Electrode assembly for measuring the effective thickness of thru-hole plating in circuit board workpieces or the like
    2.
    发明授权
    Electrode assembly for measuring the effective thickness of thru-hole plating in circuit board workpieces or the like 失效
    用于测量电路板工件等中的通孔电镀的有效厚度的电极组件

    公开(公告)号:US3885215A

    公开(公告)日:1975-05-20

    申请号:US43139674

    申请日:1974-01-07

    CPC classification number: G01B7/06 G01R27/14

    Abstract: An improved electrode construction for apparatus for testing the integrity of thru-hole plating in printed circuit boards and the like by measuring the effective thickness thereof. A first conically shaped electrode assembly is adapted to be displaced along a predetermined path into engagement with one of the defining marginal perimetric edges of a plated thru-hole in a circuit board. A second and complementally shaped electrode assembly is adapted to be displaced into engagement with the other defining marginal perimetric edge of the thru-hole. Each of such electrode assemblies include a pair of discrete selectively contoured electrode elements adapted to make line contact with the marginal defining edges of the thru-hole, whereby a predetermined magnitude of constant current can be passed through the plating intermediate one pair of electrode elements, and the voltage drop developed thereby across the thru-hole plating measured by the other pair of electrode elements.

    Abstract translation: 一种用于通过测量其有效厚度来测试印刷电路板等中的通孔电镀的完整性的装置的改进的电极结构。 第一锥形电极组件适于沿着预定路径移位,以与电路板中电镀通孔的限定边缘周边边缘中的一个接合。 第二和互补形状的电极组件适于移位成与通孔的另一个限定边缘周边边缘接合。 每个这样的电极组件包括一对离散的选择性轮廓的电极元件,其适于与通孔的边缘限定边缘进行线接触,由此预定大小的恒定电流可以通过电镀中间的一对电极元件, 并且由另一对电极元件测量的通过通孔镀层的电压降。

    Supporting device
    3.
    发明授权
    Supporting device 失效
    支持设备

    公开(公告)号:US3786686A

    公开(公告)日:1974-01-22

    申请号:US3786686D

    申请日:1972-03-22

    Inventor: HAY W

    CPC classification number: F16H19/04 G01N23/203 Y10T74/1812

    Abstract: A radiation backscatter measuring instrument is provided for use with a portable probe assembly having an elongated casing with an opening at one end thereof and containing a radiation source positioned in predetermined relation therewith and a radiation detector for detecting radiation backscattered from a workpiece exposed to radiation from the source through the casing opening. The radiation backscatter measuring instrument includes a planar, horizontally disposed, transparent locator with a series of guide lines on the bottom surface thereof which is positioned over the selected locus of measurement on the horizontally supported workpiece. The locator is then horizontally retracted from its locating position while the portable probe is vertically lowered to engage the workpiece with the opening thereof being positioned over the selected portion of the workpiece to be tested.

    Abstract translation: 提供了一种用于便携式探针组件的辐射反向散射测量仪器,其具有在其一端具有开口的细长壳体并且包含以其预定关系定位的辐射源,以及用于检测从暴露于辐射的工件向后散射的辐射的辐射检测器 源通过套管开口。 辐射反向散射测量仪器包括一个平面的,水平设置的透明定位器,其底表面上具有一系列引导线,该引导线位于水平支撑的工件上的所选择的测量轨迹上。 然后定位器从其定位位置水平地缩回,同时便携式探头垂直下降以接合工件,其开口定位在被测工件的选定部分上方。

    Radiation backscatter measuring instrument
    4.
    发明授权
    Radiation backscatter measuring instrument 失效
    辐射背板测量仪器

    公开(公告)号:US3720833A

    公开(公告)日:1973-03-13

    申请号:US3720833D

    申请日:1971-05-10

    Inventor: HAY W

    CPC classification number: F16H19/04 G01N23/203

    Abstract: A radiation backscatter measuring instrument is provided for use with a portable probe assembly having an elongated casing with an opening at one end thereof and containing a radiation source positioned in predetermined relation therewith and a radiation detector for detecting radiation backscattered from a workpiece exposed to radiation from the source through the casing opening. The radiation backscatter measuring instrument includes a planar, horizontally disposed, transparent locator with a series of guide lines on the bottom surface thereof which is positioned over the selected locus of measurement on the horizontally supported workpiece. The locator is then horizontally retracted from its locating position while the portable probe is vertically lowered to engage the workpiece with the opening thereof being positioned over the selected portion of the workpiece to be tested.

