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公开(公告)号:US20250093412A1
公开(公告)日:2025-03-20
申请号:US18966905
申请日:2024-12-03
Applicant: VueReal Inc.
Inventor: Gholamreza CHAJI , Chang Ho PARK
Abstract: What is disclosed are methods and structures of an improved probe card assembly to inspect micro devices.
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公开(公告)号:US20240120173A1
公开(公告)日:2024-04-11
申请号:US18263406
申请日:2022-01-28
Applicant: VueReal Inc.
Inventor: Gholamreza CHAJI , Ehsanollah FATHI , Chang Ho PARK
IPC: H01J37/252 , H01J37/063 , H01J37/09 , H01J37/24
CPC classification number: H01J37/252 , H01J37/063 , H01J37/09 , H01J37/243
Abstract: The present disclosure relates to integrating microdevices into a system substrate. In particular it relates to measuring microdevices using an electron beam method using one or several tips as Ebeam sources. The disclosure further outlines methods to target Ebeams effectively to produce an optimum result with minimal damage to adjacent microdevices and components.
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公开(公告)号:US20220003815A1
公开(公告)日:2022-01-06
申请号:US17432575
申请日:2020-02-20
Applicant: VueReal Inc.
Inventor: Gholamreza CHAJI , Chang Ho PARK
Abstract: What is disclosed are methods and structures of an improved probe card assembly to inspect micro devices.
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