公开(公告)号：US07956443B2

公开(公告)日：2011-06-07

申请号：US12725724

申请日：2010-03-17

申请人： Salman Akram ,  Charles M. Watkins ,  Mark Hiatt ,  David R. Hembree ,  James M. Wark ,  Warren M. Farnworth ,  Mark E. Tuttle ,  Sidney B. Rigg ,  Steven D. Oliver ,  Kyle K. Kirby ,  Alan G. Wood ,  Lu Velicky

发明人： Salman Akram ,  Charles M. Watkins ,  Mark Hiatt ,  David R. Hembree ,  James M. Wark ,  Warren M. Farnworth ,  Mark E. Tuttle ,  Sidney B. Rigg ,  Steven D. Oliver ,  Kyle K. Kirby ,  Alan G. Wood ,  Lu Velicky

IPC分类号： H01L23/485

CPC分类号： H01L21/76877 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/45 ,  H01L27/14634 ,  H01L27/14636 ,  H01L2221/6834 ,  H01L2224/02166 ,  H01L2224/0554 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/48463 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths.

摘要翻译： 公开了一种用于成像器，存储器和其他集成电路应用的透晶片互连，从而消除了对引线接合的需要，使得结合这种互连的器件可堆叠并且实现成像器件的晶片级封装。 此外，实现了更小且更可靠的管芯封装，并且由于信号路径长度的减小，电路寄生（例如，L和R）被减小。

公开(公告)号：US08502353B2

公开(公告)日：2013-08-06

申请号：US13154550

申请日：2011-06-07

申请人： Salman Akram ,  Charles M. Watkins ,  William M. Hiatt ,  David R. Hembree ,  James M. Wark ,  Warren M. Farnworth ,  Mark E. Tuttle ,  Sidney B. Rigg ,  Steven D. Oliver ,  Kyle K. Kirby ,  Alan G. Wood ,  Lu Velicky

发明人： Salman Akram ,  Charles M. Watkins ,  William M. Hiatt ,  David R. Hembree ,  James M. Wark ,  Warren M. Farnworth ,  Mark E. Tuttle ,  Sidney B. Rigg ,  Steven D. Oliver ,  Kyle K. Kirby ,  Alan G. Wood ,  Lu Velicky

IPC分类号： H01L23/485

CPC分类号： H01L21/76877 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/45 ,  H01L27/14634 ,  H01L27/14636 ,  H01L2221/6834 ,  H01L2224/02166 ,  H01L2224/0554 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/48463 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths.

摘要翻译： 公开了一种用于成像器，存储器和其他集成电路应用的透晶片互连，从而消除了对引线接合的需要，使得结合这种互连的器件可堆叠并且实现成像器件的晶片级封装。 此外，实现了更小且更可靠的管芯封装，并且由于信号路径长度的减小，电路寄生（例如，L和R）被减小。

公开(公告)号：US07683458B2

公开(公告)日：2010-03-23

申请号：US11924781

申请日：2007-10-26

申请人： Salman Akram ,  Charles M. Watkins ,  William M. Hiatt ,  David R. Hembree ,  James M. Wark ,  Warren M. Farnworth ,  Mark E. Tuttle ,  Sidney B. Rigg ,  Steven D. Oliver ,  Kyle K. Kirby ,  Alan G. Wood ,  Lu Velicky

发明人： Salman Akram ,  Charles M. Watkins ,  William M. Hiatt ,  David R. Hembree ,  James M. Wark ,  Warren M. Farnworth ,  Mark E. Tuttle ,  Sidney B. Rigg ,  Steven D. Oliver ,  Kyle K. Kirby ,  Alan G. Wood ,  Lu Velicky

IPC分类号： H01L23/485

CPC分类号： H01L21/76877 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/45 ,  H01L27/14634 ,  H01L27/14636 ,  H01L2221/6834 ,  H01L2224/02166 ,  H01L2224/0554 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/48463 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths.

