Abstract:
An emissive layer deposited in graded manner using a plurality of nozzles is disclosed. A mixtures ejected from the plurality of nozzles may contain varying concentrations of host-to-dopant material. The nozzles, as disclosed, may be arranged in a sequential manner such that the order of the sequence is based on varying concentration of the host-to-dopant material. The nozzles may be configured to translate relative to an area of a substrate to allow sequential deposition.
Abstract:
Systems and methods for the design and fabrication of OLEDs, including high-performance large-area OLEDs, are provided. Variously described fabrication processes may be used to deposit and pattern bus lines with a smooth profile and a gradual sidewall transition. Such smooth profiles may, for example, reduce the probability of electrical shorting at the bus lines. Accordingly, in certain circumstances, an insulating layer may no longer be considered essential, and may be optionally avoided altogether. In cases where an insulating layer is not used, further enhancements in the emissive area and shelf life of the device may be achieved as well. According to aspects of the invention, bus lines such as those described herein may be deposited, and patterned, using vapor deposition such as vacuum thermal evaporation (VTE) through a shadow mask, and may avoid multiple photolithography steps. Other vapor deposition systems and methods may include, among others, sputter deposition, e-beam evaporation and chemical vapor deposition (CVD). A final profile of the bus line may substantially correspond to the profile as deposited.
Abstract:
Systems and methods are provided for depositing thin patterned films of materials in which individual elements of the patterned film are deposited by two or more nozzles having different geometries. The different nozzle geometries may include one or more of different throttle diameters, different exhaust diameters, different cross-sectional shapes, different bore angles, different wall angles, different exhaust distances from the substrate, and different leading edges relative to the direction of movement of the nozzles or the substrate. Methods may include steps of ejecting a carrier gas and a material from a plurality of nozzles and depositing the material on a substrate in a plurality of laterally spaced elements.
Abstract:
Embodiments disclosed herein provide devices having a nozzle die with one or more nozzles, each of which has one or more integrated skimmers. The use of an integrated nozzle/skimmer structure allows for higher-resolution printing in OVJP-type deposition techniques without requiring the use of a shadow mask by allowing for a relatively narrow organic material beam that can be placed at relatively high distances away from the substrate.
Abstract:
Nozzle designs which have been found to be effective in governing overspray in OVJP are provided. Aspects of the invention have been found to be effective in reducing or avoiding sudden pressure drops at the end of the nozzle close to the substrate, and may be advantageously employed in obtaining, for example, greater consistency between the nozzle outlet diameter and the deposited pattern width.
Abstract:
Luminaires and luminaire components are provided that may include emissive, index-matching, and/or outcoupling components that are replaceable separately from other components of the luminaire. In some embodiments, an index-matching component may include a gel sheet or pad that can be disposed between an emissive component and an outcoupling component. The index-matching component may be replaceable separately from the emissive and outcoupling components. In some embodiments, an emissive component including an OLED panel and/or an index-matching component may be replaceable separately from other components of the luminaire.
Abstract:
Methods of fabricating a device having laterally patterned first and second sub-devices, such as subpixels of an OLED, are provided. Exemplary methods may include depositing via organic vapor jet printing (OVJP) a first organic layer of the first sub-device and a first organic layer of the second sub-device. The first organic layer of the first sub-device and the first organic layer of the second sub-device are both the same type of layer, but have different thicknesses. The type of layer is selected from an ETL, an HTL, an HIL, a spacer and a capping layer.
Abstract:
Systems, and methods for the design and fabrication of OLEDs, including large-area OLEDs with metal bus lines, are provided. For a given panel area dimension, target luminous emittance, OLED device structure and efficiency, and electrical resistivity and thickness of the bus line material and electrode onto which the bus lines are disposed, a bus line pattern may be designed to optimize Fill Factor (FF), Luminance Uniformity (U) and Power Loss (PL). Example designs may be to maximize FF, maximize U and minimize PL. or define minimum criteria for U and a maximum criteria for PL, and then to optimize the bus line layout to maximize FF. OLED panels including bus lines with different resistances along the bus line are also described.
Abstract:
Devices and components are provided that include a curved outcoupling component and an OLED, where the outcoupling component provides up to 100% outcoupling of light emitted by the OLED into air. The outcoupling component has an outer radius R and includes a material with a refractive index n. The OLED is in optical communication with the outcoupling component and disposed such that each emissive element of the OLED is within a distance r measured from the center of curvature of the surface at the outer radius R, such that R−r>(n−1)r.
Abstract:
Methods of fabricating a device having laterally patterned first and second sub-devices, such as subpixels of an OLED, are provided. Exemplary methods may include depositing via organic vapor jet printing (OVJP) a first organic layer of the first sub-device and a first organic layer of the second sub-device. The first organic layer of the first sub-device and the first organic layer of the second sub-device are both the same type of layer, but have different thicknesses. The type of layer is selected from an ETL, an HTL, an HIL, a space and a capping layer.