公开(公告)号：US08183077B2

公开(公告)日：2012-05-22

申请号：US12873184

申请日：2010-08-31

Applicant: Vladimir Vaganov ,  Nickolai Belov

Inventor： Vladimir Vaganov ,  Nickolai Belov

IPC: G01R27/26

CPC classification number: G01L5/162 ,  G01L1/18 ,  G01L1/2231

Abstract: Methods of fabricating 3-dimensional force input control devices are disclosed. These roughly comprise: providing a first substrate, fabricating stress-sensitive IC components and signal processing IC on a side one of the first substrate, fabricating one or more closed trenches on a side two of the first substrate within each die area, creating elastic element, frame area and rigid island, providing a second substrate, patterning a side two of the second substrate to define areas for deep etching, creating a layer of bonding material in local areas on at least one of the surfaces of the side one of the second substrate and the side two of the first substrate, aligning and bonding the side two of the first substrate with the side one of the second substrate, etching the second substrate from the side two through to the first substrate, dicing the two bonded substrates into multiple separate dice.

Abstract translation: 公开了制造三维力输入控制装置的方法。 这些大致包括：提供第一衬底，在第一衬底的一侧上制造应力敏感IC部件和信号处理IC，在每个管芯区域内在第一衬底的侧面二上制造一个或多个闭合沟槽，从而产生弹性元件 框架区域和刚性岛，提供第二基板，图案化第二基板的侧面两侧以限定用于深刻蚀刻的区域，在第二基板的侧面的至少一个表面上的局部区域中形成结合材料层 衬底和第一衬底的侧面两侧，将第一衬底的侧面与第二衬底的侧面对准并粘合，将第二衬底从侧面二穿过至第一衬底，将两个键合衬底切割成多个 单独的骰子。

公开(公告)号：US07367232B2

公开(公告)日：2008-05-06

申请号：US11042721

申请日：2005-01-24

Applicant: Vladimir Vaganov ,  Nickolai Belov

Inventor： Vladimir Vaganov ,  Nickolai Belov

IPC: G01P15/12

CPC classification number: G01P15/18 ,  G01P15/123 ,  G01P2015/084 ,  G01P2015/0842

Abstract: A system and method for inputting motion measurement data into a computationally based device are provided. In a first version three-axis accelerometer determines components of an inertial force vector with respect to an orthogonal coordinate system. The accelerometer includes a sensor die made of a semiconductor substrate having a frame element, a proof mass element, and an elastic element mechanically coupling the frame and the proof mass. The accelerometer also has three or more stress-sensitive IC components integrated into the elastic element adjacent to the frame element for electrical connectivity without metal conductor traversal of the elastic element.

Abstract translation: 提供了一种用于将运动测量数据输入到基于计算的设备中的系统和方法。 在第一版本中，三轴加速度计确定相对于正交坐标系的惯性力矢量的分量。 加速度计包括由半导体衬底制成的传感器芯片，该半导体衬底具有框架元件，校验质量元件和机械地联接框架和校验块的弹性元件。 加速度计还具有集成到与框架元件相邻的弹性元件中的三个或更多个应力敏感的IC部件，用于电连接而不需要金属导体穿过弹性元件。

公开(公告)号：US07659182B2

公开(公告)日：2010-02-09

申请号：US11804863

申请日：2007-05-21

Applicant: Vladimir Vaganov ,  Nickolai Belov

Inventor： Vladimir Vaganov ,  Nickolai Belov

IPC: H01L21/00

CPC classification number: H01L21/4803 ,  B30B15/061 ,  B81C1/0038 ,  B81C2201/019 ,  B81C2203/038 ,  H01L21/2007 ,  H01L21/4857 ,  H01L2224/75305 ,  H01L2224/75314 ,  H01L2224/7598 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/00

Abstract: Methods of wafer-to-wafer bonding are disclosed. These methods use a force-transposing substrate providing redistribution of the applied force to the local bonding areas across the wafer. Certain versions of the Present Invention also provide a compliant force-distributing member along with applying bonding material to bonding areas in select locations. A predetermined sequence of external force loading and temperature steps ensure creating bonds between the wafers in the bonding areas. The disclosed methods improve wafer bonding, by increasing its uniformity and strength across the wafer, increasing both reproducibility and yield process and decreasing cost of semiconductor and MEMS devices.

