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1.发明授权Method for in-situ monitoring of patterned substrate processing using reflectometry. 有权使用反射计原位监测图案化基板处理的方法。公开(公告)号：US07019844B2
公开(公告)日：2006-03-28
申请号：US10286410
申请日：2002-11-01
IPC分类号： G01B9/02
CPC分类号： G01B11/0625 , G01B11/0683 , G01N21/8422
摘要： A method of determining a parameter of interest during fabrication of a patterned substrate includes illuminating at least a portion of the patterned substrate with a normal incident light beam, obtaining a measured net reflectance spectrum of the portion of the patterned substrate from a normal reflected light beam, calculating a modeled net reflectance spectrum of the portion of the patterned substrate, and determining a set of parameters that provides a close match between the measured net reflectance spectrum and the modeled net reflectance spectrum. The modeled net reflectance spectrum is calculated as a weighted incoherent sum of reflectances from n≧1 different regions constituting the portion of the patterned substrate, wherein the reflectance of each of the n different regions is a weighted coherent sum of reflected fields from k≧1 laterally-distinct areas constituting the region.
摘要翻译： 在图案化衬底的制造期间确定感兴趣参数的方法包括用正常入射光束照射图案化衬底的至少一部分，从正常反射光束获得图案化衬底的部分的测量的净反射光谱 计算图案化衬底的部分的建模的净反射光谱，以及确定提供测量的净反射光谱和建模的净反射光谱之间的紧密匹配的一组参数。 模拟的净反射光谱被计算为构成图案化衬底部分的n≥1个不同区域的反射率的加权不相干和，其中n个不同区域中的每一个的反射率是来自k>的反射场的加权相干和， =构成该地区的1个横向不同的区域。
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公开(公告)号：US07399711B2
公开(公告)日：2008-07-15
申请号：US10286409
申请日：2002-11-01
IPC分类号： H01I21/302
CPC分类号： G01B11/0625 , G01B11/0616 , G01B11/0683 , G01N21/8422
摘要： A method of controlling a recess etch process for a multilayered substrate having a trench therein and a column of material deposited in the trench includes determining a first dimension from a surface of the substrate to a reference point in the substrate by obtaining a measured net reflectance of at least a portion of the substrate including the trench, computing a modeled net reflectance of the portion of the substrate as a weighted incoherent sum of reflectances from n≧1 different regions constituting the portion of the substrate, determining a set of parameters that provides a close match between the measured net reflectance and the modeled net reflectance, and extracting the first dimension from the set of parameters; computing an endpoint of the process as a function of the first dimension and a desired recess depth measured from the reference point; and etching down from a surface of the column of material until the endpoint is reached.
摘要翻译： 控制其中具有沟槽的多层衬底的凹陷蚀刻工艺和沉积在沟槽中的材料柱的方法包括通过获得测量的净反射率来确定从衬底的表面到衬底中的参考点的第一维度 衬底的至少一部分包括沟槽，计算衬底部分的建模净反射率作为构成衬底部分的n≥1个不同区域的反射率的加权非相干和，确定提供的一组参数 测量的净反射率和建模的净反射率之间的紧密匹配，并从该组参数中提取第一维度; 计算作为第一尺寸的函数的过程的端点和从参考点测量的期望的凹陷深度; 并且从材料柱的表面向下蚀刻直到达到端点。
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公开(公告)号：US08358416B2
公开(公告)日：2013-01-22
申请号：US13415763
申请日：2012-03-08
IPC分类号： G01N21/00
CPC分类号： G01N21/274 , G01J3/02 , G01J3/0205 , G01J3/0218 , G01J3/0294 , G01J3/443 , G01N21/68
摘要： A processing system having a chamber for in-situ optical interrogation of plasma emission to quantitatively measure normalized optical emission spectra is provided. The processing chamber includes a confinement ring assembly, a flash lamp, and a set of quartz windows. The processing chamber also includes a plurality of collimated optical assemblies, the plurality of collimated optical assemblies are optically coupled to the set of quartz windows. The processing chamber also includes a plurality of fiber optic bundles. The processing chamber also includes a multi-channel spectrometer, the multi-channel spectrometer is configured with at least a signal channel and a reference channel, the signal channel is optically coupled to at least the flash lamp, the set of quartz windows, the set of collimated optical assemblies, the illuminated fiber optic bundle, and the collection fiber optic bundle to measure a first signal.
