公开(公告)号：US07698952B2

公开(公告)日：2010-04-20

申请号：US11861119

申请日：2007-09-25

申请人： Wayne G. Renken ,  Mei H. Sun ,  Aron Abramowski Mason ,  Lynn Karl Wiese

发明人： Wayne G. Renken ,  Mei H. Sun ,  Aron Abramowski Mason ,  Lynn Karl Wiese

IPC分类号： G01L1/00

CPC分类号： G01L9/0073

摘要： At least one pair of capacitively coupled electrodes contained in a structure is used to sense the deflection of a diaphragm in a pressure or force sensor for measuring the pressure or force exerted on the diaphragm. Preferably the structure has properties (such as one or more of the following: dimensions, hardness, area and flexibility) that are substantially the same as those of a real substrate, such as a semiconductor wafer or flat panel display panel.

摘要翻译： 使用包含在结构中的至少一对电容耦合电极来感测用于测量施加在隔膜上的压力或力的压力或力传感器中的隔膜的偏转。 优选地，结构具有与诸如半导体晶片或平板显示面板的实际基板的特性（例如尺寸，硬度，面积和柔性）相同的性质（诸如以下的一个或多个）。

公开(公告)号：US07497134B2

公开(公告)日：2009-03-03

申请号：US11861207

申请日：2007-09-25

申请人： Wayne G. Renken ,  Mei H. Sun ,  Aron Abramowski Mason

发明人： Wayne G. Renken ,  Mei H. Sun ,  Aron Abramowski Mason

IPC分类号： G01L1/16

CPC分类号： G01L1/148 ,  G01L5/0047 ,  G01L9/0042 ,  G01L9/0073

摘要： At least one shear force sensor is used to measure the shear force on a member, when the member is in contact with and pressed against a polishing or planarization surface and a lateral force is applied between the two surfaces. Preferably the structure and the surface of the structure have properties (such as one or more of the following: dimensions and coefficient of friction) that are substantially the same as those of a real substrate, such as a semiconductor wafer or flat panel display panel.

摘要翻译： 当构件与抛光或平坦化表面接触并压靠在抛光或平坦化表面上并且在两个表面之间施加横向力时，使用至少一个剪切力传感器来测量构件上的剪切力。 优选地，结构和结构的表面具有与诸如半导体晶片或平板显示面板的实际基板基本上相同的性质（例如以下的一个或多个：尺寸和摩擦系数）。

公开(公告)号：US20130029433A1

公开(公告)日：2013-01-31

申请号：US13361869

申请日：2012-01-30

申请人： Mei H. Sun ,  Mark Wiltse ,  Wayne G. Renken ,  Zachary Reid ,  Tony Dibiase

发明人： Mei H. Sun ,  Mark Wiltse ,  Wayne G. Renken ,  Zachary Reid ,  Tony Dibiase

IPC分类号： H01L21/66 ,  H05K3/30 ,  G01N27/00 ,  G01N19/00 ,  G01N33/00 ,  G01N21/00

CPC分类号： H01L21/67253 ,  G03F7/70616 ,  G03F7/7085 ,  G03F7/70875 ,  Y10T29/4913

摘要： An instrument comprises a substrate, a plurality of sensors distributed at positions across the substrate's surface, at least one electronic processing component on the surface, electrical conductors extending across the surface and connected to the sensors and processing component, and a cover disposed over the sensors, processing component and conductors. The cover and substrate have similar material properties to a production substrate. The cover is configured to electromagnetically shield the sensors, conductors, or processing component. The instrument has approximately the same thickness and/or flatness as the production substrate. It is emphasized that this abstract is provided to comply with rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

摘要翻译： 仪器包括基板，分布在基板表面上的位置处的多个传感器，表面上的至少一个电子处理部件，横跨表面延伸并连接到传感器和处理部件的电导体，以及设置在传感器 ，处理部件和导体。 覆盖物和基材与生产基材具有相似的材料性质。 盖被配置为电磁屏蔽传感器，导体或处理部件。 仪器具有与生产基底大致相同的厚度和/或平坦度。 要强调的是，提供这个摘要是为了符合要求摘要的规则，允许搜索者或其他读者快速确定技术公开内容的主题。 提交它的理解是，它不会用于解释或限制权利要求的范围或含义。

