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公开(公告)号：US11692270B2
公开(公告)日：2023-07-04
申请号：US16431519
申请日：2019-06-04
Inventor： Rajan Vaidyanathan , Aravinda Kar
CPC classification number: C23C16/56 , A61L27/306 , A61L31/088 , C23C10/28 , C23C16/483 , C23C16/545 , A61L2420/02 , A61L2420/06 , A61N1/086
Abstract: A system for forming surface modified substrates includes a laser system, and a laser processing chamber. A laser scanner automatically controls a position of the laser beam or an x-y translating stage upon which the laser processing chamber is mounted thereon for scanning the laser beam relative to a substrate of material (M) having a bulk portion and an outer surface integrated with the bulk portion, and a coating including metal organic molecules including at least one metal X or particles of metal X on the outer surface. At laser-heated spots atoms of X from the metal coating diffuse into the outer surface to form a modified surface layer including both M and X. The modified surface layer has a thickness of 1 nm, and a 25° C. electrical conductivity ≥2.5% above or ≤2.5% below a 25° C. electrical conductivity in the bulk portion.
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Patent Agency Ranking
公开(公告)号：US20190284699A1
公开(公告)日：2019-09-19
申请号：US16431519
申请日：2019-06-04
Inventor： Rajan Vaidyanathan , Aravinda Kar
Abstract: A system for forming surface modified substrates includes a laser system, and a laser processing chamber. A laser scanner automatically controls a position of the laser beam or an x-y translating stage upon which the laser processing chamber is mounted thereon for scanning the laser beam relative to a substrate of material (M) having a bulk portion and an outer surface integrated with the bulk portion, and a coating including metal organic molecules including at least one metal X or particles of metal X on the outer surface. At laser-heated spots atoms of X from the metal coating diffuse into the outer surface to form a modified surface layer including both M and X. The modified surface layer has a thickness of 1 nm, and a 25° C. electrical conductivity ≥2.5% above or ≤2.5% below a 25° C. electrical conductivity in the bulk portion.
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公开(公告)号：US09327057B1
公开(公告)日：2016-05-03
申请号：US14158444
申请日：2014-01-17
Inventor： Rajan Vaidyanathan
CPC classification number: A61L31/022 , A61B10/0283 , A61L27/06 , A61L27/50 , A61L31/18 , A61L2400/12 , A61N1/08 , A61N1/086
Abstract: An MRI compatible medical device includes a non-magnetic metal alloy portion having a bulk portion including a first and a second metal. A surface of the metal alloy portion includes an integral MRI heating resistant surface structure having a thickness ≧3 nanometers. The non-magnetic metal alloy portion is structurally different from the bulk portion and includes a lamellar nanostructure or microstructure. The MRI heating resistant surface structure can include (i) a matrix phase including the first and second metal having nanometer or micron scale particles, precipitates and/or inclusions that differ in chemical composition and physical characteristics of the matrix phase and are discontinuously distributed therein; (ii) a level of crystallinity at least 5% less than the bulk portion; and/or (iii) metal atoms different from the first and second metal having a concentration profile evidencing diffusion into the metal alloy portion.
Abstract translation: MRI兼容的医疗装置包括具有包括第一和第二金属的本体部分的非磁性金属合金部分。 金属合金部分的表面包括具有≥3纳米厚度的整体MRI加热表面结构。 非磁性金属合金部分在结构上与本体部分不同，并且包括层状纳米结构或微结构。 MRI加热表面结构可以包括（i）包括具有纳米或微米级粒子的第一和第二金属的基质相，在基质相的化学组成和物理特性不同的且不连续分布的沉淀物和/或夹杂物; （ii）结晶度比本体部分少至少5％; 和/或（iii）不同于第一和第二金属的金属原子，其具有证明扩散到金属合金部分中的浓度分布。
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公开(公告)号：US10788373B2
公开(公告)日：2020-09-29
申请号：US16424742
申请日：2019-05-29
Inventor： Aravinda Kar , Jeffrey Jennings , Rajan Vaidyanathan
Abstract: An imaging device may include an RF source configured to irradiate an object with RF radiation, and an array of RE antenna elements. Each RF antenna element may include a loop bolometer configured to receive the RF radiation after interaction with the object. The imaging device may include a processor configured to generate an image based upon respective outputs from the array of RF antenna elements, and a display coupled to the processor and configured to display the image of the object.
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公开(公告)号：US20190368942A1
公开(公告)日：2019-12-05
申请号：US16424742
申请日：2019-05-29
Inventor： ARAVINDA KAR , Jeffrey Jennings , Rajan Vaidyanathan
Abstract: An imaging device may include an RF source configured to irradiate an object with RF radiation, and an array of RE antenna elements. Each RF antenna element may include a loop bolometer configured to receive the RF radiation after interaction with the object. The imaging device may include a processor configured to generate an image based upon respective outputs from the array of RF antenna elements, and a display coupled to the processor and configured to display the image of the object.
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公开(公告)号：US10358723B2
公开(公告)日：2019-07-23
申请号：US13969055
申请日：2013-08-16
Inventor： Rajan Vaidyanathan , Aravinda Kar
Abstract: A method of forming surface modified substrates includes providing a substrate of material (M) having a bulk portion and an outer surface integrated with the bulk portion. A coating is deposited including metal organic molecules including at least one metal X or particles of metal X onto the outer surface. The coating is laser irradiated with a laser beam, where atoms of metal X diffuse into the outer surface to form a modified surface layer including both M and atoms of metal X on the bulk portion. The modified surface layer has a thickness of at least 1 nm, and a 25° C. electrical conductivity that is at least 2.5% above or 2.5% below a 25° C. electrical conductivity in the bulk portion.
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