摘要翻译： 公开了一种用于成像器，存储器和其他集成电路应用的透晶片互连，从而消除了对引线接合的需要，使得结合这种互连的器件可堆叠并且实现成像器件的晶片级封装。 此外，实现了更小且更可靠的管芯封装，并且由于信号路径长度的减小，电路寄生（例如，L和R）被减小。

公开(公告)号：US07452743B2

公开(公告)日：2008-11-18

申请号：US11217877

申请日：2005-09-01

申请人： Steven D. Oliver ,  Lu Velicky ,  William Mark Hiatt ,  David R. Hembree ,  Mark E. Tuttle ,  Sidney B. Rigg ,  James M. Wark ,  Warren M. Farnworth ,  Kyle K. Kirby

发明人： Steven D. Oliver ,  Lu Velicky ,  William Mark Hiatt ,  David R. Hembree ,  Mark E. Tuttle ,  Sidney B. Rigg ,  James M. Wark ,  Warren M. Farnworth ,  Kyle K. Kirby

IPC分类号： H01L21/00

CPC分类号： H01L21/00 ,  H01L21/76898 ,  H01L23/552 ,  H01L27/14609 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/14685 ,  H01L27/14687 ,  H01L2924/0002 ,  H01L2924/00

摘要： Microelectronic imaging units and methods for manufacturing a plurality of imaging units at the wafer level are disclosed herein. In one embodiment, a method for manufacturing a plurality of imaging units includes providing an imager workpiece having a plurality of imaging dies including integrated circuits, external contacts electrically coupled to the integrated circuits, and image sensors operably coupled to the integrated circuits. The individual image sensors include at least one dark current pixel at a perimeter portion of the image sensor. The method includes depositing a cover layer onto the workpiece and over the image sensors. The method further includes patterning and selectively developing the cover layer to form discrete volumes of cover layer material over corresponding image sensors. The discrete volumes of cover layer material have sidewalls aligned with an inboard edge of the individual dark current pixels such that the dark current pixels are not covered by the discrete volumes.

摘要翻译： 本文公开了用于在晶片级制造多个成像单元的微电子成像单元和方法。 在一个实施例中，制造多个成像单元的方法包括提供具有多个成像管芯的成像工件，所述成像管芯包括集成电路，电耦合到集成电路的外部触点以及可操作地耦合到集成电路的图像传感器。 各个图像传感器包括在图像传感器的周边部分处的至少一个暗电流像素。 该方法包括将覆盖层沉积在工件上并在图像传感器上方。 该方法还包括图案化和选择性地显影覆盖层以在对应的图像传感器上形成分离体积的覆盖层材料。 覆盖层材料的离散体积具有与各个暗电流像素的内侧边缘对准的侧壁，使得暗电流像素不被离散体积覆盖。

公开(公告)号：US20080318353A1

公开(公告)日：2008-12-25

申请号：US12196591

申请日：2008-08-22

申请人： Steven D. Oliver ,  James M. Wark ,  Kyle K. Kirby

发明人： Steven D. Oliver ,  James M. Wark ,  Kyle K. Kirby

IPC分类号： H01L21/00

CPC分类号： H04N5/2254 ,  B33Y80/00 ,  G02B7/006 ,  G02B7/022 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14685 ,  H01L31/02325 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15174 ,  H04N5/2253 ,  H01L2924/00014

摘要： Microelectronic imager assemblies with optical devices having integral reference features and methods for assembling such microelectronic imagers is disclosed herein. In one embodiment, the imager assembly can include a workpiece with a substrate having a front side, a back side, and a plurality of imaging dies on and/or in the substrate. The imaging dies include image sensors, integrated circuitry operatively coupled to the image sensors, and external contacts electrically coupled to the integrated circuitry. The assembly also includes optics supports on the workpiece. The optics supports have openings aligned with corresponding image sensors and first interface features at reference locations relative to corresponding image sensors. The assembly further includes optical devices having optics elements and second interface features seated with corresponding first interface features to position the optics elements at a desired location relative to corresponding image sensors.

摘要翻译： 本文公开了具有整体参考特征的光学装置的微电子成像器组件和用于组装这种微电子成像器的方法。 在一个实施例中，成像器组件可以包括具有衬底的工件，该衬底具有在衬底上和/或衬底中的前侧，后侧和多个成像管芯。 成像管芯包括图像传感器，可操作地耦合到图像传感器的集成电路以及电耦合到集成电路的外部触点。 组件还包括工件上的光学支架。 光学支架具有与对应的图像传感器对准的开口和相对于相应图像传感器的参考位置处的第一界面特征。 该组件还包括具有光学元件的光学装置和与对应的第一界面特征相配合的第二界面特征，以将光学元件相对于相应的图像传感器定位在期望的位置。

公开(公告)号：US07993944B2

公开(公告)日：2011-08-09

申请号：US12196591

申请日：2008-08-22

申请人： Steven D. Oliver ,  James M. Wark ,  Kyle K. Kirby

发明人： Steven D. Oliver ,  James M. Wark ,  Kyle K. Kirby

IPC分类号： H01L21/00

CPC分类号： H04N5/2254 ,  B33Y80/00 ,  G02B7/006 ,  G02B7/022 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14685 ,  H01L31/02325 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15174 ,  H04N5/2253 ,  H01L2924/00014

