公开(公告)号：US07709776B2

公开(公告)日：2010-05-04

申请号：US12390195

申请日：2009-02-20

申请人： Warren M. Farnworth ,  Sidney B. Rigg ,  William Mark Hiatt ,  Alan G. Wood ,  Peter A. Benson ,  James M. Wark ,  David R. Hembree ,  Kyle K. Kirby ,  Charles M. Watkins ,  Salman Akram

发明人： Warren M. Farnworth ,  Sidney B. Rigg ,  William Mark Hiatt ,  Alan G. Wood ,  Peter A. Benson ,  James M. Wark ,  David R. Hembree ,  Kyle K. Kirby ,  Charles M. Watkins ,  Salman Akram

IPC分类号： H01L27/00 ,  H01L31/0232

CPC分类号： H01L27/00 ,  B33Y80/00 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/00014

摘要： Microelectronic imager assemblies comprising a workpiece including a substrate and a plurality of imaging dies on and/or in the substrate. The substrate includes a front side and a back side, and the imaging dies comprise imaging sensors at the front side of the substrate and external contacts operatively coupled to the image sensors. The microelectronic imager assembly further comprises optics supports superimposed relative to the imaging dies. The optics supports can be directly on the substrate or on a cover over the substrate. Individual optics supports can have (a) an opening aligned with one of the image sensors, and (b) a bearing element at a reference distance from the image sensor. The microelectronic imager assembly can further include optical devices mounted or otherwise carried by the optics supports.

摘要翻译： 微电子成像器组件包括包括衬底的工件和在衬底上和/或衬底中的多个成像管芯。 基板包括前侧和后侧，并且成像管芯包括在基板的前侧的成像传感器和可操作地耦合到图像传感器的外部触点。 微电子成像器组件还包括相对于成像管芯叠加的光学支架。 光学支撑件可以直接在基板上或衬底上的盖上。 单个光学支撑件可以具有（a）与图像传感器中的一个对准的开口，以及（b）与图像传感器相距一定距离处的轴承元件。 微电子成像器组件还可以包括由光学器件支撑件安装或以其它方式承载的光学器件。

公开(公告)号：US20090155949A1

公开(公告)日：2009-06-18

申请号：US12390195

申请日：2009-02-20

申请人： Warren M. Farnworth ,  Sidney B. Rigg ,  William Mark Hiatt ,  Alan G. Wood ,  Peter A. Benson ,  James M. Wark ,  David R. Hembree ,  Kyle K. Kirby ,  Charles M. Watkins ,  Salman Akram

发明人： Warren M. Farnworth ,  Sidney B. Rigg ,  William Mark Hiatt ,  Alan G. Wood ,  Peter A. Benson ,  James M. Wark ,  David R. Hembree ,  Kyle K. Kirby ,  Charles M. Watkins ,  Salman Akram

IPC分类号： H01L31/0232

CPC分类号： H01L27/00 ,  B33Y80/00 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/00014

摘要： Microelectronic imager assemblies comprising a workpiece including a substrate and a plurality of imaging dies on and/or in the substrate. The substrate includes a front side and a back side, and the imaging dies comprise imaging sensors at the front side of the substrate and external contacts operatively coupled to the image sensors. The microelectronic imager assembly further comprises optics supports superimposed relative to the imaging dies. The optics supports can be directly on the substrate or on a cover over the substrate. Individual optics supports can have (a) an opening aligned with one of the image sensors, and (b) a bearing element at a reference distance from the image sensor. The microelectronic imager assembly can further include optical devices mounted or otherwise carried by the optics supports.

摘要翻译： 微电子成像器组件包括包括衬底的工件和在衬底上和/或衬底中的多个成像管芯。 基板包括前侧和后侧，并且成像管芯包括在基板的前侧的成像传感器和可操作地耦合到图像传感器的外部触点。 微电子成像器组件还包括相对于成像管芯叠加的光学支架。 光学支撑件可以直接在基板上或衬底上的盖上。 单个光学支撑件可以具有（a）与图像传感器中的一个对准的开口，以及（b）与图像传感器相距一定距离处的轴承元件。 微电子成像器组件还可以包括由光学器件支撑件安装或以其它方式承载的光学器件。

公开(公告)号：US07189954B2

公开(公告)日：2007-03-13

申请号：US10894262

申请日：2004-07-19

申请人： Warren M. Farnworth ,  Sidney B. Rigg ,  William Mark Hiatt ,  Alan G. Wood ,  Peter A. Benson ,  James M. Wark ,  David R. Hembree ,  Kyle K. Kirby ,  Charles M. Watkins ,  Salman Akram

