System and method for detecting particles produced in a process chamber
by scattering light
    2.
    发明授权
    System and method for detecting particles produced in a process chamber by scattering light 失效
    用于通过散射光检测在处理室中产生的颗粒的系统和方法

    公开(公告)号:US6115120A

    公开(公告)日:2000-09-05

    申请号:US413590

    申请日:1999-10-06

    CPC分类号: G01N15/0227 G01N21/53

    摘要: Particles generated within a semiconductor wafer process chamber are monitored by emitting a rastered laser beam into the process chamber and detecting a two-dimensional image of scattered radiant energy within the process chamber. A video frame representing a matrix array of pixel intensities is produced and processed by a processor. The processor receives first and second video frames, the first frame representing a matrix array of pixels of a background image of the process chamber before a wafer processing is started and the second frame representing a matrix array of corresponding pixels of a target image of the process changer after a wafer processing is started. Differential intensities between the pixels of the background image and corresponding pixels of the target image are detected and a decision is made on the detected intensities to produce an output signal representing presence or absence of the particles.

    摘要翻译: 在半导体晶片处理室内产生的颗粒通过将成像激光束发射到处理室中并检测处理室内的散射辐射能的二维图像来监测。 表示像素强度的矩阵阵列的视频帧由处理器产生和处理。 处理器接收第一和第二视频帧,第一帧表示在晶片处理开始之前处理室的背景图像的矩阵阵列,并且第二帧表示处理的目标图像的对应像素的矩阵阵列 在晶片处理开始之后更换器。 检测背景图像的像素与目标图像的对应像素之间的差分强度,并且对所检测的强度进行判定,以产生表示颗粒存在或不存在的输出信号。

    Method and apparatus for plasma etching
    5.
    发明授权
    Method and apparatus for plasma etching 失效
    等离子体蚀刻的方法和装置

    公开(公告)号:US06306770B1

    公开(公告)日:2001-10-23

    申请号:US09273293

    申请日:1999-03-19

    IPC分类号: H01L21302

    CPC分类号: H01J37/32862 C23F4/00

    摘要: A plasma etching apparatus includes a processing chamber for etch-processing a substrate, a lower electrode located within the processing chamber for holding the substrate on an upper surface thereof by an electrostatic attraction, and an upper electrode located to face the lower electrode. A purge gas introducing port is provided at a side wall of the processing chamber at a position which is between the upper electrode and the lower electrode in height and which opposes to the evacuation port in a plan view in such a manner that the lower electrode is positioned between the evacuation port and the purge gas introducing port in the plan view. A plasma etching method includes the steps of holding the substrate on the lower electrode in such a condition that a surface to be etched of the substrate is faced upwards, then introducing a process gas into the processing chamber, applying a high frequency voltage between the lower electrode and the upper electrode to generate a plasma gas in a low pressure so as to etch the substrate, and thereafter, introducing a purge gas into the process chamber at the time of completion of the processing. At the time of completing the processing, the supplying of the process gas is stopped and it starts to supply the purge gas into the processing chamber, and thereafter, when a predetermined time has elapsed, the application of the high frequency voltage is stopped.

    摘要翻译: 等离子体蚀刻装置包括用于对衬底进行蚀刻处理的处理室,位于处理室内的用于通过静电引力将衬底保持在其上表面上的下电极和位于下电极的上电极。 吹扫气体导入口设置在处理室的侧壁处于上部电极和下部电极之间的高度位置,并且在平面图中以与下部电极相反的方式设置在下部电极为 在平面图中位于排气口和净化气体导入口之间。 等离子体蚀刻方法包括以下步骤:在基板的被蚀刻表面朝上的状态下将基板保持在下电极上,然后将处理气体引入处理室,在下部电极之间施加高频电压 电极和上电极,以产生低压的等离子体气体,以蚀刻基板,然后在处理完成时将吹扫气体引入处理室。 在完成处理时,停止处理气体的供给,并且开始向处理室供应净化气体,此后,当经过预定时间时,停止施加高频电压。

    Apparatus for monitoring particles and method of doing the same
    9.
    发明授权
    Apparatus for monitoring particles and method of doing the same 失效
    用于监测颗粒的装置及其做法

    公开(公告)号:US07006682B1

    公开(公告)日:2006-02-28

    申请号:US09656713

    申请日:2000-09-07

    IPC分类号: G06K9/00

    CPC分类号: G01N15/1463 G01N2015/1493

    摘要: There is provided an apparatus for monitoring a size of a particle, including (a) a laser beam source which radiates a laser beam to an area in which particles exist, (b) a photodetector which receives the laser beam having been scattered by the particles, and outputs image data including brightness of pixels, (c) an area detector which detects pixels corresponding to an area on which the scattered laser beam is incident, based on the image data, (d) a maximum brightness detector which detects a maximum brightness among brightness of the pixels detected by the area detector, and (e) a measurement unit which compares the maximum brightness to a predetermined threshold brightness to thereby measure a relative size of the particles.

    摘要翻译: 提供了一种用于监测颗粒尺寸的装置,包括(a)将激光束照射到存在颗粒的区域的激光束源,(b)接收由颗粒散射的激光束的光电检测器 ,输出包括像素亮度的图像数据,(c)基于图像数据检测与散射激光束入射的区域对应的像素的区域检测器,(d)检测最大亮度的最大亮度检测器 在由区域检测器检测到的像素的亮度之间,以及(e)测量单元,其将最大亮度与预定阈值亮度进行比较,从而测量颗粒的相对尺寸。

    Apparatus and method for detecting an end point of a cleaning process
    10.
    发明授权
    Apparatus and method for detecting an end point of a cleaning process 有权
    用于检测清洁过程的终点的装置和方法

    公开(公告)号:US06737666B1

    公开(公告)日:2004-05-18

    申请号:US09721703

    申请日:2000-11-27

    IPC分类号: G01N2149

    摘要: A cleaning end point detecting apparatus detects an end point of a cleaning process in which contamination attached to an inner wall of a reaction chamber is removed by introducing a cleaning gas into the chamber to produce a cluster cloud and detached particles. An irradiating unit irradiates a laser beam onto the cluster cloud and the detached particles within the reaction chamber to produce a scattered laser beam. A monitoring unit monitors the scattered laser beam as a two-dimensional image information. A judging unit judges the end point of the cleaning process on the basis of the two-dimensional image information. Preferably, the judging unit judges, as the end point of the cleaning process, a time instant when neither the detached particles nor the cluster cloud are detected on the basis of the two-dimensional image information.

    摘要翻译: 清洗终点检测装置检测清洁过程的终点,其中通过将清洁气体引入室中来除去附着在反应室内壁上的污染物,以产生簇云和分离的颗粒。 照射单元将激光束照射到聚簇云和反应室内的分离的颗粒以产生散射的激光束。 监视单元将散射的激光束监视为二维图像信息。 判断单元基于二维图像信息判断清洁处理的结束点。 优选地,判断单元基于二维图像信息来判断清除处理的结束点是否没有检测到分离的颗粒和簇云的时刻。