摘要： Microelectronic imager assemblies with optical devices having integral reference features and methods for assembling such microelectronic imagers is disclosed herein. In one embodiment, the imager assembly can include a workpiece with a substrate having a front side, a back side, and a plurality of imaging dies on and/or in the substrate. The imaging dies include image sensors, integrated circuitry operatively coupled to the image sensors, and external contacts electrically coupled to the integrated circuitry. The assembly also includes optics supports on the workpiece. The optics supports have openings aligned with corresponding image sensors and first interface features at reference locations relative to corresponding image sensors. The assembly further includes optical devices having optics elements and second interface features seated with corresponding first interface features to position the optics elements at a desired location relative to corresponding image sensors.

摘要翻译： 本文公开了具有整体参考特征的光学装置的微电子成像器组件和用于组装这种微电子成像器的方法。 在一个实施例中，成像器组件可以包括具有衬底的工件，该衬底具有在衬底上和/或衬底中的前侧，后侧和多个成像管芯。 成像管芯包括图像传感器，可操作地耦合到图像传感器的集成电路以及电耦合到集成电路的外部触点。 组件还包括工件上的光学支架。 光学支架具有与对应的图像传感器对准的开口和相对于相应图像传感器的参考位置处的第一界面特征。 该组件还包括具有光学元件的光学装置和与对应的第一界面特征相配合的第二界面特征，以将光学元件相对于相应的图像传感器定位在期望的位置。

公开(公告)号：US07429494B2

公开(公告)日：2008-09-30

申请号：US10925406

申请日：2004-08-24

申请人： Steven D. Oliver ,  James M. Wark ,  Kyle K. Kirby

发明人： Steven D. Oliver ,  James M. Wark ,  Kyle K. Kirby

IPC分类号： H01L21/00

CPC分类号： H04N5/2254 ,  B33Y80/00 ,  G02B7/006 ,  G02B7/022 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14685 ,  H01L31/02325 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15174 ,  H04N5/2253 ,  H01L2924/00014

摘要： Microelectronic imager assemblies with optical devices having integral reference features and methods for assembling such microelectronic imagers is disclosed herein. In one embodiment, the imager assembly can include a workpiece with a substrate having a front side, a back side, and a plurality of imaging dies on and/or in the substrate. The imaging dies include image sensors, integrated circuitry operatively coupled to the image sensors, and external contacts electrically coupled to the integrated circuitry. The assembly also includes optics supports on the workpiece. The optics supports have openings aligned with corresponding image sensors and first interface features at reference locations relative to corresponding image sensors. The assembly further includes optical devices having optics elements and second interface features seated with corresponding first interface features to position the optics elements at a desired location relative to corresponding image sensors.

摘要翻译： 本文公开了具有整体参考特征的光学装置的微电子成像器组件和用于组装这种微电子成像器的方法。 在一个实施例中，成像器组件可以包括具有衬底的工件，该衬底具有在衬底上和/或衬底中的前侧，后侧和多个成像管芯。 成像管芯包括图像传感器，可操作地耦合到图像传感器的集成电路以及电耦合到集成电路的外部触点。 组件还包括工件上的光学支架。 光学支架具有与对应的图像传感器对准的开口和相对于相应图像传感器的参考位置处的第一界面特征。 该组件还包括具有光学元件的光学装置和与对应的第一界面特征相配合的第二界面特征，以将光学元件相对于相应的图像传感器定位在期望的位置。

公开(公告)号：US07749899B2

公开(公告)日：2010-07-06

申请号：US11446003

申请日：2006-06-01

申请人： Douglas Clark ,  Steven D. Oliver ,  Kyle K. Kirby ,  Ross S. Dando

发明人： Douglas Clark ,  Steven D. Oliver ,  Kyle K. Kirby ,  Ross S. Dando

IPC分类号： H01L21/44

CPC分类号： H01L21/76898

摘要： Methods and systems for forming electrical interconnects through microelectronic workpieces are disclosed herein. One aspect of the invention is directed to a method of manufacturing an electrical interconnect in a microelectronic workpiece having a plurality of dies. Each die can include at least one terminal electrically coupled to an integrated circuit. The method can include forming a blind hole in a first side of the workpiece, and forming a vent in a second side of the workpiece in fluid communication with the blind hole. The method can further include moving, e.g., by sucking and/or wetting, electrically conductive material into at least a portion of the blind hole by drawing at least a partial vacuum in the vent. In one embodiment, the blind hole can extend through one of the terminals on the workpiece. In this embodiment, the electrically conductive material forms an interconnect that extends through the workpiece and is electrically coupled to the terminal.

