公开(公告)号：US07847391B2

公开(公告)日：2010-12-07

申请号：US12165932

申请日：2008-07-01

申请人： Ubol Udompanyavit ,  Sreenivasan K. Koduri ,  Gerald William Steele ,  Jason Marc Cole ,  Steven Kummerl

发明人： Ubol Udompanyavit ,  Sreenivasan K. Koduri ,  Gerald William Steele ,  Jason Marc Cole ,  Steven Kummerl

IPC分类号： H01L23/52 ,  H01L23/48

CPC分类号： H01L23/495 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/28 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/2919 ,  H01L2224/48091 ,  H01L2224/48195 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package that comprises a lead frame, an integrated circuit located on the lead frame and a shunt resistor coupled to the lead frame and to the integrated circuit. The shunt resistor has a lower temperature coefficient of resistance than the lead frame, and the lead frame has a lower resistivity than the shunt resistor. The shunt resistor has a low-resistance coupling to external leads of the lead frame, or, the shunt resistor has its own integrated external leads.

摘要翻译： 一种集成电路封装，包括引线框架，位于引线框架上的集成电路和耦合到引线框架和集成电路的分流电阻器。 分流电阻器具有比引线框架更低的电阻温度系数，并且引线框架具有比分流电阻器更低的电阻率。 分流电阻器具有与引线框架的外部引线的低电阻耦合，或者分流电阻器具有其自己的集成外部引线。

公开(公告)号：US20120199951A1

公开(公告)日：2012-08-09

申请号：US13412347

申请日：2012-03-05

申请人： Ubol Udompanyavit ,  Steven Kummerl

发明人： Ubol Udompanyavit ,  Steven Kummerl

IPC分类号： H01L27/04 ,  H01L21/56

CPC分类号： H01L23/495 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48195 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/0665 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package that comprises a lead frame 105, an integrated circuit located on the lead frame and a shunt resistor coupled to the integrated circuit. The shunt resistor has a lower temperature coefficient of resistance than the lead frame, and the lead frame has a lower resistivity than the shunt resistor. The shunt resistor has a low-resistance coupling to external leads of the lead frame, or, the shunt resistor has its own integrated external leads.

摘要翻译： 集成电路封装，其包括引线框架105，位于引线框架上的集成电路和耦合到集成电路的分流电阻器。 分流电阻器具有比引线框架更低的电阻温度系数，并且引线框架具有比分流电阻器更低的电阻率。 分流电阻器具有与引线框架的外部引线的低电阻耦合，或者分流电阻器具有其自己的集成外部引线。

公开(公告)号：US20100001382A1

公开(公告)日：2010-01-07

申请号：US12165932

申请日：2008-07-01

申请人： Ubol Udompanyavit ,  Sreenivasan K. Koduri ,  Gerald William Steele ,  Jason Marc Cole ,  Steven Kummerl

发明人： Ubol Udompanyavit ,  Sreenivasan K. Koduri ,  Gerald William Steele ,  Jason Marc Cole ,  Steven Kummerl

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L23/495 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/28 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/2919 ,  H01L2224/48091 ,  H01L2224/48195 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package that comprises a lead frame, an integrated circuit located on the lead frame and a shunt resistor coupled to the lead frame and to the integrated circuit. The shunt resistor has a lower temperature coefficient of resistance than the lead frame, and the lead frame has a lower resistivity than the shunt resistor. The shunt resistor has a low-resistance coupling to external leads of the lead frame, or, the shunt resistor has its own integrated external leads.

