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1.发明申请公开(公告)号：US20160086723A1
公开(公告)日：2016-03-24
申请号：US14956948
申请日：2015-12-02
Applicant: Virginia Tech Intellectual Properties, Inc.
Inventor： Yipeng Su , Dongbin Hou , Fred C. Lee , Qiang Li
CPC classification number: H01F1/14 , H01F3/14 , H01F17/0033 , H01F2017/002 , H02M3/155 , H05K1/0233 , H05K1/0373 , H05K1/165 , H05K2201/0209 , H05K2201/0245 , H05K2201/086 , H05K2201/10015
Abstract: A low profile inductor structure suitable for use in a high power density power converter has one or more windings formed by vias through a thin, generally planar body of magnetic material forming the inductor core and conductive cladding on the body of magnetic material or material covering the magnetic material body. Variation of inductance with load current and other operational or environmental parameters is reduced to any desired degree by forming a slot that removes all or a portion of the magnetic material between the locations of the vias.
Abstract translation: 适用于高功率密度功率转换器的低调电感器结构具有一个或多个绕组，其通过通过薄的大体平面的磁性材料体形成的通孔形成电感器芯和磁性材料或材料的主体上的导电包层， 磁性材料体。 具有负载电流和其他操作或环境参数的电感的变化通过形成在该通孔的位置之间去除磁性材料的全部或一部分的槽而减少到任何所需的程度。
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公开(公告)号：US10109404B2
公开(公告)日：2018-10-23
申请号：US14956948
申请日：2015-12-02
Applicant: Virginia Tech Intellectual Properties, Inc.
Inventor： Yipeng Su , Dongbin Hou , Fred C. Lee , Qiang Li
IPC: H01F5/00 , H01F27/28 , H01F1/14 , H01F17/00 , H05K1/03 , H01F3/14 , H02M3/155 , H05K1/02 , H05K1/16
Abstract: A low profile inductor structure suitable for use in a high power density power converter has one or more windings formed by vias through a thin, generally planar body of magnetic material forming the inductor core and conductive cladding on the body of magnetic material or material covering the magnetic material body. Variation of inductance with load current and other operational or environmental parameters is reduced to any desired degree by forming a slot that removes all or a portion of the magnetic material between the locations of the vias.
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3.发明申请High Frequency Integrated Point-of-Load Power Converter with Embedded Inductor Substrate 有权具有嵌入式电感基板的高频集成点负载电源转换器公开(公告)号：US20150062989A1
公开(公告)日：2015-03-05
申请号：US14177531
申请日：2014-02-11
Applicant: Virginia Tech Intellectual Properties, Inc.
Inventor： Yipeng Su , Qiang Li , Fred C. Lee , Wenli Zhang
IPC: H05K7/02
CPC classification number: H01F17/0033 , H01F2017/008 , H02M3/155 , H05K1/0233 , H05K1/0373 , H05K1/165 , H05K2201/0209 , H05K2201/0245 , H05K2201/086 , H05K2201/10015
Abstract: A low profile power converter structure is provide wherein volume is reduced and power density is increased to approach 1 KW/in3 by at least one of forming an inductor as a body of magnetic material embedded in a substrate formed by a plurality of printed circuit board (PCB) lamina and forming inductor windings of PCB cladding and vias which may be of any desired number of turns and may include inversely coupled windings and which provide a lateral flux path, forming the body of magnetic material from high aspect ratio flakes of magnetic material which are aligned with the inductor magnetic field in an insulating organic binder and hot-pressed and providing a four-layer architecture comprising two layers of PCB lamina including the embedded body of magnetic material, a shield layer and an additional layer of PCB lamina, including cladding for supporting and connecting a switching circuit, a capacitor and the inductor.
Abstract translation: 通过形成作为嵌入由多个印刷电路板形成的基板中的磁性材料的主体的电感器中的至少一个，提供体积减小并且功率密度增加到接近1KW / in 3的低剖面功率转换器结构（ PCB）层并且形成可以具有任何所需匝数的PCB包层和通孔的电感器绕组，并且可以包括反耦合绕组并且提供横向磁通路径，从磁性材料的高纵横比薄片形成磁性材料体 与绝缘有机粘合剂中的电感器磁场对准并热压，并提供包括两层PCB层的四层结构，包括磁性材料的嵌入体，屏蔽层和附加的PCB层的层，包括包层 用于支持和连接开关电路，电容器和电感器。
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4.发明授权High frequency integrated point-of-load power converter with embedded inductor substrate 有权具有嵌入式电感基板的高频集成式负载点功率转换器公开(公告)号：US09564264B2
公开(公告)日：2017-02-07
申请号：US14177531
申请日：2014-02-11
Applicant: Virginia Tech Intellectual Properties, Inc.
Inventor： Yipeng Su , Qiang Li , Fred C. Lee , Wenli Zhang
CPC classification number: H01F17/0033 , H01F2017/008 , H02M3/155 , H05K1/0233 , H05K1/0373 , H05K1/165 , H05K2201/0209 , H05K2201/0245 , H05K2201/086 , H05K2201/10015
Abstract: A low profile power converter structure is provide wherein volume is reduced and power density is increased to approach 1 KW/in3 by at least one of forming an inductor as a body of magnetic material embedded in a substrate formed by a plurality of printed circuit board (PCB) lamina and forming inductor windings of PCB cladding and vias which may be of any desired number of turns and may include inversely coupled windings and which provide a lateral flux path, forming the body of magnetic material from high aspect ratio flakes of magnetic material which are aligned with the inductor magnetic field in an insulating organic binder and hot-pressed and providing a four-layer architecture comprising two layers of PCB lamina including the embedded body of magnetic material, a shield layer and an additional layer of PCB lamina, including cladding for supporting and connecting a switching circuit, a capacitor and the inductor.
Abstract translation: 通过形成作为嵌入由多个印刷电路板形成的基板中的磁性材料的主体的电感器中的至少一个，提供体积减小并且功率密度增加到接近1KW / in 3的低剖面功率转换器结构（ PCB）层并且形成可以具有任何所需匝数的PCB包层和通孔的电感器绕组，并且可以包括反耦合绕组并且提供横向磁通路径，从磁性材料的高纵横比薄片形成磁性材料体 与绝缘有机粘合剂中的电感器磁场对准并热压，并提供包括两层PCB层的四层结构，包括磁性材料的嵌入体，屏蔽层和附加的PCB层的层，包括包层 用于支持和连接开关电路，电容器和电感器。
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