公开(公告)号：US08104342B2

公开(公告)日：2012-01-31

申请号：US12034041

申请日：2008-02-20

申请人： Mei H. Sun ,  Mark Wiltse ,  Wayne G. Renken ,  Zachary Reid ,  Tony DiBiase

发明人： Mei H. Sun ,  Mark Wiltse ,  Wayne G. Renken ,  Zachary Reid ,  Tony DiBiase

IPC分类号： G01D11/24

CPC分类号： H01L21/67253 ,  G03F7/70616 ,  G03F7/7085 ,  G03F7/70875 ,  Y10T29/4913

摘要： An instrument for measuring a parameter comprises a substrate, a plurality of sensors carried by and distributed across a surface of the substrate that individually measure the parameter at different positions, an electronic processing component carried by the substrate surface, electrical conductors extending across the surface connected to the sensors and the electronic processing component, and a cover disposed over the sensors, electronic processing component and conductors. The cover and substrate have similar material properties to a production substrate processed by a substrate processing cell. The instrument has approximately the same thickness and/or flatness as the production substrate. The instrument may be subjected a substrate process and one or more parameters may be measured with the instrument during the process. The behavior of a production wafer in the substrate process may be characterized based on measurements of the parameters made with the one or more sensors.

摘要翻译： 用于测量参数的仪器包括基板，由基板的表面承载并分布在多个基板表面上的单独测量不同位置处的参数的多个传感器，由基板表面承载的电子处理部件，跨越表面连接的电导体 传感器和电子处理部件，以及设置在传感器，电子处理部件和导体上的盖子。 盖和基底与由基板处理单元处理的生产基板具有相似的材料特性。 仪器具有与生产基底大致相同的厚度和/或平坦度。 仪器可以经受衬底工艺，并且可以在过程期间用仪器测量一个或多个参数。 可以基于用一个或多个传感器进行的参数的测量来表征生产晶片在衬底工艺中的行为。

公开(公告)号：US07757574B2

公开(公告)日：2010-07-20

申请号：US11302763

申请日：2005-12-13

申请人： Wayne G. Renken ,  Mei H. Sun

发明人： Wayne G. Renken ,  Mei H. Sun

IPC分类号： G01D7/02

CPC分类号： G01D9/005 ,  H01L21/67253 ,  H01L22/34 ,  H01L2224/48091 ,  Y10T29/4913 ,  H01L2924/00014

摘要： A measuring device incorporating a substrate with sensors that measure the processing conditions that a wafer may undergo during manufacturing. The substrate can be inserted into a processing chamber by a robot head and the measuring device can transmit the conditions in real time or store the conditions for subsequent analysis. Sensitive electronic components of the device can be distanced or isolated from the most deleterious processing conditions in order increase the accuracy, operating range, and reliability of the device. Isolation may be provided by vacuum or suitable material and phase change material may be located adjacent to electronics to maintain a low temperature.

摘要翻译： 一种测量装置，其包含具有测量晶片在制造过程中可能经历的加工条件的传感器的基板。 基板可以通过机器人头插入处理室，并且测量装置可以实时地传送条件或存储用于后续分析的条件。 设备的敏感电子元件可以远离或与最有害的处理条件隔离，以提高设备的精度，操作范围和可靠性。 可以通过真空或合适的材料提供隔离，并且相变材料可以位于电子设备附近以保持低温。

公开(公告)号：US20090056441A1

公开(公告)日：2009-03-05

申请号：US12034041

申请日：2008-02-20

申请人： Mei H. Sun ,  Mark Wiltse ,  Wayne G. Renken ,  Zachary Reid ,  Tony DiBiase

