公开(公告)号：US20250167053A1

公开(公告)日：2025-05-22

申请号：US19027284

申请日：2025-01-17

Applicant: VueReal Inc.

Inventor： Gholamreza CHAJI

IPC: H01L21/66 ,  H01L25/075

Abstract: A method of aligning a first substrate and a second substrate comprises positioning the first substrate having at least a first alignment mark in close proximity to the second substrate having at least a second alignment mark, measuring an alignment value between the first and second alignment marks of both the first and second substrate; and adjusting the position of the first substrate and the second substrate based on the measured alignment value.

公开(公告)号：US20250167033A1

公开(公告)日：2025-05-22

申请号：US19027997

申请日：2025-01-17

Applicant: VueReal Inc.

Inventor： Gholamreza CHAJI

IPC: H01L21/683 ,  H01L21/67 ,  H01L23/544

Abstract: This invention relates to the process of correcting misalignment and filling voids after a microdevice transfer process. The process involves transfer heads, measurement of offset and misalignment in horizontal, vertical, and rotational errors. An execution of the new offset vector for the next transfer corrects the alignment.

公开(公告)号：US20250160088A1

公开(公告)日：2025-05-15

申请号：US18839300

申请日：2023-12-12

Applicant: VueReal Inc.

Inventor： Gholamreza CHAJI ,  Ehsanollah FATHI ,  Danish BAIG

IPC: H10H29/03 ,  H01L21/683 ,  H01L25/075 ,  H10H29/24

Abstract: The present disclosure relates to development of microdevices on a substrate that can be released and transferred to a system substrate. The disclosure further relates to methods to integrate anchors to hold a microdevice to a substrate. The microdevices are in different configurations with respect to anchors, release layers, buffers layers and substrate.

公开(公告)号：US20250093412A1

公开(公告)日：2025-03-20

申请号：US18966905

申请日：2024-12-03

Applicant: VueReal Inc.

Inventor： Gholamreza CHAJI ,  Chang Ho PARK

IPC: G01R31/28 ,  G01R1/067 ,  G01R1/073

Abstract: What is disclosed are methods and structures of an improved probe card assembly to inspect micro devices.

公开(公告)号：US20250060927A1

公开(公告)日：2025-02-20

申请号：US18723403

申请日：2022-12-23

Applicant: VueReal Inc.

Inventor： Gholamreza CHAJI

IPC: G06F3/14 ,  H10K59/18

Abstract: The present disclosure relates to tiling which is one approach to develop large area electronic systems such as displays and sensors. In particular, the invention discloses connecting an array of tiles, an array of pixels and distributing signals between pixels in row and column. In addition, the invention discloses alignment of tiles, differentiability of tiles, sharing pixel circuits between subpixels with different microdevices, and EM signals controlling switches and alignment on opposite surfaces.

公开(公告)号：US20240395778A1

公开(公告)日：2024-11-28

申请号：US18796567

申请日：2024-08-07

Applicant: VueReal Inc.

Inventor： Gholamreza CHAJI ,  Mae GAO ,  Ehsanollah FATHI ,  Pranav GAVIMENI

IPC: H01L25/075 ,  H01L33/62

Abstract: Structures and methods are disclosed for fabricating optoelectronic solid state array devices. In one case a backplane and array of micro devices is aligned and connected through bumps.

公开(公告)号：US20240292724A1

公开(公告)日：2024-08-29

申请号：US18568577

申请日：2022-06-10

Applicant: VueReal Inc.

Inventor： Gholamreza CHAJI

IPC: H10K59/90 ,  G02B6/42 ,  H10K59/38 ,  H10K59/65 ,  H10K59/70 ,  H10K59/80 ,  H10K102/00

CPC classification number: H10K59/90 ,  G02B6/4214 ,  H10K59/38 ,  H10K59/65 ,  H10K59/70 ,  H10K59/878 ,  H10K2102/331

Abstract: Structures and methods are disclosed for fabricating a color optoelectronic solid state array device. In one embodiment, different color devices and optical structures are combined to form a color optoelectronic solid state array. The optical structure comprise of light distribution layer, light extraction layer, waveguide, reflective layers, linear color combinator. In another embodiment, a method to combine light colors in a color microdevice array is disclosed.

公开(公告)号：US20240138249A1

公开(公告)日：2024-04-25

申请号：US18544961

申请日：2023-12-19

Applicant: VueReal Inc.

Inventor： Gholamreza CHAJI

IPC: H10K71/80 ,  H10K50/805 ,  H10K50/844 ,  H10K50/88 ,  H10K59/90

CPC classification number: H10K71/80 ,  H10K50/805 ,  H10K50/844 ,  H10K50/88 ,  H10K59/90 ,  H10K50/10

Abstract: This invention discloses methods to form a micro thin film device. The methods use release layer on a substrate, encapsulation layers, electrode formation, and forming a bank layer. The methods further use VIA's to provide access to pads. The methods also entail transfer of multiple micro thin film devices by forming micro thin film devices on a cartridge, forming a housing, using anchors, and covering a side wall of the housing with a release layer.

公开(公告)号：US20240120173A1

公开(公告)日：2024-04-11

申请号：US18263406

申请日：2022-01-28

Applicant: VueReal Inc.

Inventor： Gholamreza CHAJI ,  Ehsanollah FATHI ,  Chang Ho PARK

IPC: H01J37/252 ,  H01J37/063 ,  H01J37/09 ,  H01J37/24

CPC classification number: H01J37/252 ,  H01J37/063 ,  H01J37/09 ,  H01J37/243

Abstract: The present disclosure relates to integrating microdevices into a system substrate. In particular it relates to measuring microdevices using an electron beam method using one or several tips as Ebeam sources. The disclosure further outlines methods to target Ebeams effectively to produce an optimum result with minimal damage to adjacent microdevices and components.

公开(公告)号：US20230230869A1

公开(公告)日：2023-07-20

申请号：US18007103

申请日：2021-07-27

Applicant: VueReal Inc.

Inventor： Gholamreza CHAJI ,  Lauren LESERGENT

IPC: H01L21/683 ,  B81C1/00

CPC classification number: H01L21/6835 ,  B81C1/00476 ,  H01L2221/68318 ,  H01L2221/68381

Abstract: This disclosure is related to integrating pixelated microdevices into a system substrate to develop a functional system such as display, sensors, and other optoelectronic devices. The process may involve having a structure of release layers in the housing and then using different decoupling mechanisms for release. The release layers are not limited to but can be a combination of chemical or optical or mechanical release layers.