公开(公告)号：US3885215A

公开(公告)日：1975-05-20

申请号：US43139674

申请日：1974-01-07

Applicant: UNIT PROCESS ASSEMBLIES

Inventor： WEINSTOCK JACQUES J

IPC: G01B7/06 ,  G01R27/14 ,  G01R1/06

CPC classification number: G01B7/06 ,  G01R27/14

Abstract: An improved electrode construction for apparatus for testing the integrity of thru-hole plating in printed circuit boards and the like by measuring the effective thickness thereof. A first conically shaped electrode assembly is adapted to be displaced along a predetermined path into engagement with one of the defining marginal perimetric edges of a plated thru-hole in a circuit board. A second and complementally shaped electrode assembly is adapted to be displaced into engagement with the other defining marginal perimetric edge of the thru-hole. Each of such electrode assemblies include a pair of discrete selectively contoured electrode elements adapted to make line contact with the marginal defining edges of the thru-hole, whereby a predetermined magnitude of constant current can be passed through the plating intermediate one pair of electrode elements, and the voltage drop developed thereby across the thru-hole plating measured by the other pair of electrode elements.

Abstract translation: 一种用于通过测量其有效厚度来测试印刷电路板等中的通孔电镀的完整性的装置的改进的电极结构。 第一锥形电极组件适于沿着预定路径移位，以与电路板中电镀通孔的限定边缘周边边缘中的一个接合。 第二和互补形状的电极组件适于移位成与通孔的另一个限定边缘周边边缘接合。 每个这样的电极组件包括一对离散的选择性轮廓的电极元件，其适于与通孔的边缘限定边缘进行线接触，由此预定大小的恒定电流可以通过电镀中间的一对电极元件， 并且由另一对电极元件测量的通过通孔镀层的电压降。

公开(公告)号：US3560742A

公开(公告)日：1971-02-02

申请号：US3560742D

申请日：1967-01-17

Applicant: UNIT PROCESS ASSEMBLIES

Inventor： WEINSTOCK JACQUES J ,  HAY WILLIAM D

IPC: G01N23/203 ,  G01T1/16

CPC classification number: G01N23/203

Abstract: A portable beta backscatter measuring instrument assembly to effect measurements of the thickness of coatings on workpieces, including a jig mounted portable probe member incorporating means adjustable relative thereto to engage a workpiece, or an abutment fixed relative to a workpiece, to hold the probe member in firm engagement with a surface of the workpiece in proper position for measuring the thickness of a coating on the surface.

公开(公告)号：US3519824A

公开(公告)日：1970-07-07

申请号：US3519824D

申请日：1966-03-14

Applicant: UNIT PROCESS ASSEMBLIES

Inventor： WEINSTOCK JACQUES J ,  HAY WILLIAM D

IPC: G01N23/203 ,  G01T1/16

CPC classification number: G01N23/203

公开(公告)号：US3588507A

公开(公告)日：1971-06-28

申请号：US3588507D

申请日：1968-04-01

Applicant: UNIT PROCESS ASSEMBLIES

Inventor： WEINSTOCK JACQUES J ,  HAY WILLIAM D

IPC: G01N23/203 ,  G01T1/16

CPC classification number: G01N23/203

Abstract: APPARATUS FOR LOCATING A BETA RAY EMITTING PROBE ASSEMBLY AND AN APERTURE IN A PRINTED CIRCUIT BOARD OR OTHER WORKPIECE AT A MEASURING STATION IN PRECISE RELATIONSHIP TO ONE ANOTHER TO EFFECT BETA BACKSCATTER-TYPE MEASUREMENTS OF THE THICKNESSES OF PLATINGS ON A PREDETERMINED AREA ON THE SIDEWALL OF A SELECTED APERTURE, INCLUDING MEANS FOR GUIDING THE PROBE ASSEMBLY FOR MOVEMENT BETWEEN A RETRACTED POSITION AND AN ADVANCED OPERATIVE MEASURING POSITION TO ASSURE DIRECTED IMPINGEMENT OF A COLLIMATED BEAM OF BETA RADIATION ON SAID PREDETERMINED AREA OF THE WALL OF ANY APERTURE SELECTED FROM A PLURALITY OF SIMILAR APERTURES IN A BOARD.

公开(公告)号：US3496359A

公开(公告)日：1970-02-17

申请号：US3496359D

申请日：1966-02-09

Applicant: UNIT PROCESS ASSEMBLIES

Inventor： WEINSTOCK JACQUES J ,  WADE DONALD E ,  LIEBER SIDNEY U ,  HAY WILLIAM D

IPC: G01N23/203 ,  G01T1/16 ,  H01J39/00

CPC classification number: G01N23/203