发明人： Warren M. Farnworth ,  Sidney B. Rigg ,  William Mark Hiatt ,  Alan G. Wood ,  Peter A. Benson ,  James M. Wark ,  David R. Hembree ,  Kyle K. Kirby ,  Charles M. Watkins ,  Salman Akram

IPC分类号： H01L31/0232 ,  H01L27/00

CPC分类号： H01L27/00 ,  B33Y80/00 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/00014

摘要： Microelectronic imager assemblies comprising a workpiece including a substrate and a plurality of imaging dies on and/or in the substrate. The substrate includes a front side and a back side, and the imaging dies comprise imaging sensors at the front side of the substrate and external contacts operatively coupled to the image sensors. The microelectronic imager assembly further comprises optics supports superimposed relative to the imaging dies. The optics supports can be directly on the substrate or on a cover over the substrate. Individual optics supports can have (a) an opening aligned with one of the image sensors, and (b) a bearing element at a reference distance from the image sensor. The microelectronic imager assembly can further include optical devices mounted or otherwise carried by the optics supports.

公开(公告)号：US07265330B2

公开(公告)日：2007-09-04

申请号：US11476015

申请日：2006-06-28

申请人： Warren M. Farnworth ,  Sidney B. Rigg ,  William Mark Hiatt ,  Alan G. Wood ,  Peter A. Benson ,  James M. Wark ,  David R. Hembree ,  Kyle K. Kirby ,  Charles M. Watkins ,  Salman Akram

发明人： Warren M. Farnworth ,  Sidney B. Rigg ,  William Mark Hiatt ,  Alan G. Wood ,  Peter A. Benson ,  James M. Wark ,  David R. Hembree ,  Kyle K. Kirby ,  Charles M. Watkins ,  Salman Akram

IPC分类号： H01L27/00 ,  H01L31/0232

CPC分类号： H01L27/00 ,  B33Y80/00 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/00014

摘要： Microelectronic imager assemblies comprising a workpiece including a substrate and a plurality of imaging dies on and/or in the substrate. The substrate includes a front side and a back side, and the imaging dies comprise imaging sensors at the front side of the substrate and external contacts operatively coupled to the image sensors. The microelectronic imager assembly further comprises optics supports superimposed relative to the imaging dies. The optics supports can be directly on the substrate or on a cover over the substrate. Individual optics supports can have (a) an opening aligned with one of the image sensors, and (b) a bearing element at a reference distance from the image sensor. The microelectronic imager assembly can further include optical devices mounted or otherwise carried by the optics supports.

摘要翻译： 微电子成像器组件包括包括衬底的工件和在衬底上和/或衬底中的多个成像管芯。 基板包括前侧和后侧，并且成像管芯包括在基板的前侧的成像传感器和可操作地耦合到图像传感器的外部触点。 微电子成像器组件还包括相对于成像管芯叠加的光学支架。 光学支撑件可以直接在基板上或衬底上的盖上。 单个光学支撑件可以具有（a）与图像传感器中的一个对准的开口，以及（b）与图像传感器相距一定距离处的轴承元件。 微电子成像器组件还可以包括由光学器件支撑件安装或以其它方式承载的光学器件。

公开(公告)号：US07504615B2

公开(公告)日：2009-03-17

申请号：US11727545

申请日：2007-03-27

申请人： Warren M. Farnworth ,  Sidney B. Rigg ,  William Mark Hiatt ,  Alan G. Wood ,  Peter A. Benson ,  James M. Wark ,  David R. Hembree ,  Kyle K. Kirby ,  Charles M. Watkins ,  Salman Akram

发明人： Warren M. Farnworth ,  Sidney B. Rigg ,  William Mark Hiatt ,  Alan G. Wood ,  Peter A. Benson ,  James M. Wark ,  David R. Hembree ,  Kyle K. Kirby ,  Charles M. Watkins ,  Salman Akram

IPC分类号： H01L27/00 ,  H01L31/0232

CPC分类号： H01L27/00 ,  B33Y80/00 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/00014

摘要： Microelectronic imager assemblies comprising a workpiece including a substrate and a plurality of imaging dies on and/or in the substrate. The substrate includes a front side and a back side, and the imaging dies comprise imaging sensors at the front side of the substrate and external contacts operatively coupled to the image sensors. The microelectronic imager assembly further comprises optics supports superimposed relative to the imaging dies. The optics supports can be directly on the substrate or on a cover over the substrate. Individual optics supports can have (a) an opening aligned with one of the image sensors, and (b) a bearing element at a reference distance from the image sensor. The microelectronic imager assembly can further include optical devices mounted or otherwise carried by the optics supports.