摘要翻译： 一种集成电路封装，包括引线框架，位于引线框架上的集成电路和耦合到引线框架和集成电路的分流电阻器。 分流电阻器具有比引线框架更低的电阻温度系数，并且引线框架具有比分流电阻器更低的电阻率。 分流电阻器具有与引线框架的外部引线的低电阻耦合，或者分流电阻器具有其自己的集成外部引线。

公开(公告)号：US08129228B2

公开(公告)日：2012-03-06

申请号：US12910933

申请日：2010-10-25

申请人： Ubol Udompanyavit ,  Sreenivasan K Koduri ,  Gerald W Steele ,  Jason M Cole ,  Steven Kummerl

发明人： Ubol Udompanyavit ,  Sreenivasan K Koduri ,  Gerald W Steele ,  Jason M Cole ,  Steven Kummerl

IPC分类号： H01L21/00

CPC分类号： H01L23/495 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/28 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/2919 ,  H01L2224/48091 ,  H01L2224/48195 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package that comprises a lead frame, an integrated circuit located on the lead frame and a shunt resistor coupled to the lead frame and to the integrated circuit. The shunt resistor has a lower temperature coefficient of resistance than the lead frame, and the lead frame has a lower resistivity than the shunt resistor. The shunt resistor has a low-resistance coupling to external leads of the lead frame, or, the shunt resistor has its own integrated external leads.

摘要翻译： 一种集成电路封装，包括引线框架，位于引线框架上的集成电路和耦合到引线框架和集成电路的分流电阻器。 分流电阻器具有比引线框架更低的电阻温度系数，引线框架具有比分流电阻器更低的电阻率。 分流电阻器具有与引线框架的外部引线的低电阻耦合，或者分流电阻器具有其自己的集成外部引线。

公开(公告)号：US20110033985A1

公开(公告)日：2011-02-10

申请号：US12910933

申请日：2010-10-25

申请人： Ubol Udompanyavit ,  Sreenivasan K. Koduri ,  Gerald W. Steele ,  Jason Marc Cole ,  Steven Kummerl

发明人： Ubol Udompanyavit ,  Sreenivasan K. Koduri ,  Gerald W. Steele ,  Jason Marc Cole ,  Steven Kummerl

IPC分类号： H01L21/60

CPC分类号： H01L23/495 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/28 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/2919 ,  H01L2224/48091 ,  H01L2224/48195 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package that comprises a lead frame, an integrated circuit located on the lead frame and a shunt resistor coupled to the lead frame and to the integrated circuit. The shunt resistor has a lower temperature coefficient of resistance than the lead frame, and the lead frame has a lower resistivity than the shunt resistor. The shunt resistor has a low-resistance coupling to external leads of the lead frame, or, the shunt resistor has its own integrated external leads.

摘要翻译： 一种集成电路封装，包括引线框架，位于引线框架上的集成电路和耦合到引线框架和集成电路的分流电阻器。 分流电阻器具有比引线框架更低的电阻温度系数，并且引线框架具有比分流电阻器更低的电阻率。 分流电阻器具有与引线框架的外部引线的低电阻耦合，或者分流电阻器具有其自己的集成外部引线。

公开(公告)号：US08324721B2

公开(公告)日：2012-12-04

申请号：US13412347

申请日：2012-03-05

申请人： Ubol Udompanyavit ,  Steve Kummerl

发明人： Ubol Udompanyavit ,  Steve Kummerl

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L23/495 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48195 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/0665 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package that comprises a lead frame 105, an integrated circuit located on the lead frame and a shunt resistor coupled to the integrated circuit. The shunt resistor has a lower temperature coefficient of resistance than the lead frame, and the lead frame has a lower resistivity than the shunt resistor. The shunt resistor has a low-resistance coupling to external leads of the lead frame, or, the shunt resistor has its own integrated external leads.

