公开(公告)号：US09221675B2

公开(公告)日：2015-12-29

申请号：US13561194

申请日：2012-07-30

申请人： Wei Hu ,  Gang Li ,  Jia-Xin Mei

发明人： Wei Hu ,  Gang Li ,  Jia-Xin Mei

IPC分类号： B81C1/00 ,  H04R31/00 ,  H04R19/00

CPC分类号： B81C1/00158 ,  B81C1/00246 ,  H04R19/005 ,  H04R31/00

摘要： A method for integrating an IC and a MEMS component includes the following steps: S1) providing a SOI base (20) having a first area (21) and a second area (22); S2) fabricating an IC on the first area through a standard semiconductor process, and simultaneously forming a metal conductive layer (26) and a medium insulation layer (25c) extending to the second area; S3) partly removing the medium insulation layer and then further partly removing the silicon component layer so as to form a backplate diagram; S4) depositing a sacrificial layer (32) above the SOI base; S5) forming a Poly Sil-xGex film (33) on the sacrificial layer; S6) forming a back cavity (34); and S7) eroding the sacrificial layer to form a chamber (36) in communication with the back cavity. Besides, a chip (10) fabricated by the above method is also disclosed.

摘要翻译： 一种用于集成IC和MEMS部件的方法包括以下步骤：S1）提供具有第一区域（21）和第二区域（22）的SOI基底（20）; S2）通过标准半导体工艺在第一区域上制造IC，同时形成延伸到第二区域的金属导电层（26）和介质绝缘层（25c）; S3）部分地去除介质绝缘层，然后进一步部分去除硅组分层以形成背板图; S4）在SOI基底上方沉积牺牲层（32）; S5）在牺牲层上形成Poly Sil-xGex膜（33）; S6）形成后腔（34）; 和S7）侵蚀牺牲层以形成与后腔连通的腔室（36）。 此外，还公开了通过上述方法制造的芯片（10）。

公开(公告)号：US20130202136A1

公开(公告)日：2013-08-08

申请号：US13561194

申请日：2012-07-30

申请人： Wei Hu ,  Gang Li ,  Jia-Xin Mei

发明人： Wei Hu ,  Gang Li ,  Jia-Xin Mei

IPC分类号： H04R1/00 ,  H01L21/02

CPC分类号： B81C1/00158 ,  B81C1/00246 ,  H04R19/005 ,  H04R31/00

摘要： A method for integrating an IC and a MEMS component includes the following steps: S1) providing a SOI base (20) having a first area (21) and a second area (22); S2) fabricating an IC on the first area through a standard semiconductor process, and simultaneously forming a metal conductive layer (26) and a medium insulation layer (25c) extending to the second area; S3) partly removing the medium insulation layer and then further partly removing the silicon component layer so as to form a backplate diagram; S4) depositing a sacrificial layer (32) above the SOI base; S5) forming a Poly Sil-xGex film (33) on the sacrificial layer; S6) forming a back cavity (34); and S7) eroding the sacrificial layer to form a chamber (36) in communication with the back cavity. Besides, a chip (10) fabricated by the above method is also disclosed.

摘要翻译： 一种用于集成IC和MEMS部件的方法包括以下步骤：S1）提供具有第一区域（21）和第二区域（22）的SOI基底（20）; S2）通过标准半导体工艺在第一区域上制造IC，同时形成延伸到第二区域的金属导电层（26）和介质绝缘层（25c）; S3）部分地去除介质绝缘层，然后进一步部分去除硅组分层以形成背板图; S4）在SOI基底上方沉积牺牲层（32）; S5）在牺牲层上形成Poly Sil-xGex膜（33）; S6）形成后腔（34）; 和S7）侵蚀牺牲层以形成与后腔连通的腔室（36）。 此外，还公开了通过上述方法制造的芯片（10）。