摘要翻译： 微电子成像器组件包括包括衬底的工件和在衬底上和/或衬底中的多个成像管芯。 基板包括前侧和后侧，并且成像管芯包括在基板的前侧的成像传感器和可操作地耦合到图像传感器的外部触点。 微电子成像器组件还包括相对于成像管芯叠加的光学支架。 光学支撑件可以直接在基板上或衬底上的盖上。 单个光学支撑件可以具有（a）与图像传感器中的一个对准的开口，以及（b）与图像传感器相距一定距离处的轴承元件。 微电子成像器组件还可以包括由光学器件支撑件安装或以其它方式承载的光学器件。

公开(公告)号：US07419841B2

公开(公告)日：2008-09-02

申请号：US11494453

申请日：2006-07-28

申请人： Warren M. Farnworth ,  Sidney B. Rigg ,  William M. Hiatt ,  Kyle K. Kirby ,  Peter A. Benson ,  James M. Wark ,  Alan G. Wood ,  David R. Hembree ,  Salman Akram ,  Charles M. Watkins

发明人： Warren M. Farnworth ,  Sidney B. Rigg ,  William M. Hiatt ,  Kyle K. Kirby ,  Peter A. Benson ,  James M. Wark ,  Alan G. Wood ,  David R. Hembree ,  Salman Akram ,  Charles M. Watkins

IPC分类号： H01L21/00

CPC分类号： H01L27/14618 ,  H01L23/481 ,  H01L24/48 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/04941 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Microelectronic imagers and methods for packaging microelectronic imagers are disclosed herein. In one embodiment, a microelectronic imaging unit can include a microelectronic die, an image sensor, an integrated circuit electrically coupled to the image sensor, and a bond-pad electrically coupled to the integrated circuit. An electrically conductive through-wafer interconnect extends through the die and is in contact with the bond-pad. The interconnect can include a passage extending completely through the substrate and the bond-pad with conductive fill material at least partially disposed in the passage. An electrically conductive support member is carried by and projects from the bond-pad. A cover over the image sensor is coupled to the support member.

摘要翻译： 本文公开了微电子成像器和用于封装微电子成像器的方法。 在一个实施例中，微电子成像单元可以包括微电子管芯，图像传感器，电耦合到图像传感器的集成电路以及电耦合到集成电路的接合焊盘。 导电晶片互连延伸穿过管芯并且与焊盘接触。 互连可以包括完全延伸穿过基底的通道和具有至少部分地设置在通道中的导电填充材料的接合垫。 导电支撑构件由接合垫承载和突出。 图像传感器上的盖连接到支撑构件。

公开(公告)号：US07199439B2

公开(公告)日：2007-04-03

申请号：US10867352

申请日：2004-06-14

申请人： Warren M. Farnworth ,  Sidney B. Rigg ,  William M. Hiatt ,  Kyle K. Kirby ,  Peter A. Benson ,  James M. Wark ,  Alan G. Wood ,  David R. Hembree ,  Salman Akram ,  Charles M. Watkins

发明人： Warren M. Farnworth ,  Sidney B. Rigg ,  William M. Hiatt ,  Kyle K. Kirby ,  Peter A. Benson ,  James M. Wark ,  Alan G. Wood ,  David R. Hembree ,  Salman Akram ,  Charles M. Watkins

IPC分类号： H01L31/0203

CPC分类号： H01L27/14618 ,  H01L23/481 ,  H01L24/48 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/04941 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Microelectronic imagers and methods for packaging microelectronic imagers are disclosed herein. In one embodiment, a microelectronic imaging unit can include a microelectronic die, an image sensor, an integrated circuit electrically coupled to the image sensor, and a bond-pad electrically coupled to the integrated circuit. An electrically conductive through-wafer interconnect extends through the die and is in contact with the bond-pad. The interconnect can include a passage extending completely through the substrate and the bond-pad with conductive fill material at least partially disposed in the passage. An electrically conductive support member is carried by and projects from the bond-pad. A cover over the image sensor is coupled to the support member.