摘要翻译： 本文公开了通过微电子工件形成电互连的方法和系统。 本发明的一个方面涉及一种在具有多个管芯的微电子工件中制造电互连的方法。 每个管芯可以包括电耦合到集成电路的至少一个端子。 该方法可以包括在工件的第一侧中形成盲孔，并且在与盲孔流体连通的工件的第二侧中形成通气孔。 该方法还可以包括通过在排气口中抽取至少一部分真空来移动，例如通过将导电材料吸入和/或润湿至盲孔的至少一部分。 在一个实施例中，盲孔可延伸穿过工件上的一个端子。 在该实施例中，导电材料形成延伸穿过工件并且与端子电连接的互连。

公开(公告)号：US07169248B1

公开(公告)日：2007-01-30

申请号：US11185045

申请日：2005-07-19

申请人： Kyle K. Kirby ,  Steven D. Oliver

发明人： Kyle K. Kirby ,  Steven D. Oliver

IPC分类号： B29C65/44 ,  B32B38/10 ,  H01L21/301 ,  H01L21/302

CPC分类号： H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2924/3025 ,  Y10T156/1052 ,  Y10T156/108 ,  Y10T428/14 ,  Y10T428/1414 ,  Y10T428/1471

摘要： Methods for releasably attaching support members to microfeature workpieces and microfeature assemblies formed using such methods. A method for processing a microfeature workpiece in accordance with one embodiment includes applying adhesive material to a non-active portion on a first side of a workpiece. The workpiece can include a first active portion and a second active portion separated from each other at least in part by the non-active portion. The method continues by adhesively attaching the first side of the workpiece to a first support member, and releasably attaching the second side of the workpiece to a second support member. The method further includes separating the first active portion from the second active portion while the workpiece is attached to the second support member by cutting through the first support member and the non-active portion of the workpiece. The separation process removes at least approximately all the adhesive material from the non-active portion of the workpiece.

摘要翻译： 用于将支撑构件可释放地附接到微型工件和使用这种方法形成的微特征组件的方法。 根据一个实施例的用于处理微特征工件的方法包括将粘合剂材料施加到工件的第一侧上的非活动部分。 工件可以包括至少部分地由非活动部分彼此分离的第一有效部分和第二有效部分。 该方法通过将工件的第一侧粘合地附接到第一支撑构件并且将工件的第二侧可释放地附接到第二支撑构件来继续。 该方法还包括通过切割穿过第一支撑构件和工件的非活动部分而将工件附接到第二支撑构件而将第一活动部分与第二活动部分分离。 分离过程至少从工件的非活性部分去除所有的粘合剂材料。

公开(公告)号：US07833601B2

公开(公告)日：2010-11-16

申请号：US11585485

申请日：2006-10-24

申请人： Kyle K. Kirby ,  Steven D. Oliver

发明人： Kyle K. Kirby ,  Steven D. Oliver

IPC分类号： B32B9/00 ,  B32B33/00

CPC分类号： H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2924/3025 ,  Y10T156/1052 ,  Y10T156/108 ,  Y10T428/14 ,  Y10T428/1414 ,  Y10T428/1471

摘要： Methods for releasably attaching support members to microfeature workpieces and microfeature assemblies formed using such methods are disclosed herein. A method for processing a microfeature workpiece in accordance with one embodiment includes applying adhesive material to a non-active portion on a first side of a workpiece. The workpiece can include a first active portion and a second active portion separated from each other at least in part by the non-active portion. The method continues by adhesively attaching the first side of the workpiece to a first support member, and releasably attaching the second side of the workpiece to a second support member. The method further includes separating the first active portion from the second active portion while the workpiece is attached to the second support member by cutting through the first support member and the non-active portion of the workpiece. The separation process removes at least approximately all the adhesive material from the non-active portion of the workpiece.

摘要翻译： 本文公开了将支撑构件可释放地附接到微特征工件和使用这种方法形成的微特征组件的方法。 根据一个实施例的用于处理微特征工件的方法包括将粘合剂材料施加到工件的第一侧上的非活动部分。 工件可以包括至少部分地由非活动部分彼此分离的第一有效部分和第二有效部分。 该方法通过将工件的第一侧粘合地附接到第一支撑构件并且将工件的第二侧可释放地附接到第二支撑构件来继续。 该方法还包括通过切割穿过第一支撑构件和工件的非活动部分而将工件附接到第二支撑构件而将第一活动部分与第二活动部分分离。 分离过程至少从工件的非活性部分去除所有的粘合剂材料。