摘要翻译： 提供一种具有用于等离子体发射的原位光询问室以定量测量归一化光发射光谱的处理系统。 处理室包括限制环组件，闪光灯和一组石英窗。 处理室还包括多个准直光学组件，多个准直光学组件光学耦合到该组石英窗口。 处理室还包括多个光纤束。 处理室还包括多通道光谱仪，多通道光谱仪配置有至少一个信号通道和一个参考通道，信号通道光学耦合到至少闪光灯，该组石英窗，该组 准直光学组件，照明光纤束和收集光纤束以测量第一信号。
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4.发明申请公开(公告)号：US20100332201A1
公开(公告)日：2010-12-30
申请号：US12826575
申请日：2010-06-29
CPC分类号： H01J37/32935 , H01J37/32477
摘要： A method for assessing health status of a processing chamber is provided. The method includes executing a recipe. The method also includes receiving processing data from a set of sensors during execution of the recipe. The method further includes analyzing the processing data utilizing a set of multi-variate predictive models. The method yet also includes generating a set of component wear data values. The method yet further includes comparing the set of component wear data values against a set of useful life threshold ranges. The method moreover includes generating a warning if the set of component wear data values is outside of the set of useful life threshold ranges.
摘要翻译： 提供了一种用于评估处理室的健康状况的方法。 该方法包括执行食谱。 该方法还包括在执行配方期间从一组传感器接收处理数据。 该方法还包括利用一组多变量预测模型分析处理数据。 该方法还包括生成一组组件磨损数据值。 该方法还包括将组件磨损数据值集合与一组使用寿命阈值范围进行比较。 该方法还包括如果组件磨损数据值的集合超出了使用寿命阈值范围的集合，则产生警告。
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5.发明申请ARRANGEMENT FOR IDENTIFYING UNCONTROLLED EVENTS AT THE PROCESS MODULE LEVEL AND METHODS THEREOF 有权在过程模块级别识别非受控事件的安排及其方法公开(公告)号：US20100332014A1
公开(公告)日：2010-12-30
申请号：US12826568
申请日：2010-06-29
IPC分类号： G06F19/00
CPC分类号： H01J37/32935 , G05B2219/31202
摘要： A method for detecting an in-situ fast transient event within a processing chamber during substrate processing is provided. The method includes a set of sensors comparing a data set to a set of criteria (in-situ fast transient events) to determine if the first data set includes a potential in-situ fast transient event. If the first data set includes the potential in-situ fast transient event, the method also includes saving an electrical signature that occurs in a time period during which the potential in-situ fast transient event occurs. The method further includes comparing the electrical signature against a set of stored arc signatures. If a match is determined, the method yet also includes classifying the electrical signature as a first in-situ fast transient event and determining a severity level for the first in-situ fast transient event based on a predefined set of threshold ranges.
