeded on the surface of the aluminum planking to form an Al2O3 layer, and finally, the aluminum oxide layer is separated from the aluminum planking by corroding the aluminum portion of the aluminum planking with chemical solution, grinding the aluminum portion or slicing the aluminum portion.
Abstract translation:公开了一种制造氧化铝(Al 2 O 3)衬底的方法。 在该方法中,首先提供铝板,然后在铝板的表面上进行化学反应,形成Al 2 O 3层,最后,通过腐蚀铝部分将氧化铝层与铝板隔离开来 的化学溶液的铝板,研磨铝部分或切片铝部分。
Abstract:
An illumination assembly comprises a base and at least one illumination cell. The base comprises a supply circuit for supplying an external power after connecting to a power source. The illumination cell is optionally connected to the base or removed from thereof, and includes a power storage unit stored with a storage power, a discharging circuit, and a charging circuit, wherein the power storage unit is electrically connected to the discharging circuit and the charging circuit. When the illumination cell is removed from the base, the storage power released from the power storage unit drives the illumination cell projecting an illumination light beam via the discharging circuit. When the illumination cell is assembled to the base, the supply circuit is electrically connected to the discharging circuit and the charging circuit respectively, so that the external power can drive the illumination cell projecting the illumination light beam and charge the power storage unit simultaneously.
Abstract:
A structure of heat dissipation of implant type light emitting diode package having a heat column and a method of manufacturing the same include a substrate, a heat column, and a light emitting diode chip, and the heat column is implanted directly onto a predetermined position of the light emitting diode chip of the substrate and penetrated through both surfaces of a circuit board, and a distal surface of the heat column is coupled with the light emitting diode chip to form a heat conducting end, so that the operating heat produced by a light emitting diode can be dispersed from the package structure through the heat column, so as to achieve an optimal heat dissipating effect.
Abstract:
A heat dissipating apparatus for lighting utility includes a casing, a light-focusing unit, a light-reflecting unit, a heat-dissipating unit, a light generator, a wind generator, a cover and a circuit board. The heat-dissipating unit absorbs a heat generated from the light generator, the wind generator circulates air outside the casing and inside the casing, whereby the heat absorbed by the heat-dissipating unit is dissipated outside the casing.