公开(公告)号：US09111818B2

公开(公告)日：2015-08-18

申请号：US14018757

申请日：2013-09-05

Applicant: Unimicron Technology Corporation

Inventor： Chun-Ting Lin ,  Yu-Chung Hsieh ,  Ying-Tung Wang ,  Ying-Chih Chan

IPC: H05K7/10 ,  H05K7/12 ,  H01L23/00 ,  H01L23/498 ,  H01L21/48 ,  H05K3/40

CPC classification number: H01L24/13 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/11 ,  H01L24/16 ,  H01L2224/1132 ,  H01L2224/11422 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/1161 ,  H01L2224/11622 ,  H01L2224/11823 ,  H01L2224/11825 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13022 ,  H01L2224/13026 ,  H01L2224/13076 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/1357 ,  H01L2224/13582 ,  H01L2224/13583 ,  H01L2224/13611 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/13664 ,  H01L2224/1369 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81192 ,  H01L2924/351 ,  H01L2924/381 ,  H01L2924/3841 ,  H05K3/4007 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A packaging substrate is provided, including a substrate body having a plurality of conductive pads, an insulating protective layer formed on the substrate body for the conductive pads to be exposed therefrom, and a plurality of conductive pillars disposed on the conductive pads. Each of the conductive pillars has a bottom end and a top end narrower than the bottom end, thereby forming a cone-shaped structure that does not have a wing structure. Therefore, the distance between contact points is reduced and the demands for fine-pitch and multi-joints are satisfied.

Abstract translation: 提供一种封装基板，包括具有多个导电焊盘的基板主体，形成在基板主体上用于要暴露的导电焊盘的绝缘保护层，以及设置在导电焊盘上的多个导电柱。 每个导电柱具有比底端窄的底端和顶端，从而形成不具有翼结构的锥形结构。 因此，接触点之间的距离减小，满足细间距和多关节的要求。

公开(公告)号：US20140182912A1

公开(公告)日：2014-07-03

申请号：US14018757

申请日：2013-09-05

Applicant: Unimicron Technology Corporation

Inventor： Chun-Ting Lin ,  Yu-Chung Hsieh ,  Ying-Tung Wang ,  Ying-Chih Chan

IPC: H05K1/11

CPC classification number: H01L24/13 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/11 ,  H01L24/16 ,  H01L2224/1132 ,  H01L2224/11422 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/1161 ,  H01L2224/11622 ,  H01L2224/11823 ,  H01L2224/11825 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13022 ,  H01L2224/13026 ,  H01L2224/13076 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/1357 ,  H01L2224/13582 ,  H01L2224/13583 ,  H01L2224/13611 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/13664 ,  H01L2224/1369 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81192 ,  H01L2924/351 ,  H01L2924/381 ,  H01L2924/3841 ,  H05K3/4007 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A packaging substrate is provided, including a substrate body having a plurality of conductive pads, an insulating protective layer formed on the substrate body for the conductive pads to be exposed therefrom, and a plurality of conductive pillars disposed on the conductive pads. Each of the conductive pillars has a bottom end and a top end narrower than the bottom end, thereby forming a cone-shaped structure that does not have a wing structure. Therefore, the distance between contact points is reduced and the demands for fine-pitch and multi-joints are satisfied.

Abstract translation: 提供一种封装基板，包括具有多个导电焊盘的基板主体，形成在基板主体上用于要暴露的导电焊盘的绝缘保护层，以及设置在导电焊盘上的多个导电柱。 每个导电柱具有比底端窄的底端和顶端，从而形成不具有翼结构的锥形结构。 因此，接触点之间的距离减小，满足细间距和多关节的要求。

公开(公告)号：US20140239490A1

公开(公告)日：2014-08-28

申请号：US13777097

申请日：2013-02-26

Applicant: UNIMICRON TECHNOLOGY CORPORATION

Inventor： Ying-Tung Wang

IPC: H01L23/498 ,  H01L21/768

CPC classification number: H01L23/49811 ,  H01L21/4853 ,  H01L21/4857 ,  H01L23/49822 ,  H01L2224/16225 ,  H01L2224/73204

Abstract: A packaging substrate and a fabrication method thereof are disclosed. The packaging substrate includes: a substrate body having a plurality of first and second conductive pads formed on a surface thereof; a first insulating layer formed on the surface of the substrate body and having a plurality of first and second openings for respectively exposing the first and second conductive pads; a conductive layer formed on the first and second conductive pads and the first insulating layer around peripheries of the first and second conductive pads; a plurality of first and second conductive bumps formed on the conductive layer on the first and second conductive pads, respectively; a solder layer formed on the second conductive bumps; and a plurality of conductive posts formed on the first conductive bumps and having a width different from that of the first conductive bumps. The invention improves the fabrication efficiency.

Abstract translation: 公开了一种封装基板及其制造方法。 包装基板包括：基板主体，其具有形成在其表面上的多个第一和第二导电焊盘; 第一绝缘层，其形成在所述基板主体的表面上，并且具有用于分别暴露所述第一和第二导电焊盘的多个第一和第二开口; 形成在第一和第二导电焊盘上的导电层和围绕第一和第二导电焊盘周围的第一绝缘层; 分别形成在第一和第二导电焊盘上的导电层上的多个第一和第二导电凸块; 形成在所述第二导电凸块上的焊料层; 以及形成在所述第一导电凸块上并且具有与所述第一导电凸块的宽度不同的宽度的多个导电柱。 本发明提高了制造效率。