公开(公告)号：US10471552B2

公开(公告)日：2019-11-12

申请号：US15030326

申请日：2015-01-13

Applicant: United Technologies Corporation

Inventor： David A. Raulerson ,  Kevin D. Smith ,  Zhong Ouyang ,  Lisa J. Brasche ,  William J. Brindley ,  David N. Potter

IPC: B23P6/00 ,  F01D9/02 ,  F01D25/12

Abstract: Systems and methods are disclosed herein for repairing components. A material layer may be deposited on a surface of a component. The material layer may cover a cooling hole. A pulsed heat source may heat the component and the material layer. An infrared camera may take a series of images of the component. A location of the cooling hole may be identified based on thermal properties of the component. A removal tool may remove a portion of the material layer in order to expose the cooling hole.

公开(公告)号：US20200016702A1

公开(公告)日：2020-01-16

申请号：US16584233

申请日：2019-09-26

Applicant: United Technologies Corporation

Inventor： David A Raulerson ,  Kevin D. Smith ,  Zhong Ouyang ,  Lisa J. Brasche ,  William J. Brindley ,  David N. Potter

IPC: B23P6/00 ,  F01D25/12 ,  F01D9/02

Abstract: Systems and methods are disclosed herein for repairing components. A material layer may be deposited on a surface of a component. The material layer may cover a cooling hole. A pulsed heat source may heat the component and the material layer. An infrared camera may take a series of images of the component. A location of the cooling hole may be identified based on thermal properties of the component. A removal tool may remove a portion of the material layer in order to expose the cooling hole.

公开(公告)号：US20190039177A1

公开(公告)日：2019-02-07

申请号：US15670330

申请日：2017-08-07

Applicant: United Technologies Corporation

Inventor： Gordon M. Reed ,  David N. Potter

IPC: B23K26/06 ,  B23K26/03 ,  B23K26/282 ,  B23K26/382 ,  B23K26/40

Abstract: Aspects of the disclosure are directed to processing a component. A first coating is removed from a substrate of the component, the substrate including a first hole. Subsequent to removing the first coating from the substrate, a second coating is applied to the substrate, where a portion of the second coating at least partially blocks the first hole. Subsequent to applying the second coating to the substrate, the portion of the second coating is removed to generate a second hole through the second coating. The removal of the portion of the second coating creates a bore in the second coating that provides a clearance from an edge of the first hole on a surface of the substrate that interfaces to the second coating.

公开(公告)号：US11752573B2

公开(公告)日：2023-09-12

申请号：US15670330

申请日：2017-08-07

Applicant: United Technologies Corporation

Inventor： Gordon M. Reed ,  David N. Potter

IPC: F01D5/08 ,  B23K26/06 ,  B23K26/03 ,  B23K26/282 ,  B23K26/382 ,  B23K26/40 ,  F01D5/28 ,  F01D5/18

CPC classification number: B23K26/0648 ,  B23K26/032 ,  B23K26/282 ,  B23K26/389 ,  B23K26/40 ,  F01D5/186 ,  F01D5/288 ,  F05D2230/80

Abstract: Aspects of the disclosure are directed to processing a component. A first coating is removed from a substrate of the component, the substrate including a first hole. Subsequent to removing the first coating from the substrate, a second coating is applied to the substrate, where a portion of the second coating at least partially blocks the first hole. Subsequent to applying the second coating to the substrate, the portion of the second coating is removed to generate a second hole through the second coating. The removal of the portion of the second coating creates a bore in the second coating that provides a clearance from an edge of the first hole on a surface of the substrate that interfaces to the second coating.

公开(公告)号：US20190039191A1

公开(公告)日：2019-02-07

申请号：US15670775

申请日：2017-08-07

Applicant: UNITED TECHNOLOGIES CORPORATION

Inventor： David N. Potter ,  William J. Brindley ,  Wangen Lin

IPC: B23P6/00 ,  F04D29/38

Abstract: A weld clad layer having a substantially equiaxed grain microstructure may be formed by forming a repair area in a substrate, depositing a first layer of laser deposition spots in the repair area, and depositing a second layer of laser deposition spots over the first layer of laser deposition spots. The first layer of laser deposition spots may comprise a first laser deposition spot and a second laser deposition spot adjacent to the first laser deposition spot. The first laser deposition spot may solidify prior to deposition of the second laser deposition spot. The first layer of laser deposition spots may comprise titanium or titanium alloy.

公开(公告)号：US20160318135A1

公开(公告)日：2016-11-03

申请号：US15030326

申请日：2015-01-13

Applicant: UNITED TECHNOLOGIES CORPORATION

Inventor： David A. Raulerson ,  Kevin D. Smith ,  Zhong Ouyang ,  Lisa J. Brasche ,  William J. Brindley ,  David N. Potter

IPC: B23P6/00 ,  F01D25/12 ,  F01D9/02

CPC classification number: B23P6/002 ,  B23P2700/06 ,  F01D5/005 ,  F01D5/186 ,  F01D5/288 ,  F01D9/02 ,  F01D21/003 ,  F01D25/12 ,  F05D2220/32 ,  F05D2230/13 ,  F05D2230/80 ,  F05D2260/80 ,  F05D2260/81 ,  F05D2300/611 ,  G01N25/72 ,  G06T7/73 ,  G06T2207/10048 ,  G06T2207/30164

Abstract: Systems and methods are disclosed herein for repairing components. A material layer may be deposited on a surface of a component. The material layer may cover a cooling hole. A pulsed heat source may heat the component and the material layer. An infrared camera may take a series of images of the component. A location of the cooling hole may be identified based on thermal properties of the component. A removal tool may remove a portion of the material layer in order to expose the cooling hole.

Abstract translation: 本文公开了用于修理部件的系统和方法。 材料层可以沉积在部件的表面上。 材料层可以覆盖冷却孔。 脉冲热源可以加热组件和材料层。 红外摄像机可能会拍摄该组件的一系列图像。 可以基于部件的热性质来识别冷却孔的位置。 去除工具可以去除材料层的一部分以暴露冷却孔。