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公开(公告)号：US09111818B2
公开(公告)日：2015-08-18
申请号：US14018757
申请日：2013-09-05
Applicant: Unimicron Technology Corporation
Inventor： Chun-Ting Lin , Yu-Chung Hsieh , Ying-Tung Wang , Ying-Chih Chan
CPC classification number: H01L24/13 , H01L21/4853 , H01L23/49811 , H01L23/49816 , H01L23/49838 , H01L24/11 , H01L24/16 , H01L2224/1132 , H01L2224/11422 , H01L2224/11462 , H01L2224/11464 , H01L2224/1161 , H01L2224/11622 , H01L2224/11823 , H01L2224/11825 , H01L2224/13017 , H01L2224/13019 , H01L2224/13022 , H01L2224/13026 , H01L2224/13076 , H01L2224/13082 , H01L2224/131 , H01L2224/13147 , H01L2224/1357 , H01L2224/13582 , H01L2224/13583 , H01L2224/13611 , H01L2224/13644 , H01L2224/13655 , H01L2224/13664 , H01L2224/1369 , H01L2224/16225 , H01L2224/16227 , H01L2224/81192 , H01L2924/351 , H01L2924/381 , H01L2924/3841 , H05K3/4007 , H01L2924/00014 , H01L2924/014 , H01L2924/00012 , H01L2924/00
Abstract: A packaging substrate is provided, including a substrate body having a plurality of conductive pads, an insulating protective layer formed on the substrate body for the conductive pads to be exposed therefrom, and a plurality of conductive pillars disposed on the conductive pads. Each of the conductive pillars has a bottom end and a top end narrower than the bottom end, thereby forming a cone-shaped structure that does not have a wing structure. Therefore, the distance between contact points is reduced and the demands for fine-pitch and multi-joints are satisfied.
Abstract translation: 提供一种封装基板，包括具有多个导电焊盘的基板主体，形成在基板主体上用于要暴露的导电焊盘的绝缘保护层，以及设置在导电焊盘上的多个导电柱。 每个导电柱具有比底端窄的底端和顶端，从而形成不具有翼结构的锥形结构。 因此，接触点之间的距离减小，满足细间距和多关节的要求。
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公开(公告)号：US20140182912A1
公开(公告)日：2014-07-03
申请号：US14018757
申请日：2013-09-05
Applicant: Unimicron Technology Corporation
Inventor： Chun-Ting Lin , Yu-Chung Hsieh , Ying-Tung Wang , Ying-Chih Chan
IPC: H05K1/11
CPC classification number: H01L24/13 , H01L21/4853 , H01L23/49811 , H01L23/49816 , H01L23/49838 , H01L24/11 , H01L24/16 , H01L2224/1132 , H01L2224/11422 , H01L2224/11462 , H01L2224/11464 , H01L2224/1161 , H01L2224/11622 , H01L2224/11823 , H01L2224/11825 , H01L2224/13017 , H01L2224/13019 , H01L2224/13022 , H01L2224/13026 , H01L2224/13076 , H01L2224/13082 , H01L2224/131 , H01L2224/13147 , H01L2224/1357 , H01L2224/13582 , H01L2224/13583 , H01L2224/13611 , H01L2224/13644 , H01L2224/13655 , H01L2224/13664 , H01L2224/1369 , H01L2224/16225 , H01L2224/16227 , H01L2224/81192 , H01L2924/351 , H01L2924/381 , H01L2924/3841 , H05K3/4007 , H01L2924/00014 , H01L2924/014 , H01L2924/00012 , H01L2924/00
Abstract: A packaging substrate is provided, including a substrate body having a plurality of conductive pads, an insulating protective layer formed on the substrate body for the conductive pads to be exposed therefrom, and a plurality of conductive pillars disposed on the conductive pads. Each of the conductive pillars has a bottom end and a top end narrower than the bottom end, thereby forming a cone-shaped structure that does not have a wing structure. Therefore, the distance between contact points is reduced and the demands for fine-pitch and multi-joints are satisfied.
Abstract translation: 提供一种封装基板，包括具有多个导电焊盘的基板主体，形成在基板主体上用于要暴露的导电焊盘的绝缘保护层，以及设置在导电焊盘上的多个导电柱。 每个导电柱具有比底端窄的底端和顶端，从而形成不具有翼结构的锥形结构。 因此，接触点之间的距离减小，满足细间距和多关节的要求。
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公开(公告)号：US20130249083A1
公开(公告)日：2013-09-26
申请号：US13753906
申请日：2013-01-30
Applicant: UNIMICRON TECHNOLOGY CORPORATION
Inventor： Dyi-Chung Hu , Ying-Chih Chan , Chun-Ting Lin
IPC: H01L23/498
CPC classification number: H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/15311 , H01L2924/00
Abstract: A packaging substrate is provided, wherein a plurality of conductive posts together with a conductive bonding layer formed thereon form a plurality of external connection structures with the same height, thereby preventing tilted stack structures and poor coplanarity in a subsequent stacking process.
Abstract translation: 提供了一种封装基板，其中多个导电柱与其上形成的导电接合层一起形成具有相同高度的多个外部连接结构，从而防止在随后的堆叠过程中倾斜的堆叠结构和差的共面性。
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