Abstract:
An improved electrode construction for apparatus for testing the integrity of thru-hole plating in printed circuit boards and the like by measuring the effective thickness thereof. A first conically shaped electrode assembly is adapted to be displaced along a predetermined path into engagement with one of the defining marginal perimetric edges of a plated thru-hole in a circuit board. A second and complementally shaped electrode assembly is adapted to be displaced into engagement with the other defining marginal perimetric edge of the thru-hole. Each of such electrode assemblies include a pair of discrete selectively contoured electrode elements adapted to make line contact with the marginal defining edges of the thru-hole, whereby a predetermined magnitude of constant current can be passed through the plating intermediate one pair of electrode elements, and the voltage drop developed thereby across the thru-hole plating measured by the other pair of electrode elements.
Abstract:
A radiation backscatter measuring instrument is provided for use with a portable probe assembly having an elongated casing with an opening at one end thereof and containing a radiation source positioned in predetermined relation therewith and a radiation detector for detecting radiation backscattered from a workpiece exposed to radiation from the source through the casing opening. The radiation backscatter measuring instrument includes a planar, horizontally disposed, transparent locator with a series of guide lines on the bottom surface thereof which is positioned over the selected locus of measurement on the horizontally supported workpiece. The locator is then horizontally retracted from its locating position while the portable probe is vertically lowered to engage the workpiece with the opening thereof being positioned over the selected portion of the workpiece to be tested.
Abstract:
A radiation backscatter measuring instrument is provided for use with a portable probe assembly having an elongated casing with an opening at one end thereof and containing a radiation source positioned in predetermined relation therewith and a radiation detector for detecting radiation backscattered from a workpiece exposed to radiation from the source through the casing opening. The radiation backscatter measuring instrument includes a planar, horizontally disposed, transparent locator with a series of guide lines on the bottom surface thereof which is positioned over the selected locus of measurement on the horizontally supported workpiece. The locator is then horizontally retracted from its locating position while the portable probe is vertically lowered to engage the workpiece with the opening thereof being positioned over the selected portion of the workpiece to be tested.
Abstract:
An apparatus is provided for testing the integrity of thru-hole plating in printed circuit boards by measuring the effective thickness thereof. A printed circuit board is adapted to be positioned on a work surface of the apparatus with the plated thru-hole to be measured disposed at an operating location. A spaced pair of electrode probe are displaced downwardly along a predetermined path into engagement with the top defining edges of the plated thru-hole. A second spaced pair of electrode probe elements engage the bottom defining edges of the thru-hole whereby a predetermined magnitude of constant current can be passed through one of the upper electrode probes, the plating and one of the lower electrode probes and the voltage drop developed thereby across the thru-hole plating measured by the other set of upper and lower electrode probe elements. The upper and lower electrode probes are suitably contoured to establish essentially point contact with the surfaces of the thru-hole plating whereby accurate and reproducible readings can be obtained.
Abstract:
A portable beta backscatter measuring instrument assembly to effect measurements of the thickness of coatings on workpieces, including a jig mounted portable probe member incorporating means adjustable relative thereto to engage a workpiece, or an abutment fixed relative to a workpiece, to hold the probe member in firm engagement with a surface of the workpiece in proper position for measuring the thickness of a coating on the surface.
Abstract:
APPARATUS FOR LOCATING A BETA RAY EMITTING PROBE ASSEMBLY AND AN APERTURE IN A PRINTED CIRCUIT BOARD OR OTHER WORKPIECE AT A MEASURING STATION IN PRECISE RELATIONSHIP TO ONE ANOTHER TO EFFECT BETA BACKSCATTER-TYPE MEASUREMENTS OF THE THICKNESSES OF PLATINGS ON A PREDETERMINED AREA ON THE SIDEWALL OF A SELECTED APERTURE, INCLUDING MEANS FOR GUIDING THE PROBE ASSEMBLY FOR MOVEMENT BETWEEN A RETRACTED POSITION AND AN ADVANCED OPERATIVE MEASURING POSITION TO ASSURE DIRECTED IMPINGEMENT OF A COLLIMATED BEAM OF BETA RADIATION ON SAID PREDETERMINED AREA OF THE WALL OF ANY APERTURE SELECTED FROM A PLURALITY OF SIMILAR APERTURES IN A BOARD.