公开(公告)号：US08640968B2

公开(公告)日：2014-02-04

申请号：US12662756

申请日：2010-05-03

Applicant: Tzu Cheng Lin ,  Yu Kuang Lee ,  Wei Cheng Chou ,  Hsin Ju Wu

Inventor： Tzu Cheng Lin ,  Yu Kuang Lee ,  Wei Cheng Chou ,  Hsin Ju Wu

IPC: F24F11/053

CPC classification number: H05B1/0227

Abstract: This specification discloses a device of controlling temperature gain and the method thereof. The invention detects the temperature of work environment and uses it to generate a control signal and a PWM signal for dynamically controlling the heaters around electronic elements to heat up. When the temperature of work environment is too low, the invention can increase the stability of the electronic elements.

Abstract translation: 本说明书公开了一种控制温度增益的装置及其方法。 本发明检测工作环境的温度，并用它来产生控制信号和PWM信号，用于动态地控制电子元件周围的加热器加热。 当工作环境温度太低时，本发明可以提高电子元件的稳定性。

公开(公告)号：US08964394B2

公开(公告)日：2015-02-24

申请号：US13545971

申请日：2012-07-10

Applicant: Tzu Cheng Lin ,  Wei Cheng Chou

Inventor： Tzu Cheng Lin ,  Wei Cheng Chou

IPC: H05K7/20 ,  H05K1/02

CPC classification number: H05K1/0209 ,  G06F1/20 ,  G06F1/206 ,  H01L23/34 ,  H01L23/3677 ,  H01L2924/0002 ,  H05K1/0212 ,  H05K2201/10151 ,  H05K2201/10416 ,  H05K2203/1115 ,  H05K2203/165 ,  H01L2924/00

Abstract: A heating and heat dissipating multi-layer circuit board structure for keeping operating temperatures of electronic components is provided. The outer layer of the multi-layer printed circuit board is in contact with electronic components. The operating temperatures of electronic components are measured through by a temperature measuring circuit. When the operating temperature of at least one electronic component is lower than a default temperature, the heating circuits corresponding to the electronic components are enabled respectively to heat the electronic components through corresponding heat conduction elements. When the operating temperature of at least one electronic component is higher than another default temperature, the heating circuits corresponding to the electronic components are disabled to transfer the heat from the electronic components to the heat conduction elements automatically. Therefore, the structure achieves the goal of keeping the operating temperature of each electronic component in the corresponding environment.

Abstract translation: 提供了用于保持电子部件的工作温度的加热和散热多层电路板结构。 多层印刷电路板的外层与电子部件接触。 通过温度测量电路测量电子部件的工作温度。 当至少一个电子部件的工作温度低于默认温度时，对应于电子部件的加热电路分别启用，以通过相应的导热元件加热电子部件。 当至少一个电子部件的工作温度高于另一个默认温度时，对应于电子部件的加热电路被禁止，以将热量从电子部件传递到热传导元件。 因此，该结构实现了将各电子部件的工作温度保持在相应环境中的目标。

公开(公告)号：US20110266356A1

公开(公告)日：2011-11-03

申请号：US12662756

申请日：2010-05-03

Applicant: Tzu Cheng Lin ,  Yu Kuang Lee ,  Wei Cheng Chou ,  Hsin Ju Wu

Inventor： Tzu Cheng Lin ,  Yu Kuang Lee ,  Wei Cheng Chou ,  Hsin Ju Wu

IPC: B60H1/00

CPC classification number: H05B1/0227

Abstract: This specification discloses a device of controlling temperature gain and the method thereof. The invention detects the temperature of work environment and uses it to generate a control signal and a PWM signal for dynamically controlling the heaters around electronic elements to heat up. When the temperature of work environment is too low, the invention can increase the stability of the electronic elements.