摘要翻译： 一种集成电路封装，包括引线框架105，位于引线框架上的集成电路和耦合到集成电路的分流电阻器。 分流电阻器具有比引线框架更低的电阻温度系数，并且引线框架具有比分流电阻器更低的电阻率。 分流电阻器具有与引线框架的外部引线的低电阻耦合，或者分流电阻器具有其自己的集成外部引线。

公开(公告)号：US08581660B1

公开(公告)日：2013-11-12

申请号：US13454730

申请日：2012-04-24

申请人： Marie Denison ,  Ubol Udompanyavit ,  Osvaldo Jorge Lopez ,  Joseph Maurice Khayat

发明人： Marie Denison ,  Ubol Udompanyavit ,  Osvaldo Jorge Lopez ,  Joseph Maurice Khayat

IPC分类号： H01L25/00

CPC分类号： H01L24/97 ,  H01L24/37 ,  H01L24/38 ,  H01L24/40 ,  H01L24/41 ,  H01L25/18 ,  H01L2224/37599 ,  H01L2224/38 ,  H01L2224/40245 ,  H01L2224/48137 ,  H01L2224/4826 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H02M2001/0009 ,  H01L2924/00 ,  H01L2224/37099

摘要： A power transistor module including a power transistor with a first common power node, and a split control node. A first clip is connected to a portion of a second power node so that current through a first control segment of the control node is directed through a first transistor portion and through the first clip. A second clip is connected to another portion of the second power node so that current through a second control segment is directed through a second transistor portion and through the second clip. A ratio of an area of the first transistor portion to a combined area of the first and second portions is 5 percent to 75 percent. A shunt is coupled in series to the first clip. The shunt may be directly electrically connected to the first portion of the power transistor.

摘要翻译： 一种功率晶体管模块，包括具有第一公共功率节点的功率晶体管和分离控制节点。 第一夹子连接到第二功率节点的一部分，使得通过控制节点的第一控制段的电流被引导通过第一晶体管部分并且穿过第一夹子。 第二夹子连接到第二功率节点的另一部分，使得通过第二控制段的电流被引导通过第二晶体管部分并且穿过第二夹子。 第一晶体管部分的面积与第一和第二部分的组合面积的比率为5％至75％。 分流器与第一个夹子串联耦合。 分路可以直接电连接到功率晶体管的第一部分。

公开(公告)号：US20130278328A1

公开(公告)日：2013-10-24

申请号：US13454730

申请日：2012-04-24

申请人： Marie Denison ,  Ubol Udompanyavit ,  Osvaldo Jorge Lopez ,  Joseph Maurice Khayat

发明人： Marie Denison ,  Ubol Udompanyavit ,  Osvaldo Jorge Lopez ,  Joseph Maurice Khayat

IPC分类号： G05F1/10

CPC分类号： H01L24/97 ,  H01L24/37 ,  H01L24/38 ,  H01L24/40 ,  H01L24/41 ,  H01L25/18 ,  H01L2224/37599 ,  H01L2224/38 ,  H01L2224/40245 ,  H01L2224/48137 ,  H01L2224/4826 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H02M2001/0009 ,  H01L2924/00 ,  H01L2224/37099

摘要： A power transistor module including a power transistor with a first common power node, and a split control node. A first clip is connected to a portion of a second power node so that current through a first control segment of the control node is directed through a first transistor portion and through the first clip. A second clip is connected to another portion of the second power node so that current through a second control segment is directed through a second transistor portion and through the second clip. A ratio of an area of the first transistor portion to a combined area of the first and second portions is 5 percent to 75 percent. A shunt is coupled in series to the first clip. The shunt may be directly electrically connected to the first portion of the power transistor.

摘要翻译： 一种功率晶体管模块，包括具有第一公共功率节点的功率晶体管和分离控制节点。 第一夹子连接到第二功率节点的一部分，使得通过控制节点的第一控制段的电流被引导通过第一晶体管部分并且穿过第一夹子。 第二夹子连接到第二功率节点的另一部分，使得通过第二控制段的电流被引导通过第二晶体管部分并且穿过第二夹子。 第一晶体管部分的面积与第一和第二部分的组合面积的比率为5％至75％。 分流器与第一个夹子串联耦合。 分路可以直接电连接到功率晶体管的第一部分。