公开(公告)号：US20110007914A1

公开(公告)日：2011-01-13

申请号：US12571389

申请日：2009-09-30

申请人： Gang Li ,  Wei Hu ,  Jia Xin Mei

发明人： Gang Li ,  Wei Hu ,  Jia Xin Mei

IPC分类号： H04R1/00

CPC分类号： H04R1/04 ,  H04R1/06 ,  H04R19/02

摘要： An electrostatic loudspeaker includes a backplate having a metal film acting as one electrode of a capacitor and defining a number of sound apertures therein; a diaphragm insulatively spaced a distance from the backplate to form the capacitor; the diaphragm comprising a metal film acting as the other electrode of the capacitor; a back chamber having a substrate and an insulative spacer for joining edge portions of the diaphragm and the substrate; a driving circuit element for converting electrical signals from exterior input pads into driving signals to drive the diaphragm to vibrate and sound; the driving circuit element being mounted on an inner surface of the substrate and being accommodated in the back chamber; and a first, second and third connection paths for respectively electrically connecting the driving circuit element with the two electrodes of the capacitor, and the exterior input pads. An electrostatic loudspeaker with two backplates is also disclosed.

摘要翻译： 静电扬声器包括具有作为电容器的一个电极并在其中限定多个声孔的金属膜的背板; 隔膜与背板隔开间隔一定距离以形成电容器; 所述隔膜包括用作所述电容器的另一电极的金属膜; 具有基板的后室和用于连接隔膜和基板的边缘部分的绝缘间隔件; 驱动电路元件，用于将来自外部输入焊盘的电信号转换成驱动信号以驱动振膜振动和发出声音; 所述驱动电路元件安装在所述基板的内表面上并被容纳在所述后室中; 以及用于将驱动电路元件与电容器的两个电极和外部输入焊盘分别电连接的第一，第二和第三连接路径。 还公开了具有两个背板的静电扬声器。

公开(公告)号：US08103028B2

公开(公告)日：2012-01-24

申请号：US12571389

申请日：2009-09-30

申请人： Gang Li ,  Wei Hu ,  Jia Xin Mei

发明人： Gang Li ,  Wei Hu ,  Jia Xin Mei

IPC分类号： H04R1/02 ,  H04R25/00

CPC分类号： H04R1/04 ,  H04R1/06 ,  H04R19/02

摘要： An electrostatic loudspeaker includes a backplate having a metal film acting as one electrode of a capacitor and defining a number of sound apertures therein; a diaphragm insulatively spaced a distance from the backplate to form the capacitor; the diaphragm comprising a metal film acting as the other electrode of the capacitor; a back chamber having a substrate and an insulative spacer for joining edge portions of the diaphragm and the substrate; a driving circuit element for converting electrical signals from exterior input pads into driving signals to drive the diaphragm to vibrate and sound; the driving circuit element being mounted on an inner surface of the substrate and being accommodated in the back chamber; and a first, second and third connection paths for respectively electrically connecting the driving circuit element with the two electrodes of the capacitor, and the exterior input pads. An electrostatic loudspeaker with two backplates is also disclosed.

摘要翻译： 静电扬声器包括具有作为电容器的一个电极并在其中限定多个声孔的金属膜的背板; 隔膜与背板隔开间隔一定距离以形成电容器; 所述隔膜包括用作所述电容器的另一电极的金属膜; 具有基板的后室和用于连接隔膜和基板的边缘部分的绝缘间隔件; 驱动电路元件，用于将来自外部输入焊盘的电信号转换成驱动信号以驱动振膜振动和发出声音; 所述驱动电路元件安装在所述基板的内表面上并被容纳在所述后室中; 以及用于将驱动电路元件与电容器的两个电极和外部输入焊盘分别电连接的第一，第二和第三连接路径。 还公开了具有两个背板的静电扬声器。

公开(公告)号：US08482357B2

公开(公告)日：2013-07-09

申请号：US13310687

申请日：2011-12-02

申请人： Bin Xiao ,  Ping Lv ,  Wei Hu ,  Jia-Xin Mei ,  Gang Li

发明人： Bin Xiao ,  Ping Lv ,  Wei Hu ,  Jia-Xin Mei ,  Gang Li

IPC分类号： H03B5/18

CPC分类号： H03H9/2436 ,  H03H3/0072 ,  Y10T29/49016

摘要： A transverse acoustic wave resonator includes a base, a resonator component, a number of driving electrodes fixed to the base and a number of fixing portions connecting the base and the resonator component. The resonator component is suspended above a top surface of the base and is perpendicular to the base. The driving electrodes are coupling to side surfaces of the resonator component. The resonator component is formed in a shape of an essential regular polygon. The driving electrodes and the resonator component jointly form an electromechanical coupling system for converting capacitance into electrostatic force. Besides, a capacitive-type transverse extension acoustic wave silicon oscillator includes the transverse acoustic wave resonator and a method of fabricating the transverse acoustic wave resonator are also disclosed.

