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    THERMOMETER DEVICE AND METHOD OF MAKING
    1.
    发明申请
    THERMOMETER DEVICE AND METHOD OF MAKING 有权
    温度计装置及其制造方法

    公开(公告)号：US20150036719A1

    公开(公告)日：2015-02-05

    申请号：US14272450

    申请日：2014-05-07

    申请人： Sreenivasan K Koduri

    发明人： Sreenivasan K Koduri

    IPC分类号： G01K7/42 ,  G01K13/00

    CPC分类号： G01K13/002 ,  G01K1/14 ,  G01K1/18 ,  G01K13/004 ,  Y10T29/49002

    摘要： A method of manufacturing a thermometer probe includes: obtaining a hollow housing having an open end and a curved inner surface; obtaining a flexible detecting component having an adhesive layer; obtaining an insertion component; detachably attaching the flexible detecting component to the insertion component; inserting the insertion component, having the flexible detecting component attached thereto, through the open end of the hollow housing and into the hollow housing such that the adhesive layer is disposed between the insertion component and the inner surface; and adhering, via the adhesive layer, the flexible detecting component to the curved inner surface.

    摘要翻译： 制造温度计探针的方法包括：获得具有开口端和弯曲内表面的中空壳体; 获得具有粘合剂层的柔性检测部件; 获得插入组件; 将柔性检测部件可拆卸地安装在插入部件上; 将具有附接到其上的柔性检测部件的插入部件插入中空壳体的开口端并插入中空壳体中，使得粘合剂层设置在插入部件和内表面之间; 并且通过粘合剂层将柔性检测部件粘附到弯曲的内表面。

    Process and system to package residual quantities of wafer level packages
    7.
    发明授权
    Process and system to package residual quantities of wafer level packages 有权
    封装晶圆级封装剩余量的工艺和系统

    公开(公告)号：US07189938B2

    公开(公告)日：2007-03-13

    申请号：US11036714

    申请日：2005-01-14

    申请人： Sreenivasan K. Koduri ,  Matthew J. Stovall

    发明人： Sreenivasan K. Koduri ,  Matthew J. Stovall

    IPC分类号： B07C5/344

    CPC分类号： H01L21/67271 ,  H01L21/67132 ,  H01L21/67144

    摘要： Various preferred processes and equipment are described herein that more efficiently handle residual semiconductor parts during packaging. The processes include picking and removing all of the bad parts from a wafer before picking the good parts and picking all of the good parts first without picking any part necessary to align the wafer. The equipment includes several embodiments of a transfer machine that accommodates the efficient transfer of semiconductor parts between tacky film, waffle packs and tape and reel containment systems. Residual good parts are stored in waffle packs and can be subsequently reused in the packaging process.

    摘要翻译： 本文描述了各种优选的方法和设备，其在包装期间更有效地处理残余的半导体部件。 这些过程包括在挑选好的部件之前从晶片中挑选和去除所有不良部件，并首先挑选所有的良好部件，而不需要选择任何必要的对准晶片的部分。 该设备包括转移机器的几个实施例，其适应于胶粘膜，华夫饼纸包和带卷收容系统之间的半导体部件的有效转移。 剩余的良好部件储存在华夫饼包中，随后可以在包装过程中重复使用。

    Method of inkless wafer blind assembly
    8.
    发明授权
    Method of inkless wafer blind assembly 有权
    无墨晶圆盲组装方法

    公开(公告)号：US06927081B2

    公开(公告)日：2005-08-09

    申请号：US10422545

    申请日：2003-04-24

    申请人： Balamurugan Subramanian ,  Sreenivasan K. Koduri

    发明人： Balamurugan Subramanian ,  Sreenivasan K. Koduri

    IPC分类号： G01B5/08 ,  G01B11/08 ,  G01R31/26 ,  H01L21/66

    CPC分类号： G01B11/08

    摘要： A method of blind assembly processing a wafer by pick and place equipment is described. This method includes determining the wafer diameter or radius and determining the bad die edge exclusive zone. This determined diameter or radius and the determined edge exclusive zone is used to make a black paper mask and place it over the wafer or to cut or saw away from the wafer the bad die edge exclusive zone. This enables the pick and place equipment to avoid the bad dies in the bad die edge exclusive zone.

    摘要翻译： 描述了通过拾取和放置设备盲片组装处理晶片的方法。 该方法包括确定晶片直径或半径并确定不良裸片边缘专属区域。 该确定的直径或半径和确定的边缘独占区域用于制造黑色纸掩模并将其放置在晶片上或者从晶片上切割或锯离不良的裸片边缘专属区域。 这使得拾取和放置设备避免了坏死边缘专属区域中的坏死。

    Back side coating of semiconductor wafers
    9.
    发明授权
    Back side coating of semiconductor wafers 有权
    半导体晶片的背面涂层

    公开(公告)号：US06734532B2

    公开(公告)日：2004-05-11

    申请号：US10006576

    申请日：2001-12-06

    申请人： Sreenivasan K. Koduri ,  Kenji Masumoto ,  Mutsumi Masumoto

    发明人： Sreenivasan K. Koduri ,  Kenji Masumoto ,  Mutsumi Masumoto

    IPC分类号： H01L2358

    CPC分类号： H01L23/562 ,  H01L23/3157 ,  H01L23/552 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/01055 ,  H01L2924/01087 ,  H01L2924/04941

    摘要： A semiconductor device comprising a semiconductor chip having an active and a passive surface; the active surface includes an integrated circuit and input/output pads suitable for metallurgical contacts. Further, the device has a protective plastic film (polyimide, epoxy resin, or silicone) of controlled and uniform thickness (20 to 60 &mgr;m) selectively attached to the passive surface. The film is suitable to absorb light of visible and ultraviolet wavelengths, to remain insensitive to moisture absorption, and to exert thermomechanical stress on the chip such that this stress at least partially neutralizes the stress exerted by an outside part after chip assembly.

    摘要翻译： 一种半导体器件，包括具有有源和无源表面的半导体芯片; 主动表面包括集成电路和适用于冶金接触的输入/输出焊盘。 此外，该装置具有选择性地连接到被动表面的受控均匀厚度（20至60μm）的保护性塑料膜（聚酰亚胺，环氧树脂或硅树脂）。 该膜适于吸收可见光和紫外线波长的光，对吸湿不敏感，并在芯片上施加热机械应力，使得该应力至少部分地中和芯片组装后由外部部分施加的应力。