摘要:
An AC stress test circuit for HCI degradation evaluation in semiconductor devices includes a ring oscillator circuit, first and second pads, and first and second isolating switches. The ring oscillator circuit has a plurality of stages connected in series to form a loop. Each of the stages comprises a first node and a second node. The first and second isolating switches respectively connect the first and second pads to the first and second nodes of a designated stage and both are switched-off during ring oscillator stressing of the designated stage. The present invention also provides a method of evaluating AC stress induced HCI degradation, and a test structure.
摘要:
An improved trashcan includes an outer can having an accommodating space with an upward opening. The top of the outer can is pivotally provided with a controllable upper cover having an opening. The opening is embedded with a stepping board. The bottom of the upper cover has at least one restoring mechanism with several elastic elements for driving the stepping board to move along the axial direction of the accommodating space reciprocally.
摘要:
A trash can with a deodorizing mechanism comprises a body having an opening formed at the top of the body, a lid pivotally coupled to the top of the body for performing an opening or closing movement, and a deodorizing mechanism installed on the body and including a bottle and a nozzle. The nozzle includes an actuating element propped by an elastic body to provide a restoring elasticity, such that if the lid is closed and covered onto the opening, the actuating element will be pressed by the lid to compress the elastic body, and the nozzle will suck a deodorant stored in the bottle and spray the deodorant towards the interior of the body. If the lid is closed and covered onto the opening, the elastic body will be compressed to slow down the closing movement of the lid.
摘要:
An improved structure of trashcan includes an outer can with a controllable upper cover. The upper cover has a connecting hole with a stepping part that moves downward in the outer can when being stepped. A base is at the bottom of the upper cover. First, second, third, and fourth tracks surround the stepping part at symmetrical positions of the base. Each track accommodates a restoring assembly that connects to the stepping part so that the stepping part can restore its original position after the stepping part moves to the bottom of the trashcan. The first track and the second track are stacked vertically. The third track and the fourth track are also stacked vertically. This configuration decreases the area occupied by the base. As a result, the stepping area of the stepping part is increased for the user's convenience to step on.
摘要:
A method for fabricating a test structure, in which, a heating plate is formed on the wafer for heating a structure to be tested positioned above or adjacent to the heating plate. The heating plate produces heat by electrically connecting to a current. Thus, the heat provided by the heating plate and the electric input/output into/from the structure to be tested are controlled separately and not influenced each other.
摘要:
A garbage can capable of compressing garbage volume consists of an outer cylinder and a top cylinder. A top cover has a top plate with a through hole. The circumference of the top plate extends downwards to form an inner wall and the outer circumference of the top plate extends downwards to form an outer wall such that a space between the outer and inner walls can be formed. The front and the back sides of the space form a front trough and a back trough respectively and a small sheaf is placed on the front and back sections of the left and right hand walls of the space with a pedal located below the upper cover. A reset component includes mainly a first elastic part and a second elastic part. The first elastic part is located inside the front trough of the top cover, and the two ends have been fixed on a wire pedal. The second elastic part is placed inside the back trough of the top cover, and the two ends are fixed respectively on pedal with the wire.
摘要:
A fixed reference capacitance (10) and a variable, pressure sensitive capacitance (12) are defined by a common conductive layer (14), and a common dielectric layer (16). A peripheral conductive layer 20 completes the reference capacitor and a central conductive layer (22) completes the variable capacitor. A peripheral supporting layer or structure (18) prevents the thickness or the dielectric constant of the dielectric layer peripheral portion but not the central portion from varying in response to pressure changes. In this manner, the reference and variable capacitors may be placed closely adjacent without pressure isolating the reference capacitor. An oscillator (30) provides an AC, such as square wave, driving signal to first and second temporary storage capacitors (52, 54). A bridge (70) of CMOS transistors selectively connects the first and second storage capacitors with the reference and variable capacitors. A gating control circuit (90) selectively gates the CMOS transistors of the bridge conductive and nonconductive such that during a positive square wave half cycle, the first storage capacitor is connected with the reference capacitor and the second storage capacitor is connected with the variable capacitor and during a negative half cycle the first storage capacitor is connected with the variable capacitor and the second storage capacitor is connected with the reference capacitor.
摘要:
An AC stress test circuit for HCI degradation evaluation in semiconductor devices includes a ring oscillator circuit, first and second pads, and first and second isolating switches. The ring oscillator circuit has a plurality of stages connected in series to form a loop. Each of the stages comprises a first node and a second node. The first and second isolating switches respectively connect the first and second pads to the first and second nodes of a designated stage and both are switched-off during ring oscillator stressing of the designated stage. The present invention also provides a method of evaluating AC stress induced HCI degradation, and a test structure.
摘要:
A structure for combining a vane frame and a vane of a hanging fan includes an elastic plate onto the vane frame, a pressing portion at a front end of the elastic plate, a latching portion at a rear end of the elastic plate, and three embedding blocks on the vane frame. One of the embedding blocks abuts the elastic plate. Slants are formed on both sides of the embedding block. A snap-in portion is formed at the bottom of the embedding block. Three embedding holes are formed at a front end of the vane, each having a connecting surface for connecting the vane with each embedding block. The pressing portion abuts the vane. The connecting surface and slant abut with each other. The front end of the embedding hole is snapped with the snap-in portion. The latching portion is pressed against a rear end of the embedding hole.
摘要:
A wafer level test structure in which, a heating plate is formed on the wafer for heating a structure to be tested positioned above or adjacent to the heating plate. The heating plate produces heat by electrically connecting to a current. Thus, the heat provided by the heating plate and the electric input/output into/from the structure to be tested are controlled separately and not influenced each other.