Abstract translation: 公开了晶片到晶片结合的方法。 这些方法使用强力转置衬底，其提供所施加的力再次分布到晶片上的局部结合区域。 本发明的某些形式还提供顺应力分配构件以及将粘合材料施加到选择位置中的结合区域。 外力加载和温度步骤的预定顺序确保在粘合区域中的晶片之间产生粘合。 所公开的方法通过增加其在晶片上的均匀性和强度来提高晶片接合，提高了再现性和屈服过程，降低了半导体和MEMS器件的成本。

公开(公告)号：US20080070376A1

公开(公告)日：2008-03-20

申请号：US11804863

申请日：2007-05-21

Applicant: Vladimir Vaganov ,  Nickolai Belov

Inventor： Vladimir Vaganov ,  Nickolai Belov

IPC: H01L21/30

CPC classification number: H01L21/4803 ,  B30B15/061 ,  B81C1/0038 ,  B81C2201/019 ,  B81C2203/038 ,  H01L21/2007 ,  H01L21/4857 ,  H01L2224/75305 ,  H01L2224/75314 ,  H01L2224/7598 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/00

Abstract: Methods of wafer-to-wafer bonding are disclosed. These methods use a force-transposing substrate providing redistribution of the applied force to the local bonding areas across the wafer. Certain versions of the Present Invention also provide a compliant force-distributing member along with applying bonding material to bonding areas in selectable locations. A predetermined sequence of external force loading and temperature steps ensure creating bonds between the wafers in the bonding areas. The disclosed methods improve wafer bonding, by increasing its uniformity and strength across the wafer, increase both reproducibility and yield process and decrease cost of semiconductor and MEMS devices.

Abstract translation: 公开了晶片到晶片结合的方法。 这些方法使用强力转置衬底，其提供所施加的力再次分布到晶片上的局部结合区域。 本发明的某些形式还提供顺应力分配构件以及将可能位置的结合区域施加粘合材料。 外力加载和温度步骤的预定顺序确保在粘合区域中的晶片之间产生粘合。 所公开的方法通过增加其在晶片上的均匀性和强度来改善晶片结合，增加了再现性和屈服过程，并降低了半导体和MEMS器件的成本。

公开(公告)号：US09034666B2

公开(公告)日：2015-05-19

申请号：US13290764

申请日：2011-11-07

Applicant: Vladimir Vaganov ,  Nickolai Belov

Inventor： Vladimir Vaganov ,  Nickolai Belov

IPC: G01R31/26 ,  G06F3/0338 ,  G01L5/16 ,  G01L5/22 ,  B81C99/00

CPC classification number: G06F3/0338 ,  B81C99/0045 ,  G01L5/162 ,  G01L5/223

Abstract: Some embodiments provide methods, process, systems and apparatus for use in testing multi-axis Micro Electro Mechanical Systems (MEMS) devices. In some embodiments, methods of testing are provided, comprising: selecting, according to a test specification and a test program, at least a first MEMS device on a substrate comprising a plurality of MEMS formed relative to the substrate and applying one or more electrical probes to the first MEMS device; providing power to the first MEMS device through the one or more electrical probes; measuring output signals of the first MEMS device; applying a force to the first MEMS device using a force actuator; measuring a set of output signals of the first MEMS device based on the applied force; and processing test data and generating output test results according to the test specification and test program.

