公开(公告)号：US09960130B2

公开(公告)日：2018-05-01

申请号：US14615436

申请日：2015-02-06

申请人： United Test and Assembly Center Ltd.

发明人： Rui Huang ,  Chun Hong Wo ,  Antonio Jr. Bambalan DiMaano

IPC分类号： H01L23/48 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L24/05 ,  H01L23/3171 ,  H01L24/03 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05017 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/0519 ,  H01L2224/0529 ,  H01L2224/05393 ,  H01L2224/05552 ,  H01L2224/05558 ,  H01L2224/05618 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/48227 ,  H01L2224/48453 ,  H01L2224/48465 ,  H01L2224/48507 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/013 ,  H01L2924/01029 ,  H01L2924/00

摘要： Devices and methods for forming a device are disclosed. The device includes a contact region disposed over a last interconnect level of the device. The device includes a final passivation layer having at least an opening which at least partially exposes a top surface of the contact region and a buffer layer disposed at least over a first exposed portion of the top surface of the contact region. When an electrically conductive interconnection couples to the contact region, the buffer layer absorbs a portion of a force exerted to form an interconnection between the electrically conductive interconnection and the contact region.