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    PROCESS CONDITION MEASURING DEVICE
    1.
    发明申请
    PROCESS CONDITION MEASURING DEVICE 审中-公开
    工艺条件测量装置

    公开(公告)号：US20130029433A1

    公开(公告)日：2013-01-31

    申请号：US13361869

    申请日：2012-01-30

    申请人： Mei H. Sun ,  Mark Wiltse ,  Wayne G. Renken ,  Zachary Reid ,  Tony Dibiase

    发明人： Mei H. Sun ,  Mark Wiltse ,  Wayne G. Renken ,  Zachary Reid ,  Tony Dibiase

    IPC分类号： H01L21/66 ,  H05K3/30 ,  G01N27/00 ,  G01N19/00 ,  G01N33/00 ,  G01N21/00

    CPC分类号： H01L21/67253 ,  G03F7/70616 ,  G03F7/7085 ,  G03F7/70875 ,  Y10T29/4913

    摘要： An instrument comprises a substrate, a plurality of sensors distributed at positions across the substrate's surface, at least one electronic processing component on the surface, electrical conductors extending across the surface and connected to the sensors and processing component, and a cover disposed over the sensors, processing component and conductors. The cover and substrate have similar material properties to a production substrate. The cover is configured to electromagnetically shield the sensors, conductors, or processing component. The instrument has approximately the same thickness and/or flatness as the production substrate. It is emphasized that this abstract is provided to comply with rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

    摘要翻译： 仪器包括基板，分布在基板表面上的位置处的多个传感器，表面上的至少一个电子处理部件，横跨表面延伸并连接到传感器和处理部件的电导体，以及设置在传感器 ，处理部件和导体。 覆盖物和基材与生产基材具有相似的材料性质。 盖被配置为电磁屏蔽传感器，导体或处理部件。 仪器具有与生产基底大致相同的厚度和/或平坦度。 要强调的是，提供这个摘要是为了符合要求摘要的规则，允许搜索者或其他读者快速确定技术公开内容的主题。 提交它的理解是，它不会用于解释或限制权利要求的范围或含义。

    Process condition measuring device
    2.
    发明授权
    Process condition measuring device 有权
    工艺条件测量装置

    公开(公告)号：US08104342B2

    公开(公告)日：2012-01-31

    申请号：US12034041

    申请日：2008-02-20

    申请人： Mei H. Sun ,  Mark Wiltse ,  Wayne G. Renken ,  Zachary Reid ,  Tony DiBiase

    发明人： Mei H. Sun ,  Mark Wiltse ,  Wayne G. Renken ,  Zachary Reid ,  Tony DiBiase

    IPC分类号： G01D11/24

    CPC分类号： H01L21/67253 ,  G03F7/70616 ,  G03F7/7085 ,  G03F7/70875 ,  Y10T29/4913

    摘要： An instrument for measuring a parameter comprises a substrate, a plurality of sensors carried by and distributed across a surface of the substrate that individually measure the parameter at different positions, an electronic processing component carried by the substrate surface, electrical conductors extending across the surface connected to the sensors and the electronic processing component, and a cover disposed over the sensors, electronic processing component and conductors. The cover and substrate have similar material properties to a production substrate processed by a substrate processing cell. The instrument has approximately the same thickness and/or flatness as the production substrate. The instrument may be subjected a substrate process and one or more parameters may be measured with the instrument during the process. The behavior of a production wafer in the substrate process may be characterized based on measurements of the parameters made with the one or more sensors.

    摘要翻译： 用于测量参数的仪器包括基板，由基板的表面承载并分布在多个基板表面上的单独测量不同位置处的参数的多个传感器，由基板表面承载的电子处理部件，跨越表面连接的电导体 传感器和电子处理部件，以及设置在传感器，电子处理部件和导体上的盖子。 盖和基底与由基板处理单元处理的生产基板具有相似的材料特性。 仪器具有与生产基底大致相同的厚度和/或平坦度。 仪器可以经受衬底工艺，并且可以在过程期间用仪器测量一个或多个参数。 可以基于用一个或多个传感器进行的参数的测量来表征生产晶片在衬底工艺中的行为。

    PROCESS CONDITION MEASURING DEVICE
    3.
    发明申请
    PROCESS CONDITION MEASURING DEVICE 有权
    工艺条件测量装置

    公开(公告)号：US20090056441A1

    公开(公告)日：2009-03-05

    申请号：US12034041

    申请日：2008-02-20

    申请人： Mei H. Sun ,  Mark Wiltse ,  Wayne G. Renken ,  Zachary Reid ,  Tony DiBiase

