公开(公告)号：US20190218669A1

公开(公告)日：2019-07-18

申请号：US16250842

申请日：2019-01-17

Applicant: VIAVI SOLUTIONS INC.

Inventor： Adam Andrew PREUSS ,  Richard A. BRADLEY, JR. ,  Georg J. OCKENFUSS ,  Markus K. TILSCH ,  Andrew CLARK ,  Marius GRIGONIS ,  Andy SHKABKO ,  Nicolas Alexander DAVIS ,  Anthony Jay Kemp COTTRELL

IPC: C23C28/00 ,  C23C4/131 ,  C23C4/08 ,  C23C4/134 ,  C23C4/067 ,  C23C14/16 ,  C23C14/34

CPC classification number: C23C28/34 ,  C23C4/06 ,  C23C4/067 ,  C23C4/08 ,  C23C4/131 ,  C23C4/134 ,  C23C14/025 ,  C23C14/028 ,  C23C14/06 ,  C23C14/165 ,  C23C14/34 ,  C23C14/564 ,  C23C16/0281 ,  C23C16/24 ,  C23C16/4401 ,  C23C16/4407 ,  C23C16/4412 ,  C23C28/023 ,  C23C28/322 ,  H01J37/32477

Abstract: A device including a hard shield material; a layer including aluminum or copper; and a silicon layer having a first thickness is disclosed. The device can also include a silicon layer having a second thickness. A method of making the device is also disclosed.