摘要翻译： 横波声谐振器包括基座，谐振器部件，固定到基座的多个驱动电极以及连接基座和谐振器部件的多个固定部分。 谐振器部件悬挂在基座的顶表面上方并且垂直于基座。 驱动电极耦合到谐振器部件的侧表面。 谐振器部件形成为基本正多边形的形状。 驱动电极和谐振器部件共同形成用于将电容转换成静电力的机电耦合系统。 此外，还公开了包括横向声波谐振器的电容式横向延伸声波硅振荡器和制造横向声波谐振器的方法。

公开(公告)号：US20130093527A1

公开(公告)日：2013-04-18

申请号：US13310687

申请日：2011-12-02

申请人： BIN XIAO ,  Ping Lv ,  Wei Hu ,  Jia-Xin Mei ,  Gang Li

发明人： BIN XIAO ,  Ping Lv ,  Wei Hu ,  Jia-Xin Mei ,  Gang Li

IPC分类号： H03B5/30 ,  H01P11/00 ,  H01P7/06

CPC分类号： H03H9/2436 ,  H03H3/0072 ,  Y10T29/49016

摘要： A transverse acoustic wave resonator includes a base, a resonator component, a number of driving electrodes fixed to the base and a number of fixing portions connecting the base and the resonator component. The resonator component is suspended above a top surface of the base and is perpendicular to the base. The driving electrodes are coupling to side surfaces of the resonator component. The resonator component is formed in a shape of an essential regular polygon. The driving electrodes and the resonator component jointly form an electromechanical coupling system for converting capacitance into electrostatic force. Besides, a capacitive-type transverse extension acoustic wave silicon oscillator includes the transverse acoustic wave resonator and a method of fabricating the transverse acoustic wave resonator are also disclosed.

摘要翻译： 横波声谐振器包括基座，谐振器部件，固定到基座的多个驱动电极以及连接基座和谐振器部件的多个固定部分。 谐振器部件悬挂在基座的顶表面上方并且垂直于基座。 驱动电极耦合到谐振器部件的侧表面。 谐振器部件形成为基本正多边形的形状。 驱动电极和谐振器部件共同形成用于将电容转换成静电力的机电耦合系统。 此外，还公开了包括横向声波谐振器的电容式横向延伸声波硅振荡器和制造横向声波谐振器的方法。

公开(公告)号：US08472647B2

公开(公告)日：2013-06-25

申请号：US12416186

申请日：2009-04-01

申请人： Jia-Xin Mei ,  Gang Li

发明人： Jia-Xin Mei ,  Gang Li

IPC分类号： H04R25/00 ,  H01L29/84

CPC分类号： H04R19/04 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： A surface mountable package includes a base and a cover with a cavity defined thereby, and an acoustic transducer unit received in the cavity. The cover includes a first metal ring to enclose the acoustic transducer unit. The base includes a second metal ring to press against the first metal ring in order to form a metal shielding area. First and second metal connecting paths are formed electrically connected to the metal shielding area and the acoustic transducer unit, respectively. Besides, two pairs of first and second surface mountable metal electrodes are electrically connected to the first and the second metal connecting paths, respectively. As a result, the package can be selectively double surface mountable to a user's circuit board via the metal electrodes of the base or the metal electrodes of the cover.

摘要翻译： 表面可安装的包装包括底座和由其限定的空腔的盖，以及容纳在空腔中的声学换能器单元。 盖包括用于封闭声换能器单元的第一金属环。 底座包括第二金属环，以压靠第一金属环以形成金属屏蔽区域。 第一和第二金属连接路径分别形成为电连接到金属屏蔽区域和声学换能器单元。 此外，两对第一和第二可表面安装的金属电极分别电连接到第一和第二金属连接路径。 结果，封装可以通过基座的金属电极或盖的金属电极选择性地双面表面安装到用户的电路板。

公开(公告)号：US08621941B2

公开(公告)日：2014-01-07

申请号：US12910797

申请日：2010-10-23

申请人： Jia-Xin Mei ,  Gang Li ,  Hong-Yuan Yang

发明人： Jia-Xin Mei ,  Gang Li ,  Hong-Yuan Yang

IPC分类号： G01L1/02 ,  G01L1/22 ,  G01L1/04

CPC分类号： G06F3/0414 ,  G06F3/0338 ,  G06F3/041 ,  H01L2224/48091 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