    发明人： Mei H. Sun ,  Mark Wiltse ,  Wayne G. Renken ,  Zachary Reid ,  Tony DiBiase

    IPC分类号： G01D11/00 ,  H01L21/66

    CPC分类号： H01L21/67253 ,  G03F7/70616 ,  G03F7/7085 ,  G03F7/70875 ,  Y10T29/4913

    摘要： An instrument for measuring a parameter comprises a substrate, a plurality of sensors carried by and distributed across a surface of the substrate that individually measure the parameter at different positions, an electronic processing component carried by the substrate surface, electrical conductors extending across the surface connected to the sensors and the electronic processing component, and a cover disposed over the sensors, electronic processing component and conductors. The cover and substrate have similar material properties to a production substrate processed by a substrate processing cell. The instrument has approximately the same thickness and/or flatness as the production substrate. The instrument may be subjected a substrate process and one or more parameters may be measured with the instrument during the process. The behavior of a production wafer in the substrate process may be characterized based on measurements of the parameters made with the one or more sensors.

    摘要翻译： 用于测量参数的仪器包括基板，由基板的表面承载并分布在多个基板表面上的单独测量不同位置处的参数的多个传感器，由基板表面承载的电子处理部件，跨越表面连接的电导体 传感器和电子处理部件，以及设置在传感器，电子处理部件和导体上的盖子。 盖和基底与由基板处理单元处理的生产基板具有相似的材料特性。 仪器具有与生产基底大致相同的厚度和/或平坦度。 仪器可以经受衬底工艺，并且可以在过程期间用仪器测量一个或多个参数。 可以基于用一个或多个传感器进行的参数的测量来表征生产晶片在衬底工艺中的行为。

    Temperature effects on overlay accuracy
    4.
    发明授权
    Temperature effects on overlay accuracy 有权
    温度对叠加精度的影响

    公开(公告)号：US07924408B2

    公开(公告)日：2011-04-12

    申请号：US11690813

    申请日：2007-03-24

    申请人： Tony DiBiase ,  Mei H. Sun ,  Mark Wiltse

    发明人： Tony DiBiase ,  Mei H. Sun ,  Mark Wiltse

    IPC分类号： G03B27/58 ,  G03B27/32

    CPC分类号： G03F7/70875 ,  G03F7/70633

    摘要： A method for reducing overlay error in a photolithographic process, by providing a substrate having a permanent layer with a first pattern disposed therein, coating the substrate with photoresist, exposing the photoresist to a second pattern, while measuring temperatures at a plurality of different first positions across the substrate, developing the second pattern in the photoresist, measuring overlay errors between the first and second patterns at a plurality of different second positions across the substrate, correlating the overlay errors with temperatures by position on the substrate, determining any relationship indicated between the correlated overlay errors and temperatures, and adjusting at least one temperature controlling aspect of the photolithographic process in response to any relationship determined.

    摘要翻译： 一种通过提供具有设置在其中的具有第一图案的永久层的基板的衬底，用光致抗蚀剂涂覆衬底，将光致抗蚀剂暴露于第二图案，同时测量多个不同的第一位置处的温度的方法，用于减小光刻工艺中的覆盖误差的方法 跨越衬底，在光致抗蚀剂中显影第二图案，测量穿过衬底的多个不同第二位置处的第一和第二图案之间的重叠误差，将重叠误差与衬底上的位置的温度相关联，确定在衬底上指示的任何关系 相关重叠误差和温度，以及响应于确定的任何关系调整光刻工艺的至少一个温度控制方面。

    Temperature effects on overlay accuracy
    5.
    发明申请
    Temperature effects on overlay accuracy 有权
    温度对叠加精度的影响

    公开(公告)号：US20080204678A1

    公开(公告)日：2008-08-28

    申请号：US11690813

    申请日：2007-03-24

    申请人： Tony DiBiase ,  Mei H. Sun ,  Mark Wiltse

    发明人： Tony DiBiase ,  Mei H. Sun ,  Mark Wiltse

    IPC分类号： G03B27/52 ,  G03F7/20

    CPC分类号： G03F7/70875 ,  G03F7/70633

    摘要： A method for reducing overlay error in a photolithographic process, by providing a substrate having a permanent layer with a first pattern disposed therein, coating the substrate with photoresist, exposing the photoresist to a second pattern, while measuring temperatures at a plurality of different first positions across the substrate, developing the second pattern in the photoresist, measuring overlay errors between the first and second patterns at a plurality of different second positions across the substrate, correlating the overlay errors with temperatures by position on the substrate, determining any relationship indicated between the correlated overlay errors and temperatures, and adjusting at least one temperature controlling aspect of the photolithographic process in response to any relationship determined.