Abstract translation: 一些实施例提供用于测试多轴微机电系统（MEMS）装置的方法，过程，系统和装置。 在一些实施例中，提供了测试方法，包括：根据测试规范和测试程序，选择至少第一MEMS器件，其包括相对于衬底形成的多个MEMS，并且施加一个或多个电探针 到第一个MEMS器件; 通过所述一个或多个电探针向所述第一MEMS器件供电; 测量所述第一MEMS器件的输出信号; 使用力致动器向第一MEMS装置施加力; 基于所施加的力测量所述第一MEMS装置的一组输出信号; 并根据测试规范和测试程序处理测试数据并生成输出测试结果。

公开(公告)号：US07880247B2

公开(公告)日：2011-02-01

申请号：US12342001

申请日：2008-12-22

Applicant: Vladimir Vaganov ,  Nickolai Belov

Inventor： Vladimir Vaganov ,  Nickolai Belov

IPC: H01L23/04 ,  H01L23/48 ,  H01L23/52 ,  H01L23/28

CPC classification number: G06F3/0338

Abstract: A force input control device suitable for high-volume applications such as cell phones, portable gaming devices and other handheld electronic devices along with other applications like medical equipment, robotics, security systems and wireless sensor networks is disclosed. The device can be one-axis or two-axis or three-axis sensitive broadening the range of applications. The device comprises a force sensor die formed within semiconductor substrate and containing a force sensor providing electrical output signal in response to applied external force, and electrical connection elements for mounting and/or wire bonding. Signal conditioning and processing integrated circuit can be integrated within some devices. A package enclosing at least a portion of the force sensor die and comprising a force-transferring element cooperated with the sensor die for transferring an external force to the force sensor die.

Abstract translation: 公开了适用于诸如蜂窝电话，便携式游戏设备和其它手持电子设备等大容量应用的力输入控制装置以及医疗设备，机器人，安全系统和无线传感器网络等其他应用。 该器件可以是单轴或双轴或三轴灵敏扩大应用范围。 该装置包括在半导体衬底内形成的力传感器芯片，并且包含响应于所施加的外力提供电输出信号的力传感器和用于安装和/或引线接合的电连接元件。 信号调理和处理集成电路可以集成在一些设备内。 封装至少一部分力传感器模具的包装，包括与传感器模具配合的力传递元件，用于将外力传递给力传感器模具。

公开(公告)号：US07318349B2

公开(公告)日：2008-01-15

申请号：US11160004

申请日：2005-06-04

Applicant: Vladimir Vaganov ,  Nickolai Belov

Inventor： Vladimir Vaganov ,  Nickolai Belov

IPC: G01P15/08

CPC classification number: G01P15/18 ,  G01P15/123 ,  G01P2015/084

Abstract: 3D accelerometer for measuring three components of inertial force (or acceleration) vector with respect to an orthogonal coordinate system, which has high sensitivity due to a big proof mass located within a cavity beneath the surface of the sensor die. The size of the cavity and the size of the proof mass exceed the corresponding overall dimensions of the elastic element. The sensor structure occupies a very small area at the surface of the die increasing the area for ICs need to be integrated on the same chip.

Abstract translation: 用于测量相对于正交坐标系的惯性力（或加速度）矢量的三个分量的3D加速度计，其由于位于传感器模具表面下方的空腔内的大的检测质量而具有高灵敏度。 空腔的尺寸和检测质量的大小超过弹性元件的相应的整体尺寸。 传感器结构在芯片表面占据非常小的面积，增加了需要集成在同一芯片上的IC的面积。

公开(公告)号：US20050160814A1

公开(公告)日：2005-07-28

申请号：US11042721

申请日：2005-01-24

Applicant: Vladimir Vaganov ,  Nickolai Belov

Inventor： Vladimir Vaganov ,  Nickolai Belov

IPC: G01P15/08 ,  G01P15/12 ,  G01P15/18

CPC classification number: G01P15/18 ,  G01P15/123 ,  G01P2015/084 ,  G01P2015/0842

Abstract: A system and method for inputting motion measurement data into a computationally based device are provided. In a first version three-axis accelerometer determines components of an inertial force vector with respect to an orthogonal coordinate system. The accelerometer includes a sensor die made of a semiconductor substrate having a frame element, a proof mass element, and an elastic element mechanically coupling the frame and the proof mass. The accelerometer also has three or more stress-sensitive IC components integrated into the elastic element adjacent to the frame element for electrical connectivity without metal conductor traversal of the elastic element.