摘要翻译： 提供了一种用于在衬底处理期间检测处理室内的原位快速瞬变事件的方法。 该方法包括将数据集与一组标准（原位快速瞬变事件）进行比较的一组传感器，以确定第一数据集是否包括潜在的原位快速瞬变事件。 如果第一数据集包括潜在的原位快速瞬变事件，则该方法还包括保存在潜在的原位快速瞬变事件发生的时间段内发生的电特征。 该方法还包括将电特征与一组存储的电弧特征进行比较。 如果确定匹配，则该方法还包括将电特征分类为第一原位快速瞬时事件，并且基于预定义的一组阈值范围来确定第一原位快速瞬时事件的严重性级别。
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6.发明授权Arrangement for identifying uncontrolled events at the process module level and methods thereof 有权用于在过程模块级别识别不受控制的事件的安排及其方法公开(公告)号：US08983631B2
公开(公告)日：2015-03-17
申请号：US12555674
申请日：2009-09-08
IPC分类号： G05B11/01 , G06F19/00 , G06F9/50 , G05B19/418 , G06F11/20
CPC分类号： G06F9/5027 , G05B19/4184 , G05B2219/31202 , G05B2219/31293 , G05B2219/31318 , G05B2219/31481 , G05B2219/32209 , G05B2219/45031 , G06F11/2035 , G06F11/2043 , Y02P90/14 , Y02P90/18
摘要： A process-level troubleshooting architecture (PLTA) configured to facilitate substrate processing in a plasma processing system is provided. The architecture includes a process module controller. The architecture also includes a plurality of sensors, wherein each sensor of the plurality of sensors communicates with the process module controller to collect sensed data about one or more process parameters. The architecture further includes a process-module-level analysis server, wherein the process-module-level analysis server communicates directly with the plurality of sensors and the process module controller. The process-module-level analysis server is configured for receiving data, wherein the data include at least one of the sensed data from the plurality of sensors and process module and chamber data from the process module controller. The process-module-level analysis server is also configured for analyzing the data and sending interdiction data directly to the process module controller when a problem is identified during the substrate processing.
摘要翻译： 提供了一种配置为促进等离子体处理系统中的基板处理的过程级故障排除架构（PLTA）。 该架构包括一个进程模块控制器。 该架构还包括多个传感器，其中多个传感器中的每个传感器与过程模块控制器通信以收集关于一个或多个过程参数的感测数据。 该体系结构还包括一个过程模块级分析服务器，其中过程模块级分析服务器与多个传感器和过程模块控制器直接通信。 过程模块级分析服务器被配置为用于接收数据，其中数据包括来自多个传感器的感测数据中的至少一个以及来自处理模块控制器的处理模块和室数据。 过程模块级分析服务器还被配置为当在衬底处理期间识别出问题时，分析数据并将拦截数据直接发送到过程模块控制器。
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7.发明授权公开(公告)号：US08650002B2
公开(公告)日：2014-02-11
申请号：US12499696
申请日：2009-07-08
CPC分类号： H01J37/32935
摘要： A test system for facilitating determining whether a plasma processing system (which includes a plasma processing chamber) is ready for processing wafers. The test system may include a computer-readable medium storing at least a test program. The test program may include code for receiving electric parameter values derived from signals detected by at least one sensor when no plasma is present in the plasma processing chamber. The test program may also include code for generating electric model parameter values using the electric parameter values and a mathematical model. The test program may also include code for comparing the electric model parameter values with baseline model parameter value information. The test program may also include code for determining readiness of the plasma processing system based on the comparison. The test system may also include circuit hardware for performing one or more tasks associated with the test program.
摘要翻译： 用于有助于确定等离子体处理系统（其包括等离子体处理室）是否准备好用于处理晶片的测试系统。 测试系统可以包括至少存储测试程序的计算机可读介质。 测试程序可以包括用于接收由等离子体处理室中没有等离子体时由至少一个传感器检测到的信号导出的电参数值的代码。 测试程序还可以包括使用电参数值和数学模型产生电模型参数值的代码。 测试程序还可以包括用于将电模型参数值与基准模型参数值信息进行比较的代码。 测试程序还可以包括用于基于比较来确定等离子体处理系统的准备状态的代码。 测试系统还可以包括用于执行与测试程序相关联的一个或多个任务的电路硬件。
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8.发明申请公开(公告)号：US20100332168A1
公开(公告)日：2010-12-30
申请号：US12499696
申请日：2009-07-08
CPC分类号： H01J37/32935
摘要： A test system for facilitating determining whether a plasma processing system (which includes a plasma processing chamber) is ready for processing wafers. The test system may include a computer-readable medium storing at least a test program. The test program may include code for receiving electric parameter values derived from signals detected by at least one sensor when no plasma is present in the plasma processing chamber. The test program may also include code for generating electric model parameter values using the electric parameter values and a mathematical model. The test program may also include code for comparing the electric model parameter values with baseline model parameter value information. The test program may also include code for determining readiness of the plasma processing system based on the comparison. The test system may also include circuit hardware for performing one or more tasks associated with the test program.
