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公开(公告)号：US20250167195A1
公开(公告)日：2025-05-22
申请号：US19029080
申请日：2025-01-17
Applicant: VueReal Inc.
Inventor： Gholamreza CHAJI , Ehsanollah FATHI
Abstract: What is disclosed are structures and methods for repairing emissive display systems. Various repairing techniques embodiments in accordance with the structures and methods are provided to conquer and mitigate the defected pixels and to increase the yield and reduce the cost of emissive displays systems.
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公开(公告)号：US20240169899A1
公开(公告)日：2024-05-23
申请号：US18430857
申请日：2024-02-02
Applicant: VueReal Inc.
Inventor： Gholamreza CHAJI , Ehsanollah FATHI
IPC: G09G3/32
CPC classification number: G09G3/32 , G09G2320/0233 , G09G2320/045 , G09G2320/0673 , G09G2360/16
Abstract: This disclosure is related to compensation of micro devices based on cartridge information.
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公开(公告)号：US20220416116A1
公开(公告)日：2022-12-29
申请号：US17785964
申请日：2020-12-18
Applicant: VueReal Inc.
Inventor： Gholamreza CHAJI , Ehsanollah FATHI
IPC: H01L33/00
Abstract: The present disclosure deals with a method of integrating microdevices on a backplane using bonded pads. The process has a substrate having microdevices with bonding of selective microdevices through connecting pads on the microdevices and corresponding pads on the backplane, forming anchors and leaving the bonded selective set of microdevices on the backplane by separating the micro device substrate.
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公开(公告)号：US20220271191A1
公开(公告)日：2022-08-25
申请号：US17616450
申请日：2020-06-05
Applicant: VueReal Inc.
Inventor： Gholamreza CHAJI , Lauren LESERGENT , Ehsanollah FATHI , Aaron Daniel Trent WIERSMA
Abstract: Devices and methods for patterning the vertical solid state devices are provided. In some examples, a method of fabricating micro devices comprising forming device layers on a substrate, forming a first masking layer on a top layer of the device layers, forming a second masking layer on the first masking layer; and etching the device layers using the first and second masking layers to pattern the device layers.
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公开(公告)号：US20250160088A1
公开(公告)日：2025-05-15
申请号：US18839300
申请日：2023-12-12
Applicant: VueReal Inc.
Inventor： Gholamreza CHAJI , Ehsanollah FATHI , Danish BAIG
IPC: H10H29/03 , H01L21/683 , H01L25/075 , H10H29/24
Abstract: The present disclosure relates to development of microdevices on a substrate that can be released and transferred to a system substrate. The disclosure further relates to methods to integrate anchors to hold a microdevice to a substrate. The microdevices are in different configurations with respect to anchors, release layers, buffers layers and substrate.
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Patent Agency Ranking
公开(公告)号：US20240395778A1
公开(公告)日：2024-11-28
申请号：US18796567
申请日：2024-08-07
Applicant: VueReal Inc.
Inventor： Gholamreza CHAJI , Mae GAO , Ehsanollah FATHI , Pranav GAVIMENI
IPC: H01L25/075 , H01L33/62
Abstract: Structures and methods are disclosed for fabricating optoelectronic solid state array devices. In one case a backplane and array of micro devices is aligned and connected through bumps.
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公开(公告)号：US20240120173A1
公开(公告)日：2024-04-11
申请号：US18263406
申请日：2022-01-28
Applicant: VueReal Inc.
Inventor： Gholamreza CHAJI , Ehsanollah FATHI , Chang Ho PARK
IPC: H01J37/252 , H01J37/063 , H01J37/09 , H01J37/24
CPC classification number: H01J37/252 , H01J37/063 , H01J37/09 , H01J37/243
Abstract: The present disclosure relates to integrating microdevices into a system substrate. In particular it relates to measuring microdevices using an electron beam method using one or several tips as Ebeam sources. The disclosure further outlines methods to target Ebeams effectively to produce an optimum result with minimal damage to adjacent microdevices and components.
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公开(公告)号：US20220208738A1
公开(公告)日：2022-06-30
申请号：US17432585
申请日：2020-02-21
Applicant: VueReal Inc.
Inventor： Gholamreza CHAJI , Mae GAO , Ehsanollah FATHI , Pranav GAVIMENI
IPC: H01L25/075 , H01L33/62 , H01L33/00 , H01L33/46
Abstract: Structures and methods are disclosed for fabricating optoelectronic solid state array devices. In one case a backplane and array of micro devices is aligned and connected through bumps.
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公开(公告)号：US20220157231A1
公开(公告)日：2022-05-19
申请号：US17600905
申请日：2020-04-03
Applicant: VueReal Inc.
Inventor： Gholamreza CHAJI , Ehsanollah FATHI
IPC: G09G3/32
Abstract: This disclosure is related to compensation of micro devices based on cartridge information.
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公开(公告)号：US20220005774A1
公开(公告)日：2022-01-06
申请号：US17293441
申请日：2019-11-18
Applicant: VueReal Inc.
Inventor： Gholamreza Chaji , Ehsanollah FATHI
Abstract: What is disclosed is structures and methods of integrating micro devices into system substrate. Further, the disclosure, also relates to methods and structures for enhancing the bonding process of micro-devices into a substrate. More specifically, it relates to expanding the micro device area or bonding area of micro devices.
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