Abstract translation: 本说明书公开了一种控制温度增益的装置及其方法。 本发明检测工作环境的温度，并用它来产生控制信号和PWM信号，用于动态地控制电子元件周围的加热器加热。 当工作环境温度太低时，本发明可以提高电子元件的稳定性。

公开(公告)号：US20100097769A1

公开(公告)日：2010-04-22

申请号：US12288702

申请日：2008-10-21

Applicant: Tzu Cheng Lin

Inventor： Tzu Cheng Lin

IPC: H05K7/20

CPC classification number: H05K7/20409 ,  G06F1/20

Abstract: A heat-dissipating structure for the expansion board architecture is provided. A fixing element disposed on the heat-absorbing substrate fixes the motherboard and the first expansion board. The heat-generating elements on the motherboard or the first expansion board are directly in touch with the heat-absorbing surface of the heat-absorbing substrate to absorb their heat. The heat-dissipating board extended from the side of the heat-absorbing substrate then dissipates the heat absorbed by the heat-absorbing substrate. The structure thus solves the problems that existing heat-dissipating structures occupy larger space and therefore cannot be effectively used in an expansion board architecture to dissipate heat produced by the heat-generating elements between the motherboard and the expansion board and that it is likely to have assembly tolerance. Using the structure can reduce the space and the assembly tolerance, but effectively enhance heat dissipation in the expansion board architecture.

公开(公告)号：US20140016261A1

公开(公告)日：2014-01-16

申请号：US13545971

申请日：2012-07-10

Applicant: Tzu Cheng Lin ,  Wei Cheng Chou

Inventor： Tzu Cheng Lin ,  Wei Cheng Chou

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K1/0209 ,  G06F1/20 ,  G06F1/206 ,  H01L23/34 ,  H01L23/3677 ,  H01L2924/0002 ,  H05K1/0212 ,  H05K2201/10151 ,  H05K2201/10416 ,  H05K2203/1115 ,  H05K2203/165 ,  H01L2924/00

Abstract: A heating and heat dissipating multi-layer circuit board structure for keeping operating temperatures of electronic components is provided. The outer layer of the multi-layer printed circuit board is in contact with electronic components. The operating temperatures of electronic components are measured through by a temperature measuring circuit. When the operating temperature of at least one electronic component is lower than a default temperature, the heating circuits corresponding to the electronic components are enabled respectively to heat the electronic components through corresponding heat conduction elements. When the operating temperature of at least one electronic component is higher than another default temperature, the heating circuits corresponding to the electronic components are disabled to transfer the heat from the electronic components to the heat conduction elements automatically. Therefore, the structure achieves the goal of keeping the operating temperature of each electronic component in the corresponding environment.

Abstract translation: 提供了用于保持电子部件的工作温度的加热和散热多层电路板结构。 多层印刷电路板的外层与电子部件接触。 通过温度测量电路测量电子部件的工作温度。 当至少一个电子部件的工作温度低于默认温度时，对应于电子部件的加热电路分别启用，以通过相应的导热元件加热电子部件。 当至少一个电子部件的工作温度高于另一个默认温度时，对应于电子部件的加热电路被禁止，以将热量从电子部件传递到热传导元件。 因此，该结构实现了将各电子部件的工作温度保持在相应环境中的目标。

公开(公告)号：US07773378B2

公开(公告)日：2010-08-10

申请号：US12288702

申请日：2008-10-21

Applicant: Tzu Cheng Lin

Inventor： Tzu Cheng Lin

IPC: H05K7/20

CPC classification number: H05K7/20409 ,  G06F1/20

Abstract: A heat-dissipating structure for the expansion board architecture is provided. A fixing element disposed on the heat-absorbing substrate fixes the motherboard and the first expansion board. The heat-generating elements on the motherboard or the first expansion board are directly in touch with the heat-absorbing surface of the heat-absorbing substrate to absorb their heat. The heat-dissipating board extended from the side of the heat-absorbing substrate then dissipates the heat absorbed by the heat-absorbing substrate. The structure thus solves the problems that existing heat-dissipating structures occupy larger space and therefore cannot be effectively used in an expansion board architecture to dissipate heat produced by the heat-generating elements between the motherboard and the expansion board and that it is likely to have assembly tolerance. Using the structure can reduce the space and the assembly tolerance, but effectively enhance heat dissipation in the expansion board architecture.

Abstract translation: 提供了用于扩展板结构的散热结构。 设置在吸热基板上的固定元件固定母板和第一扩展板。 主板或第一扩展板上的发热元件与吸热基板的吸热表面直接接触以吸收其热量。 从吸热基板一侧延伸的散热板然后消散吸热基板所吸收的热量。 因此，该结构解决了现有散热结构占用较大空间的问题，因此不能有效地用于扩展板结构中，以散发由主板和扩展板之间的发热元件产生的热量，并且可能具有 组装公差。 使用结构可以减少空间和组装公差，但有效增强了扩展板架构的散热。