摘要翻译： 用于有助于确定等离子体处理系统（其包括等离子体处理室）是否准备好用于处理晶片的测试系统。 测试系统可以包括至少存储测试程序的计算机可读介质。 测试程序可以包括用于接收由等离子体处理室中没有等离子体时由至少一个传感器检测到的信号导出的电参数值的代码。 测试程序还可以包括使用电参数值和数学模型产生电模型参数值的代码。 测试程序还可以包括用于将电模型参数值与基准模型参数值信息进行比较的代码。 测试程序还可以包括用于基于比较来确定等离子体处理系统的准备状态的代码。 测试系统还可以包括用于执行与测试程序相关联的一个或多个任务的电路硬件。
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9.发明授权Automatic fault detection and classification in a plasma processing system and methods thereof 有权等离子体处理系统中的自动故障检测和分类及其方法公开(公告)号：US08989888B2
公开(公告)日：2015-03-24
申请号：US13381643
申请日：2010-06-29
IPC分类号： G06F19/00 , H01L21/00 , H01L21/322 , H01L21/42 , H01L21/469 , G01R31/00 , H01J37/32 , G06F17/00
CPC分类号： H01J37/3299 , G06F17/00 , H01J37/32935
摘要： A method for automatically detecting fault conditions and classifying the fault conditions during substrate processing is provided. The method includes collecting processing data by a set of sensors during the substrate processing. The method also includes sending the processing data to a fault detection/classification component. The method further includes performing data manipulation of the processing data by the fault detection/classification component. The method yet also includes executing a comparison between the processing data and a plurality of fault models stored within a fault library. Each fault model of the plurality of fault models represents a set of data characterizing a specific fault condition. Each fault model includes at least a fault signature, a fault boundary, and a set of principal component analysis (PCA) parameters.
摘要翻译： 提供了一种在基板处理过程中自动检测故障状况和分类故障条件的方法。 该方法包括在衬底处理期间通过一组传感器收集处理数据。 该方法还包括将处理数据发送到故障检测/分类组件。 该方法还包括通过故障检测/分类部件对处理数据进行数据处理。 该方法还包括执行处理数据与存储在故障库内的多个故障模型之间的比较。 多个故障模型的每个故障模型表示表征特定故障状况的一组数据。 每个故障模型至少包括故障签名，故障边界和一组主成分分析（PCA）参数。
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公开(公告)号：US08144328B2
公开(公告)日：2012-03-27
申请号：US12418492
申请日：2009-04-03
IPC分类号： G01N21/00
CPC分类号： G01N21/274 , G01J3/02 , G01J3/0205 , G01J3/0218 , G01J3/0294 , G01J3/443 , G01N21/68
摘要： An arrangement for in-situ optical interrogation of plasma emission to quantitatively measure normalized optical emission spectra in a plasma chamber is provided. The arrangement includes a flash lamp and a set of quartz windows. The arrangement also includes a plurality of collimated optical assemblies, which is optically coupled to the set of quartz windows. The arrangement further includes a plurality of fiber optic bundles, which comprises at least an illumination fiber optic bundle, a collection fiber optic bundle, and a reference fiber optic bundle. The arrangement more over includes a multi-channel spectrometer, which is configured with at least a signal channel and a reference channel. The signal channel is optically coupled to at least the flash lamp, the set of quartz windows, the set of collimated optical assemblies, the illuminated fiber optic bundle, and the collection fiber optic bundle to measure a first signal.
摘要翻译： 提供了用于等离子体发射的原位光询问以定量测量等离子体室中的归一化光发射光谱的布置。 该装置包括闪光灯和一组石英窗。 该布置还包括多个准直的光学组件，其光耦合到该组石英窗口。 该布置还包括多个光纤束，其包括至少照明光纤束，收集光纤束和参考光纤束。 更多的布置包括多通道光谱仪，其被配置有至少一个信号通道和参考通道。 信号通道光学耦合到至少闪光灯，该组石英窗，该组准直光学组件，照明光纤束和收集光纤束以测量第一信号。
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