摘要翻译： 本文公开了微电子成像器和用于封装微电子成像器的方法。 在一个实施例中，微电子成像单元可以包括微电子管芯，图像传感器，电耦合到图像传感器的集成电路以及电耦合到集成电路的接合焊盘。 导电晶片互连延伸穿过管芯并且与焊盘接触。 互连可以包括完全延伸穿过基底的通道和具有至少部分地设置在通道中的导电填充材料的接合垫。 导电支撑构件由接合垫承载和突出。 图像传感器上的盖连接到支撑构件。

公开(公告)号：US07956443B2

公开(公告)日：2011-06-07

申请号：US12725724

申请日：2010-03-17

申请人： Salman Akram ,  Charles M. Watkins ,  Mark Hiatt ,  David R. Hembree ,  James M. Wark ,  Warren M. Farnworth ,  Mark E. Tuttle ,  Sidney B. Rigg ,  Steven D. Oliver ,  Kyle K. Kirby ,  Alan G. Wood ,  Lu Velicky

发明人： Salman Akram ,  Charles M. Watkins ,  Mark Hiatt ,  David R. Hembree ,  James M. Wark ,  Warren M. Farnworth ,  Mark E. Tuttle ,  Sidney B. Rigg ,  Steven D. Oliver ,  Kyle K. Kirby ,  Alan G. Wood ,  Lu Velicky

IPC分类号： H01L23/485

CPC分类号： H01L21/76877 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/45 ,  H01L27/14634 ,  H01L27/14636 ,  H01L2221/6834 ,  H01L2224/02166 ,  H01L2224/0554 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/48463 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths.

摘要翻译： 公开了一种用于成像器，存储器和其他集成电路应用的透晶片互连，从而消除了对引线接合的需要，使得结合这种互连的器件可堆叠并且实现成像器件的晶片级封装。 此外，实现了更小且更可靠的管芯封装，并且由于信号路径长度的减小，电路寄生（例如，L和R）被减小。

公开(公告)号：US07683458B2

公开(公告)日：2010-03-23

申请号：US11924781

申请日：2007-10-26

申请人： Salman Akram ,  Charles M. Watkins ,  William M. Hiatt ,  David R. Hembree ,  James M. Wark ,  Warren M. Farnworth ,  Mark E. Tuttle ,  Sidney B. Rigg ,  Steven D. Oliver ,  Kyle K. Kirby ,  Alan G. Wood ,  Lu Velicky

发明人： Salman Akram ,  Charles M. Watkins ,  William M. Hiatt ,  David R. Hembree ,  James M. Wark ,  Warren M. Farnworth ,  Mark E. Tuttle ,  Sidney B. Rigg ,  Steven D. Oliver ,  Kyle K. Kirby ,  Alan G. Wood ,  Lu Velicky

IPC分类号： H01L23/485

CPC分类号： H01L21/76877 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/45 ,  H01L27/14634 ,  H01L27/14636 ,  H01L2221/6834 ,  H01L2224/02166 ,  H01L2224/0554 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/48463 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths.

摘要翻译： 公开了一种用于成像器，存储器和其他集成电路应用的透晶片互连，从而消除了对引线接合的需要，使得结合这种互连的器件可堆叠并且实现成像器件的晶片级封装。 此外，实现了更小且更可靠的管芯封装，并且由于信号路径长度的减小，电路寄生（例如，L和R）被减小。

公开(公告)号：US08502353B2

公开(公告)日：2013-08-06

申请号：US13154550

申请日：2011-06-07

申请人： Salman Akram ,  Charles M. Watkins ,  William M. Hiatt ,  David R. Hembree ,  James M. Wark ,  Warren M. Farnworth ,  Mark E. Tuttle ,  Sidney B. Rigg ,  Steven D. Oliver ,  Kyle K. Kirby ,  Alan G. Wood ,  Lu Velicky

发明人： Salman Akram ,  Charles M. Watkins ,  William M. Hiatt ,  David R. Hembree ,  James M. Wark ,  Warren M. Farnworth ,  Mark E. Tuttle ,  Sidney B. Rigg ,  Steven D. Oliver ,  Kyle K. Kirby ,  Alan G. Wood ,  Lu Velicky

IPC分类号： H01L23/485

CPC分类号： H01L21/76877 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/45 ,  H01L27/14634 ,  H01L27/14636 ,  H01L2221/6834 ,  H01L2224/02166 ,  H01L2224/0554 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/48463 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths.

摘要翻译： 公开了一种用于成像器，存储器和其他集成电路应用的透晶片互连，从而消除了对引线接合的需要，使得结合这种互连的器件可堆叠并且实现成像器件的晶片级封装。 此外，实现了更小且更可靠的管芯封装，并且由于信号路径长度的减小，电路寄生（例如，L和R）被减小。