摘要： A feedback system for identifying an external force, includes an operation plate and a pressure-sensing unit. The pressure-sensing unit includes an elastic member supporting the operation plate and a pressure sensor inside the elastic member. The pressure sensor includes a pressure sensitive film. An inner side of the elastic member is filled with fluid material which acts on the pressure sensitive film. The operation plate is driven by the external force to be slant which extrudes the elastic member to deform so as to change fluid pressure of the fluid material limited in the elastic member, and such change of the fluid pressure can be sensed by the pressure sensitive film of the pressure sensor so as to identify the movement and the intensity of the external force.

摘要翻译： 用于识别外力的反馈系统包括操作板和压力感测单元。 压力感测单元包括支撑操作板的弹性构件和弹性构件内的压力传感器。 压力传感器包括压敏膜。 弹性构件的内侧填充作用在压敏膜上的流体材料。 操作板由外力驱动而倾斜，挤压弹性构件变形，以改变在弹性构件中限制的流体材料的流体压力，并且可以通过压敏膜感测到流体压力的这种变化 以识别外力的运动和强度。

公开(公告)号：US20090257614A1

公开(公告)日：2009-10-15

申请号：US12416186

申请日：2009-04-01

申请人： Jia-Xin Mei ,  Gang Li

发明人： Jia-Xin Mei ,  Gang Li

IPC分类号： H04R11/04

CPC分类号： H04R19/04 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： A surface mountable package includes a base and a cover with a cavity defined thereby, and an acoustic transducer unit received in the cavity. The cover includes a first metal ring to enclose the acoustic transducer unit. The base includes a second metal ring to press against the first metal ring in order to form a metal shielding area. First and second metal connecting paths are formed electrically connected to the metal shielding area and the acoustic transducer unit, respectively. Besides, two pairs of first and second surface mountable metal electrodes are electrically connected to the first and the second metal connecting paths, respectively. As a result, the package can be selectively double surface mountable to a user's circuit board via the metal electrodes of the base or the metal electrodes of the cover.

摘要翻译： 表面可安装的包装包括底座和由其限定的空腔的盖，以及容纳在空腔中的声学换能器单元。 盖包括用于封闭声换能器单元的第一金属环。 底座包括第二金属环，以压靠第一金属环以形成金属屏蔽区域。 第一和第二金属连接路径分别形成为电连接到金属屏蔽区域和声学换能器单元。 此外，两对第一和第二可表面安装的金属电极分别电连接到第一和第二金属连接路径。 结果，封装可以通过基座的金属电极或盖的金属电极选择性地双面表面安装到用户的电路板。

公开(公告)号：US20120042735A1

公开(公告)日：2012-02-23

申请号：US12910797

申请日：2010-10-23

申请人： Jia-Xin Mei ,  Gang Li ,  Hong-Yuan Yang

发明人： Jia-Xin Mei ,  Gang Li ,  Hong-Yuan Yang

IPC分类号： G01L1/04

CPC分类号： G06F3/0414 ,  G06F3/0338 ,  G06F3/041 ,  H01L2224/48091 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

摘要： A feedback system for identifying an external force, includes an operation plate and a pressure-sensing unit. The pressure-sensing unit includes an elastic member supporting the operation plate and a pressure sensor inside the elastic member. The pressure sensor includes a pressure sensitive film. An inner side of the elastic member is filled with fluid material which acts on the pressure sensitive film. The operation plate is driven by the external force to be slant which extrudes the elastic member to deform so as to change fluid pressure of the fluid material limited in the elastic member, and such change of the fluid pressure can be sensed by the pressure sensitive film of the pressure sensor so as to identify the movement and the intensity of the external force.

摘要翻译： 用于识别外力的反馈系统包括操作板和压力感测单元。 压力感测单元包括支撑操作板的弹性构件和弹性构件内的压力传感器。 压力传感器包括压敏膜。 弹性构件的内侧填充作用在压敏膜上的流体材料。 操作板被外力驱动以倾斜，挤压弹性构件变形，以便改变弹性构件限制的流体材料的流体压力，并且可以通过压敏膜感测到流体压力的这种变化 以识别外力的运动和强度。