发明人： Mei H. Sun ,  Mark Wiltse ,  Wayne G. Renken ,  Zachary Reid ,  Tony DiBiase

IPC分类号： G01D11/00 ,  H01L21/66

CPC分类号： H01L21/67253 ,  G03F7/70616 ,  G03F7/7085 ,  G03F7/70875 ,  Y10T29/4913

摘要： An instrument for measuring a parameter comprises a substrate, a plurality of sensors carried by and distributed across a surface of the substrate that individually measure the parameter at different positions, an electronic processing component carried by the substrate surface, electrical conductors extending across the surface connected to the sensors and the electronic processing component, and a cover disposed over the sensors, electronic processing component and conductors. The cover and substrate have similar material properties to a production substrate processed by a substrate processing cell. The instrument has approximately the same thickness and/or flatness as the production substrate. The instrument may be subjected a substrate process and one or more parameters may be measured with the instrument during the process. The behavior of a production wafer in the substrate process may be characterized based on measurements of the parameters made with the one or more sensors.

摘要翻译： 用于测量参数的仪器包括基板，由基板的表面承载并分布在多个基板表面上的单独测量不同位置处的参数的多个传感器，由基板表面承载的电子处理部件，跨越表面连接的电导体 传感器和电子处理部件，以及设置在传感器，电子处理部件和导体上的盖子。 盖和基底与由基板处理单元处理的生产基板具有相似的材料特性。 仪器具有与生产基底大致相同的厚度和/或平坦度。 仪器可以经受衬底工艺，并且可以在过程期间用仪器测量一个或多个参数。 可以基于用一个或多个传感器进行的参数的测量来表征生产晶片在衬底工艺中的行为。

公开(公告)号：US20100294051A1

公开(公告)日：2010-11-25

申请号：US12787326

申请日：2010-05-25

申请人： Wayne G. Renken ,  Mei H. Sun

发明人： Wayne G. Renken ,  Mei H. Sun

IPC分类号： G01M19/00 ,  H05K3/00

CPC分类号： G01D9/005 ,  H01L21/67253 ,  H01L22/34 ,  H01L2224/48091 ,  Y10T29/4913 ,  H01L2924/00014

摘要： A measuring device incorporating a substrate with sensors that measure the processing conditions that a wafer may undergo during manufacturing. The substrate can be inserted into a processing chamber by a robot head and the measuring device can transmit the conditions in real time or store the conditions for subsequent analysis. Sensitive electronic components of the device can be distanced or isolated from the most deleterious processing conditions in order increase the accuracy, operating range, and reliability of the device. Isolation may be provided by vacuum or suitable material and phase change material may be located adjacent to electronics to maintain a low temperature.

摘要翻译： 一种测量装置，其包括具有测量晶片在制造期间可能经历的加工条件的传感器的基板。 基板可以通过机器人头插入处理室，并且测量装置可以实时地传送条件或存储用于后续分析的条件。 设备的敏感电子元件可以远离或与最有害的处理条件隔离，以提高设备的精度，操作范围和可靠性。 可以通过真空或合适的材料提供隔离，并且相变材料可以位于电子设备附近以保持低温。

