摘要:
An apparatus for preparing an ultra-thin specimen with a polishing wheel is developed. The apparatus includes a base, a holding unit mounted on the base and having a movable part for supporting the specimen, and an adjusting assembly attached to the base for adjusting an orientation of the specimen relative to a top surface of the polishing wheel by providing a fine movement during polishing. The movable part of the holding unit is advantageously moved away from the adjusting assembly to enlarge the latitudinal cross-section of the apparatus so as to increase the precision of the orientation.
摘要:
An automated optical inspection system for the runout tolerance of circular saw blades comprises a rotating device, a first and a second optical inspection module, and a computing device. The rotating device is used to rotate a circular saw blade. The circular saw blade includes multiple teeth, and each tooth has a side and a back. The first/second optical inspection module is used to capture a side/back image of the tooth. The computing device activates the rotating device to rotate the circular saw blade, and activates the first and the second optical inspection module to capture the side image and the back image of each tooth upon rotation of the circular saw blade. The computing device performs a radial-position-calculating procedure according to the side images, to obtain an amount of radial runout, and performs an axial-position-calculating procedure according to the back images, to obtain an amount of axial runout.
摘要:
A method of preparing a test sample for electron microscopy analysis is disclosed. First, a chip segment is attached to a holder of a sample polisher, and a first polishing end of the chip segment is polished by using the sample polisher to generate a first polished cross section. Thereafter, the chip segment is detached from the holder. Further, a carrier segment is attached to the first cross section of the chip segment and the conjoined carrier segment and the chip segment are attached to a pad segment so as to form a stacked structure. Finally, the stacked structure is attached to the holder, and a second polishing end of the chip segment is polished to generate a second polished cross section.
摘要:
A shoe rack includes a frame, at least one board, two rear connectors and two front connectors. The frame includes two lateral subframes each of which comprises at least one tilted beam. Each of the rear connectors includes a shaft rotatably connected to the board and a clip engaged with the tilted beam of one of the lateral subframes. Each of the front connectors includes a shaft rotatably connected to the board, a first clip, and a second clip located closer to the shaft than the first clip. The board extends horizontally when the first clip is engaged with the tilted beam of one of the lateral subframes. The board is tilted when the second clip is engaged with the tilted beam of one of the lateral subframes.
摘要:
A semiconductor wafer includes a plurality of active circuit die areas, each of which being bordered by a dicing line region through which the plurality of active circuit die areas are separated from each other by mechanical wafer dicing. Each of the plurality of active circuit die areas has four sides. An overcoat covers both the active circuit die areas and the dicing line region. An inter-layer dielectric layer is disposed underneath the overcoat. A reinforcement structure includes a plurality of holes formed within the dicing line region. The plurality of holes are formed by etching through the overcoat into the inter-layer dielectric layer and are disposed along the four sides of each active circuit die area. A die seal ring is disposed in between the active circuit chip area and the reinforcement structure.
摘要:
A fabrication method for a transmission electron microscope (TEM) slide is described. A die having device structures formed thereon is provided. A thermal adhesive fills the surface of device structures formed on the die. The thermal adhesive is covered by a glass piece. A polishing step is performed to a non-device side of the die to form a thin sheet from the die. The glass piece is removed to expose the thermal adhesive. A sacrificial layer is then formed above the exposed thermal adhesive on the thin sheet. A slicing step is performed to form a TEM slide from the thin sheet.
摘要:
A method for distinguishing a specific region in a sample to be observed by a microscope is disclosed. The method includes the steps of (a) forming a first concavity on a first side of the specific region by a focus ion beam (FIB) technique, (b) forming a second concavity on a second side of the specific region opposite to the first side by the focus ion beam technique, and (c) filling the first concavity and the second concavity with a first metallic packing and a second metallic packing respectively for defining the specific region to be observed.
摘要:
A disposable liquid-binding floor mat includes a water penetration layer, a water absorption layer, a water-proof layer and a self-adhesive layer. The water penetration layer is a thin piece of non-woven fabric and is superimposed on the water absorption layer. The water absorption layer is made of a hydrophilic thin plate and is superimposed between the water penetration layer and the water-proof layer. The water-proof layer is made of a water-proof film material and is superimposed between the water absorption layer and the self-adhesive layer. The self-adhesive layer is made of a self-adhesive material and is superimposed below the water-proof layer. The water penetration layer, the water absorption layer, the water-proof layer and the self-adhesive layer are bonded as an integrated non-sealed edge structure, and a deodorant is added into the water absorption layer.
摘要:
A semiconductor wafer includes a plurality of active circuit die areas, each of which being bordered by a dicing line region through which the plurality of active circuit die areas are separated from each other by mechanical wafer dicing. Each of the plurality of active circuit die areas has four sides. An overcoat covers both the active circuit die areas and the dicing line region. An inter-layer dielectric layer is disposed underneath the overcoat. A reinforcement structure includes a plurality of holes formed within the dicing line region. The plurality of holes are formed by etching through the overcoat into the inter-layer dielectric layer and are disposed along the four sides of each active circuit die area. A die seal ring is disposed in between the active circuit chip area and the reinforcement structure.
摘要:
A hand cart has a frame having a left vertical member and right vertical member, each vertical member having a top end that is coupled to a handle bar, and a bottom end that has a pin extending therefrom. The hand cart also includes a left wheel assembly and a right wheel assembly, each wheel assembly having a tubular housing that receives a portion of a vertical member, and a wheel secured to the tubular housing, with each tubular housing having a spiral slot that receives the pin of the corresponding bottom end for movement within the slot. A carrier plate has a left seat and a right seat, each seat pivotably connected to a corresponding bottom end of a vertical member.