    摘要翻译： 一种通过提供具有设置在其中的具有第一图案的永久层的基板的衬底，用光致抗蚀剂涂覆衬底，将光致抗蚀剂暴露于第二图案，同时测量多个不同的第一位置处的温度的方法，用于减小光刻工艺中的覆盖误差的方法 跨越衬底，在光致抗蚀剂中显影第二图案，测量穿过衬底的多个不同第二位置处的第一和第二图案之间的重叠误差，将重叠误差与衬底上的位置的温度相关联，确定在衬底上指示的任何关系 相关重叠误差和温度，以及响应于确定的任何关系调整光刻工艺的至少一个温度控制方面。

    Electrical adapter for a connector having a retention latch
    6.
    发明授权
    Electrical adapter for a connector having a retention latch 有权
    具有保持闩锁的连接器的电气适配器

    公开(公告)号：US07901250B2

    公开(公告)日：2011-03-08

    申请号：US12581437

    申请日：2009-10-19

    申请人： Bill Lam ,  Ian Lin ,  Mark Wiltse

    发明人： Bill Lam ,  Ian Lin ,  Mark Wiltse

    IPC分类号： H01R33/94

    CPC分类号： H01R13/6275 ,  H01R13/635 ,  H01R24/64 ,  H01R31/06

    摘要： An electrical adapter is provided for engaging a connector plug. The adapter comprises a male end, a female end, and a retention member. The male end is disposed at one end of the adapter for connecting the adapter to a female receptacle corresponding to the connector plug. The female end is disposed at another end of the adapter for engaging the connector plug. The female end comprises a top cap having a button disposed thereon. The retention member comprises a holder section, an energy storage section, and an energy release section. The holder section holds the connector plug. The energy storage section stores energy resulting from when the connector plug engages the retention member. When engaged by the button, the energy release section releases the energy stored in the energy storage section such that the connector plug automatically ejects from the adapter.

    摘要翻译： 提供用于接合连接器插头的电适配器。 适配器包括阳端，阴端和保持构件。 阳端设置在适配器的一端，用于将适配器连接到对应于连接器插头的阴插座。 母端设置在适配器的另一端以接合连接器插头。 阴端包括顶盖，其具有设置在其上的按钮。 保持构件包括保持器部分，能量存储部分和能量释放部分。 保持器部分保持连接器插头。 能量存储部分存储当连接器插头与保持构件接合时产生的能量。 当通过按钮接合时，能量释放部分释放存储在能量存储部分中的能量，使得连接器插头自动地从适配器弹出。

    ELECTRICAL ADAPTER FOR A CONNECTOR HAVING A RETENTION LATCH
    9.
    发明申请
    ELECTRICAL ADAPTER FOR A CONNECTOR HAVING A RETENTION LATCH 有权
    具有保持锁的连接器的电气适配器

    公开(公告)号：US20100112845A1

    公开(公告)日：2010-05-06

    申请号：US12581437

    申请日：2009-10-19

    申请人： Bill Lam ,  Ian Lin ,  Mark Wiltse

    发明人： Bill Lam ,  Ian Lin ,  Mark Wiltse

    IPC分类号： H01R13/629 ,  H01R25/00

    CPC分类号： H01R13/6275 ,  H01R13/635 ,  H01R24/64 ,  H01R31/06

    摘要： An electrical adapter is provided for engaging a connector plug. The adapter comprises a male end, a female end, and a retention member. The male end is disposed at one end of the adapter for connecting the adapter to a female receptacle corresponding to the connector plug. The female end is disposed at another end of the adapter for engaging the connector plug. The female end comprises a top cap having a button disposed thereon. The retention member comprises a holder section, an energy storage section, and an energy release section. The holder section holds the connector plug. The energy storage section stores energy resulting from when the connector plug engages the retention member. When engaged by the button, the energy release section releases the energy stored in the energy storage section such that the connector plug automatically ejects from the adapter.

    摘要翻译： 提供用于接合连接器插头的电适配器。 适配器包括阳端，阴端和保持构件。 阳端设置在适配器的一端，用于将适配器连接到对应于连接器插头的阴插座。 母端设置在适配器的另一端以接合连接器插头。 阴端包括顶盖，其具有设置在其上的按钮。 保持构件包括保持器部分，能量存储部分和能量释放部分。 保持器部分保持连接器插头。 能量存储部分存储当连接器插头与保持构件接合时产生的能量。 当通过按钮接合时，能量释放部分释放存储在能量存储部分中的能量，使得连接器插头自动地从适配器弹出。