公开(公告)号：US12103246B2

公开(公告)日：2024-10-01

申请号：US15814267

申请日：2017-11-15

申请人： USHIO DENKI KABUSHIKI KAISHA

发明人： Motohiro Sakai ,  Shinji Suzuki ,  Fumitoshi Takemoto ,  Kenichi Hirose

IPC分类号： B29C65/74 ,  B29C35/08 ,  B29C59/14 ,  B29C59/16 ,  B29C65/00 ,  B29C65/02 ,  B29C65/14 ,  B29L11/00 ,  B29L31/00 ,  B81C3/00 ,  C09J5/02 ,  H01L21/18 ,  H01L21/20 ,  H01L21/67

CPC分类号： B29C65/7415 ,  B29C59/14 ,  B29C59/16 ,  B29C65/1406 ,  B29C65/1432 ,  B29C66/028 ,  B29C66/1122 ,  B29C66/53461 ,  B29C66/54 ,  B29C66/83221 ,  B81C3/001 ,  C09J5/02 ,  H01L21/187 ,  H01L21/2007 ,  H01L21/67005 ,  B29C2035/0827 ,  B29C65/02 ,  B29C66/232 ,  B29C66/30223 ,  B29C66/534 ,  B29C66/71 ,  B29C66/712 ,  B29C66/73366 ,  B29C66/7465 ,  B29C66/919 ,  B29C66/92445 ,  B29C66/929 ,  B29C66/949 ,  B29L2011/00 ,  B29L2011/0016 ,  B29L2031/756 ,  C09J2400/143 ,  C09J2400/146 ,  C09J2400/163 ,  C09J2400/166 ,  B29C66/71 ,  B29K2083/00 ,  B29C66/71 ,  B29K2023/38 ,  B29C66/71 ,  B29K2069/00 ,  B29C66/71 ,  B29K2025/06

摘要： Disclosed herein is a method of bonding substrates, a microchip, and a method of manufacturing the microchip capable of joining two substrates in a higher adhered state even when at least one of the substrate has a warpage or a roll. A method of bonding a first substrate and a second substrate each of which is made of glass or a resin comprises: a surface activating step for activating each of joining surfaces of the first substrate and the second substrate; and a pressurizing step for pressurizing the first substrate and the second substrate in a state that the first substrate and the second substrate are stacked such that respective joining surfaces contact each other. The joining surface of the first substrate and/or the joining surface of the second substrate are constituted with a plurality of joining regions segmented to be separate from one another by a segmenting recessed portion.