Abstract translation: 提供了一种将运动测量数据输入到基于计算的设备中的系统和方法。 在第一版本中，三轴加速度计确定相对于正交坐标系的惯性力矢量的分量。 加速度计包括由半导体衬底制成的传感器芯片，该半导体衬底具有框架元件，校验质量元件和机械地联接框架和校验块的弹性元件。 加速度计还具有集成到与框架元件相邻的弹性元件中的三个或更多个应力敏感的IC部件，用于电连接而不需要金属导体穿过弹性元件。

公开(公告)号：US20120194207A1

公开(公告)日：2012-08-02

申请号：US13290764

申请日：2011-11-07

Applicant: Vladimir Vaganov ,  Nickolai Belov

Inventor： Vladimir Vaganov ,  Nickolai Belov

IPC: G01R31/00

CPC classification number: G06F3/0338 ,  B81C99/0045 ,  G01L5/162 ,  G01L5/223

Abstract: Some embodiments provide methods, process, systems and apparatus for use in testing multi-axis Micro Electro Mechanical Systems (MEMS) devices. In some embodiments, methods of testing are provided, comprising: selecting, according to a test specification and a test program, at least a first MEMS device on a substrate comprising a plurality of MEMS formed relative to the substrate and applying one or more electrical probes to the first MEMS device; providing power to the first MEMS device through the one or more electrical probes; measuring output signals of the first MEMS device; applying a force to the first MEMS device using a force actuator; measuring a set of output signals of the first MEMS device based on the applied force; and processing test data and generating output test results according to the test specification and test program.

Abstract translation: 一些实施例提供用于测试多轴微机电系统（MEMS）装置的方法，过程，系统和装置。 在一些实施例中，提供了测试方法，包括：根据测试规范和测试程序，选择至少第一MEMS器件，其包括相对于衬底形成的多个MEMS，并且施加一个或多个电探针 到第一个MEMS器件; 通过所述一个或多个电探针向所述第一MEMS器件供电; 测量所述第一MEMS器件的输出信号; 使用力致动器向第一MEMS装置施加力; 基于所施加的力测量所述第一MEMS装置的一组输出信号; 并根据测试规范和测试程序处理测试数据并生成输出测试结果。

公开(公告)号：US07791151B2

公开(公告)日：2010-09-07

申请号：US11803788

申请日：2007-05-15

Applicant: Vladimir Vaganov ,  Nickolai Belov

Inventor： Vladimir Vaganov ,  Nickolai Belov

IPC: G01R27/26

CPC classification number: G01L5/162 ,  G01L1/18 ,  G01L1/2231

Abstract: Method of fabricating 3-dimensional force input control device are disclosed. These roughly follow a process of providing a first substrate having side one and side two, fabricating stress-sensitive IC components and signal processing IC on the side one of the first substrate, fabricating closed trenches on the side two of the first substrate within each die area, said closed trenches create elastic element, frame area and at least one rigid island separated from the frame areas, providing a second substrate having side one and side two, patterning side two of the second substrate to define areas for deep etching, creating a layer of bonding material in the local areas on at least one of the surfaces of the side one of the second substrate and the side two of the first substrate, aligning and bonding the side two of the first substrate with the side one of the second substrate, etching the second substrate from the side two through to the first substrate, dicing two bonded substrates onto multiple separate dice, resulting in processed, aligned, bonded and diced batch fabricated low cost 3D force input control devices.

Abstract translation: 公开了制造三维力输入控制装置的方法。 这些大致遵循提供具有侧面1和侧面2的第一基板的过程，在第一基板的侧面上制造应力敏感IC部件和信号处理IC，在每个管芯内在第一基板的侧面二上制造闭合沟槽 所述封闭沟槽产生弹性元件，框架区域和与框架区域分离的至少一个刚性岛，提供具有侧面和侧面两个的第二基底，图案化第二基底的侧面以限定用于深刻蚀的区域， 在第二基板的一侧的第一表面和第一基板的侧面的至少一个表面上的局部区域中的接合材料层，将第一基板的侧面与第二基板的侧面对准和接合 ，从第二侧到第一衬底的第二衬底蚀刻，将两个键合的衬底切割成多个分开的裸片，得到加工的，对准的，结合的和切割的 批量制造低成本3D力输入控制装置。