    Abstract translation: 提供了一种用于便携式探针组件的辐射反向散射测量仪器,其具有在其一端具有开口的细长壳体并且包含以其预定关系定位的辐射源,以及用于检测从暴露于辐射的工件向后散射的辐射的辐射检测器 源通过套管开口。 辐射反向散射测量仪器包括一个平面的,水平设置的透明定位器,其底表面上具有一系列引导线,该引导线位于水平支撑的工件上的所选择的测量轨迹上。 然后定位器从其定位位置水平地缩回,同时便携式探头垂直下降以接合工件,其开口定位在被测工件的选定部分上方。

    Apparatus for testing the integrity of a thru-hole plating in circuit board workpieces or the like by measuring the effective thickness thereof
    7.
    发明授权
    Apparatus for testing the integrity of a thru-hole plating in circuit board workpieces or the like by measuring the effective thickness thereof 失效
    用于测试电路板工作中的三角形镀层的完整性或通过测量其有效厚度的方法

    公开(公告)号:US3766470A

    公开(公告)日:1973-10-16

    申请号:US3766470D

    申请日:1971-05-24

    Inventor: HAY W JENSEN R

    CPC classification number: G01R31/2805

    Abstract: An apparatus is provided for testing the integrity of thru-hole plating in printed circuit boards by measuring the effective thickness thereof. A printed circuit board is adapted to be positioned on a work surface of the apparatus with the plated thru-hole to be measured disposed at an operating location. A spaced pair of electrode probe are displaced downwardly along a predetermined path into engagement with the top defining edges of the plated thru-hole. A second spaced pair of electrode probe elements engage the bottom defining edges of the thru-hole whereby a predetermined magnitude of constant current can be passed through one of the upper electrode probes, the plating and one of the lower electrode probes and the voltage drop developed thereby across the thru-hole plating measured by the other set of upper and lower electrode probe elements. The upper and lower electrode probes are suitably contoured to establish essentially point contact with the surfaces of the thru-hole plating whereby accurate and reproducible readings can be obtained.

    Abstract translation: 提供一种用于通过测量印刷电路板的有效厚度来测试印刷电路板中的通孔电镀的完整性的装置。 印刷电路板适于定位在设备的工作表面上,其中待测量的电镀通孔设置在操作位置。 间隔开的一对电极探针沿着预定路径向下移位,以与电镀通孔的顶部限定边缘接合。 第二间隔的一对电极探针元件与通孔的底部限定边缘接合,由此可以使预定大小的恒定电流通过上电极探针,电镀和下电极探针中的一个以及电压降 从而跨越由另一组上下电极探针元件测量的穿孔镀层。 上电极探针和下电极探针适当地形成轮廓,以便与穿孔镀层的表面基本上形成点接触,由此可以获得精确和可再现的读数。

    Portable beta backscatter measuring instrument assembly
    8.
    发明授权
    Portable beta backscatter measuring instrument assembly 失效
    便携式测试仪表组件

    公开(公告)号:US3560742A

    公开(公告)日:1971-02-02

    申请号:US3560742D

    申请日:1967-01-17

    CPC classification number: G01N23/203

    Abstract: A portable beta backscatter measuring instrument assembly to effect measurements of the thickness of coatings on workpieces, including a jig mounted portable probe member incorporating means adjustable relative thereto to engage a workpiece, or an abutment fixed relative to a workpiece, to hold the probe member in firm engagement with a surface of the workpiece in proper position for measuring the thickness of a coating on the surface.

    Beta backscatter thickness measuring apparatus for apertures in printed circuit boards and the like
    10.
    发明授权
    Beta backscatter thickness measuring apparatus for apertures in printed circuit boards and the like 失效
    印刷电路板和其他类似印刷电路板的测厚仪厚度测量装置

    公开(公告)号:US3588507A

    公开(公告)日:1971-06-28

    申请号:US3588507D

    申请日:1968-04-01

    CPC classification number: G01N23/203

    Abstract: APPARATUS FOR LOCATING A BETA RAY EMITTING PROBE ASSEMBLY AND AN APERTURE IN A PRINTED CIRCUIT BOARD OR OTHER WORKPIECE AT A MEASURING STATION IN PRECISE RELATIONSHIP TO ONE ANOTHER TO EFFECT BETA BACKSCATTER-TYPE MEASUREMENTS OF THE THICKNESSES OF PLATINGS ON A PREDETERMINED AREA ON THE SIDEWALL OF A SELECTED APERTURE, INCLUDING MEANS FOR GUIDING THE PROBE ASSEMBLY FOR MOVEMENT BETWEEN A RETRACTED POSITION AND AN ADVANCED OPERATIVE MEASURING POSITION TO ASSURE DIRECTED IMPINGEMENT OF A COLLIMATED BEAM OF BETA RADIATION ON SAID PREDETERMINED AREA OF THE WALL OF ANY APERTURE SELECTED FROM A PLURALITY OF SIMILAR APERTURES IN A BOARD.

Patent Agency Ranking