公开(公告)号：US06190040B1

公开(公告)日：2001-02-20

申请号：US09307667

申请日：1999-05-10

申请人： Wayne G. Renken ,  Mei H. Sun

发明人： Wayne G. Renken ,  Mei H. Sun

IPC分类号： G01K702

CPC分类号： H01L21/67248 ,  G01K1/026 ,  G01K1/143

摘要： A cable and interconnect design including a substrate containing discrete sensors in a plurality of cavities or a plurality of thin film sensors deposited throughout the substrate surface. The discrete sensors are bonded within each cavity and potted with a potting compound. Each sensor has leads joined to filaments by an interconnect system. Thin film sensor leads on the substrate connect to a signal transmitting cable by the interconnect system. The filaments are coated and converge at a strain relief coupled to the substrate. The cable, having flat and round portions, includes an array of flat signal transmitting cables arranged side by side in the flat portion and stacked one on top of the other in the round portion. Each signal cable contains a plurality of the filaments bonded together. A pair of ribbons extend along the length of the array of cables. The ribbons and array of cables are bonded together with film to form the flat portion. The ribbons are joined to the strain relief, thereby joining the cable to the substrate. A boot is disposed around the cable transition between the flat and round portions. A connector is coupled to the round portion and the filaments are terminated to the connector. Advantages include the interconnect system bonding pads which reduce fabrication time and provide simple connection geometry on the substrate. Integration of the ribbons into the flat portion allows repeated use in a vacuum seal without damaging the cables. Stacked flat cables make identification of the filaments easy and product assembly fast.

摘要翻译： 一种电缆和互连设计，其包括在多个空腔中包含离散传感器的基板或沉积在整个基板表面上的多个薄膜传感器。 离散的传感器在每个腔内结合并用灌封组合物灌装。 每个传感器具有通过互连系统连接到细丝的引线。 基板上的薄膜传感器引线通过互连系统连接到信号传输电缆。 长丝被涂覆并在与基底耦合的应变释放物上会聚。 具有扁圆形部分的电缆包括在平坦部分中并排布置并且在圆形部分中彼此层叠的扁平信号传输电缆阵列。 每个信号电缆包含多个连接在一起的长丝。 一对带沿电缆阵列的长度延伸。 带子和电缆阵列用薄膜粘合在一起以形成平坦部分。 带被连接到应变消除件，从而将电缆连接到基板。 在平坦部分和圆形部分之间的电缆过渡处布置引导件。 连接器连接到圆形部分，并且细丝终止于连接器。 优点包括互连系统接合焊盘，其减少制造时间并且在衬底上提供简单的连接几何形状。 将带状物整合到平坦部分中允许重复使用在真空密封中而不损坏电缆。 堆叠扁平电缆使灯丝的识别容易，产品组装快速。

公开(公告)号：US08033190B2

公开(公告)日：2011-10-11

申请号：US12787326

申请日：2010-05-25

申请人： Wayne G. Renken ,  Mei H. Sun

发明人： Wayne G. Renken ,  Mei H. Sun

IPC分类号： G01D7/02

CPC分类号： G01D9/005 ,  H01L21/67253 ,  H01L22/34 ,  H01L2224/48091 ,  Y10T29/4913 ,  H01L2924/00014

摘要： A measuring device incorporating a substrate with sensors that measure the processing conditions that a wafer may undergo during manufacturing. The substrate can be inserted into a processing chamber by a robot head and the measuring device can transmit the conditions in real time or store the conditions for subsequent analysis. Sensitive electronic components of the device can be distanced or isolated from the most deleterious processing conditions in order increase the accuracy, operating range, and reliability of the device. Isolation may be provided by vacuum or suitable material and phase change material may be located adjacent to electronics to maintain a low temperature.

摘要翻译： 一种测量装置，其包括具有测量晶片在制造期间可能经历的加工条件的传感器的基板。 基板可以通过机器人头插入处理室，并且测量装置可以实时地传送条件或存储用于后续分析的条件。 设备的敏感电子元件可以远离或与最有害的处理条件隔离，以提高设备的精度，操作范围和可靠性。 可以通过真空或合适的材料提供隔离，并且相变材料可以位于电子设备附近以保持低温。

公开(公告)号：US06915589B2

公开(公告)日：2005-07-12

申请号：US10688300

申请日：2003-10-16

申请人： Mei H. Sun ,  Richard Schwaninger ,  Wayne G. Renken

发明人： Mei H. Sun ,  Richard Schwaninger ,  Wayne G. Renken

IPC分类号： G01D20060101 ,  G01D11/30 ,  G01D21/00

CPC分类号： G01D11/30

摘要： Multiple sensors may be attached to a substrate to measure conditions at different points. Positioning the sensors accurately may be achieved using a template to establish sensor position. A pre-fabricated kit including a template, sensors and a cable assembly may be easily transported so that sensors may be attached in the field.